data sheet cabga/ctbga/CVBGA features: thermal resistance: reliability: cutting edge technology and expanding package offerings provide a platform from prototype-to-production. ? full, in-house design ? square or rectangle packages available ? 4 mm to 21 mm body size available ? 8 to 449 ball counts ? 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available ? jedec mo-216 compliant for 0.8 mm and 1.0 mm ball pitch ? jedec mo-195 compliant for 0.5 mm & 0.65 mm ball pitch ? pb free and green package available ? daisy chain packages available ? short traces for excellent electrical inductance ? low inductance (modeled data) 1.4nh (1.0 mm trace length) 4.1nh (5.0 mm trace length) theta ja at 1.0 watt and 0 airflow (c/watt) cabga ctbga CVBGA 8 x 8 37.28 36.45 37.52 10 x 10 19.86 29.04 26.7 11 x 11 29 n/a n/a 15 x 15 20.1 n/a n/a 19 x 19 17.04 n/a n/a amkor assures reliable performance by continuously monitoring key indices: ? moisture sensitivity jedec level 2 @ 240 c characterization jedec level 3 @ 260 c 85 c/85% rh, 168 hours ? temp/humidity 85 c/85%, 1000 hours ? high temp storage 150 c, 1000 hours ? hast 130 c/85% rh, 96 hours ? temp cycle -55/+125 c, 1000 cycles chiparray ? packages: amkor?s chiparray ? packages are laminate- based ball grid array (bga) packages that are compatible with established smt mounting processes. the near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes. (see table on back.) in addition to the standard core chiparray package (cabga), amkor offers thin core ball grid array packages (ctbga and CVBGA) which, coupled with a thin mold cap, achieve package thicknesses down to 1.0 mm max. by utilizing a thin core laminate, much denser routing can be achieved, thereby enabling more i/os in a given footprint. amkor chiparray packages, regardless of body size and thickness, utilize the same, flexible capacity which assures economical packaging solutions. further, high volume processes and innovative design assure high quality and cutting edge technology. due to their small size and i/o density, amkor?s chiparray product family is an excellent choice for new devices requiring a small footprint size and low mounted height. applications: the chiparray package family is applicable for semiconductors such as memory, analog, asics, rf devices and simple plds requiring a smaller package size than conventional pbgas. chiparray packages fill the need for low cost, minimum space and high speed requirements of mobile phones and pagers, notebook and subnotebook personal computers, pdas and other wireless systems. laminate www.amkor.com visit amkor technology online for locations and to view the most current product information . ds550n rev date: 01?07
laminate process highlights die thickness (max) 0.27 mm (10.5 mils) bond pad pitch (min) 50 m (2 mils) marking laser ball inspection optical pack options dry pack wafer backgrinding available standard materials package substrate - conductor copper - dielectric epoxy polyimide blend die attach adhesive low stress elastomer encapsulant epoxy mold compound solder ball eutectic snpb/pbfree test services program generation/conversion product engineering wafer sort 256 pin x 20 mhz test system available -55 c to +165 c test available burn-in shipping jedec trays tape and reel services data sheet bottom view side view top view with respect to the information in this document, amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. this document does not in any way extend or modify amkor?s warranty on any product beyond that set forth in its standard terms and conditions of sale. amkor reserves the right to make changes in its product and specifications at any time and withou t notice. www.amkor.com cabga/ctbga/CVBGA standard package offering cabga/ctbga/CVBGA ball pitch 1.0 0.80 0.75 0.65 0.50 ball pitch 1.0 0.80 0.65 0.50 ball pitch 1.0 0.80 0.65 0.50 body ball ball ball ball ball body ball ball ball ball body ball ball ball ball size count count count count count size count count count count size count count count count 4 16 49 10 81 100 192 15 160 208 256 4 40 10 96 241 15 176 273 5 25 40 10 120 181 15 196 324 5 57 10 121 277 15 144 6 36 48 10 144 16 280 324 6 49 56 10 97 16 285 6 64 11 100 109 200 223 17 176 256 6 84 11 97 128 17 208 272 7 48 44 81 104 11 169 17 224 280 7 49 46 108 12 112 144 208 228 17 228 292 7 64 48 64 12 121 160 288 17 252 316 7 64 84 12 196 17 256 7 96 13 108 200 277 289 19 280 288 8 42 64 48 105 108 13 144 224 320 19 289 8 72 111 132 13 225 417 19 324 8 81 113 144 14 192 300 287 21 256 449 8 94 96 14 220 21 272 9 64 100 48 124 21 316 9 72 64 21 336 9 80 21 400 9 81 180 180
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