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preliminary product information 1 2004-05-13 xpak 850 nm module 10 gigabit pluggable transceiver compatible with xpak msa rev. 2.3 v23833-g2005-a101 V23833-G6005-A101 v23833-g6005-a111 preliminary data sheet fiber optics part number standard de-latch mechanism connector laser class v23833-g2005-a101 fibre channel bail lc 1m V23833-G6005-A101 ethernet bail lc 1m v23833-g6005-a111 ethernet none lc 1m file: 2101 file: 2117 features standards ? compatible with ieee std 802.3ae?-2002 compatible with fibre channel 10gfc draft 3.5 compatible with xpak msa rev. 2.3 optical ieee ethernet: serial 850 nm 10gbase-sr t11 fibre channel: serial 850 nm 1200-m5-sn-i; 1200-m5e-sn-i; 1200-m6-sn-i 10 gigabit fibre channel: 10.51875 gbit/s (v23833-g2005-a101) 10 gigabit ethernet: 10.3125 gbit/s (v23833-g6005-a1x1) transmission distance ? up to 82 m 1) (50 m mmf) ? up to 300 m 1) (on special mmf) vertical cavity surface emitting laser at 850 nm (vcsel) lc connector, multimode fiber full duplex transmission mode eye safety class 1m (iec 60825-1:a2) 1) maximum reach as defined by ieee. longer reach possible depending upon link implementation.
v23833-gx005-a1x1 applications preliminary product information 2 2004-05-13 dom ? loss of signal from receiver ? supply voltage monitor (+3.3 v, adaptable power supply) ?transmit power ? module temperature ? received power ? transmit bias current monitor mechanical mezzanine profile: 2.68" l x 1.42" w x 0.38" h (68.07 mm x 35.99 mm x 9.8 mm) mezzanine module height for pci card applications mid-board mounting separated signal/chassis ground (a common signal/chassis ground module version is available upon request) belly-to-belly applications de-latch mechanism with low extraction force (v23833-gxxxx-ax0x only) built-in heat sink electrical hot pluggable power supply: +5.0 v, +3.3 v, adaptable power supply (aps: +1.8 v) total power consumption: 3.4 w typical xaui electrical interface ? 3.125 gbit/s ethernet (v23833-g60xx-xxxx) ? 3.1875 gbit/s fibre channel (v23833-g20xx-xxxx) management and control via mdio 2-wire bus 70-pin connector applications 10 gbit/s ethernet and fibre channel transmission systems for short range (sr) integration on pci card mid-board mounting belly-to-belly for high density applications enterprise and campus network applications storage applications backplane and switch applications core and edge routers aggregation point for lower date rate xpak evaluation kit v23833-g9909-z001 available upon request
v23833-gx005-a1x1 pin configuration preliminary product information 3 2004-05-13 pin configuration figure 1 xpak transceiver electrical pad layout 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 prtad2 prtad1 prtad0 vend specific aps set reserved aps sense aps aps 3.3 v 3.3 v 5.0 v gnd gnd gnd gnd 5.0 v 3.3 v 3.3 v aps aps lasi reset vend specific tx on/off reserved mod detect vend specific vend specific mdio mdc prtad4 prtad3 gnd gnd gnd gnd gnd 70 69 53 52 51 49 48 47 46 45 44 43 42 40 39 38 37 36 50 41 reserved reserved gnd tx lane3? tx lane3+ gnd tx lane2? tx lane2+ gnd tx lane1? tx lane1+ gnd tx lane0? tx lane0+ 68 67 66 65 64 63 62 61 59 58 57 56 55 60 gnd 54 gnd rx lane2? rx lane2+ gnd rx lane1? rx lane1+ gnd rx lane0? rx lane0+ gnd reserved reserved rx lane3? rx lane3+ gnd 1 2 3 4 5 6 7 8 9 gnd gnd toward bezel top of transceiver pcb bottom of transceiver pcb (as viewed through top) file: 2301
v23833-gx005-a1x1 pin configuration preliminary product information 4 2004-05-13 connector pin assignments pin no. signal name pin no. signal name 1gnd 70gnd 2gnd 69gnd 3 gnd 68 reserved 4 +5.0 v dc power 67 reserved 5 +3.3 v dc power 66 gnd 6 +3.3 v dc power 65 tx lane3? 7 aps 64 tx lane3+ 8 aps 63 gnd 9 lasi 62 tx lane2? 10 reset 61 tx lane2+ 11 vendor specific 60 gnd 12 tx on/off 59 tx lane1? 13 reserved 58 tx lane1+ 14 mod detect 57 gnd 15 vendor specific 56 tx lane0? 16 vendor specific 55 tx lane0+ 17 mdio 54 gnd 18 mdc 53 gnd 19 prtad4 52 gnd 20 prtad3 51 rx lane3? 21 prtad2 50 rx lane3+ 22 prtad1 49 gnd 23 prtad0 48 rx lane2? 24 vendor specific 47 rx lane2+ 25 aps set 46 gnd 26 reserved 45 rx lane1? 27 aps sense 44 rx lane1+ 28 aps 43 gnd 29 aps 42 rx lane0? 30 +3.3 v dc power 41 rx lane0+ 31 +3.3 v dc power 40 gnd 32 +5.0 v dc power 39 reserved 33 gnd 38 reserved 34 gnd 37 gnd 35 gnd 36 gnd
v23833-gx005-a1x1 pin configuration preliminary product information 5 2004-05-13 pin description signal name level i/o pin no. description management and monitoring ports mdio open drain i/o 17 management data i/o. requires external 10 - 22 k ? pull-up to 1.8 v on host. mdc 1.2 v cmos i 18 management data clock input prtad4 1.2 v cmos i 19 port address input bit 4 prtad3 1.2 v cmos i 20 port address input bit 3 prtad2 1.2 v cmos i 21 port address input bit 2 prtad1 1.2 v cmos i 22 port address input bit 1 prtad0 1.2 v cmos i 23 port address input bit 0 lasi open drain o 9 link alarm status interrupt output. open drain compatible output with 10 - 20 k ? pull-up on host. logic high = normal operation logic low = status flag triggered reset open drain i 10 reset input. open drain compatible input with 10 k ? pull-up to aps internal to transceiver. logic high = normal operation logic low = reset note: 1.8 v is aps vendor specific 11,15,16,24 vendor specific pins. leave unconnected when not used. tx on/off open drain i 12 tx on/off input. open drain compatible input with 10 k ? pull-up to aps internal to transceiver. logic high = transmitter on logic low = transmitter off note: 1.8 v is aps mod detect o 14 pulled low inside transceiver through a 1 k ? resistor to ground
v23833-gx005-a1x1 pin configuration preliminary product information 6 2004-05-13 transmit functions reserved reserved i i 68 67 reserved for future use reserved for future use tx lane 3? tx lane 3+ ac-coupled, internally biased differential xaui i i 65 64 module xaui input lane 3? module xaui input lane 3+ tx lane 2? tx lane 2+ i i 62 61 module xaui input lane 2? module xaui input lane 2+ tx lane 1? tx lane 1+ i i 59 58 module xaui input lane 1? module xaui input lane 1+ tx lane 0? tx lane 0+ i i 56 55 module xaui input lane 0? module xaui input lane 0+ receive functions reserved reserved o o 38 39 reserved for future use reserved for future use rx lane 0+ rx lane 0? ac-coupled, internally biased differential xaui o o 41 42 module xaui output lane 0+ module xaui output lane 0? rx lane 1+ rx lane 1? o o 44 45 module xaui output lane 1+ module xaui output lane 1? rx lane 2+ rx lane 2? o o 47 48 module xaui output lane 2+ module xaui output lane 2? rx lane 3+ rx lane 3? o o 50 51 module xaui output lane 3+ module xaui output lane 3? pin description (cont?d) signal name level i/o pin no. description
v23833-gx005-a1x1 pin configuration preliminary product information 7 2004-05-13 dc power gnd 0 v dc i 1,2,3,33,34, 35,36,37,40, 43,46,49,52, 53,54,57,60, 63,66,69,70 ground connection for signal ground on the module aps +1.8 v i 7,8,28,29 input from adaptive power supply aps sense +1.8 v o 27 aps sense output. connected to the aps input inside transceiver. aps set gnd i 25 feedback input from aps. connected to gnd through a zero ? resistor inside the transceiver. 3.3 v +3.3 v dc i 5,6,30,31 dc power input, +3.3 v dc, nominal 5.0 v +5.0 v dc i 4,32 dc power input, +5.0 v dc, nominal reserved 26 reserved for apd. do not connect. reserved 13 reserved. do not connect. pin description (cont?d) signal name level i/o pin no. description
v23833-gx005-a1x1 description preliminary product information 8 2004-05-13 description system block diagram (10 gbit/s ethernet) figure 2 optical interface standard specifications ieee std 802.3ae?-2002 clause 52, 10gbase-sr fibre channel 10gfc draft 3.5, 1200-m5-sn-i fibre channel 10gfc draft 3.5, 1200-m5e-sn-i fibre channel 10gfc draft 3.5, 1200-m6-sn-i xpak msa 2.3 standard fiber type minimum modal bandwidth at 850 nm (mhz*km) operating range 1) (meters) 1) longer reaches possible depending upon link implementation. ieee 62.5 m mmf 160 2 to 26 50 m mmf 400 2 to 66 fibre channel 62.5 m mmf 200 0.5 to 33 50 m mmf 500 0.5 to 82 50 m mmf 2000 0.5 to 300 hot swap control 10 gbit/s optical (multimode fiber) 10gbe mac + rs laser 64b/66b encoder/ decoder 8b/10b xgxs 4x 3.125 gbit/s serdes data management v cc 8b/10b xgxs 4x 3.125 gbit/s serdes xaui 4x 3.125 gbit/s 10 gbit/s serdes & cdr +cmu 70-pin edge connector bist mdio mdc management data interface vcsel laser pin tia laser driver la file: 2303
v23833-gx005-a1x1 description preliminary product information 9 2004-05-13 electrical interface standard specifications ieee std 802.3ae?-2002 clause 45 & 47 xpak msa 2.3 environment: thermal management recommendations module can withstand and operate with case temperature of 75c for up to 96 hrs/yr. transceiver requires airflow across cooling fins. maximum airflow required per xpak msa is 3 m/s. actual airflow required to provide adequate cooling for module is 1 m/s with a maximum air inlet temperature of 50c. a maximum case temperature of 70c must be observed. fibers and connectors the transceiver has lc receptacles for both tx and rx. the transceiver is designed for multimode lc cables, 0 polished endface (pc). 70-pin connector the module interface connector is a 70-pin, printed circuit board edge connection with a 0.5 mm pitch. the appropriate mating connector for the customer pcb is a 70-pin smt, dual row, right angled, edge connector, 0.5 mm pitch (tycoamp part number 1367337-1, molex part number 74441-0003 or equivalent). cage requirement the cage assembly required to mount the xpak module is defined by the msa. there are two cage designs for the module, tall and mezzanine profile. for correct operation and emi design the correct cage size must be selected for the appropriate module. alternatively a flangeless cage design is specified where there is limited size. a sufficient emi gasket that connects from the cage to the face plate must be fitted. the mechanical design must ensure that no air gaps exist between the cage and the face plate while the module is plugged in. recommended xpak rail assembly, molex part number 74732-0200. operating air inlet temperature: 0c - 50c operating airflow: 3 m/s maximum defined per xpak msa operating humidity: 0% - 95% rh non-condensing
v23833-gx005-a1x1 description preliminary product information 10 2004-05-13 dom parameters parameter values unit min. typ. max. transceiver temperature monitor accuracy 1) 5c transmit bias current monitor accuracy 2) 10 % transmit power monitor accuracy 3) 3db receive power monitor accuracy 3) 3db 1) 0 to 70c case temperature. 2) 0 to 12.5 ma. 3) 0 to 6.5 mw. regulatory compliance feature standard comments esd: electrostatic discharge to the electrical pins (hbm) eia/jesd22-a114-b (mil-std 883d method 3015.7) class 1a (> 500 v) immunity: against electrostatic discharge (esd) to the module receptacle en 61000-4-2 iec 61000-4-2 discharges ranging from 2kv to 15 kv to the front end / faceplate / receptacle cause no damage to module (under recommended conditions). immunity: against radio frequency electromagnetic field en 61000-4-3 iec 61000-4-3 with a field strength of 10 v/m, noise frequency ranges from 10 mhz to 2 ghz. no effect on module performance between the specification limits. emission: electromagnetic interference (emi) fcc 47 cfr part 15, class b en 55022 class b cispr 22 noise frequency range: 30 mhz to 40 ghz radiated emission does not exceed specified limits when measured inside a shielding enclosure with msa conform cutout.
v23833-gx005-a1x1 technical data preliminary product information 11 2004-05-13 technical data exceeding any one of these values may permanently destroy the device. absolute maximum ratings parameter symbol limit values unit min. max. storage ambient temperature 1) 1) non condensing. t as ?20 85 c operating ambient temperature 1) t ao 065c operating case temperature 1) t co 080c supply voltage +5.0 v v 5 06v supply voltage +3.3 v v 3 04v supply voltage aps v aps 02v static discharge voltage, all pins st d 500 v average receive optical power rx p max 0dbm recommended operating conditions parameter symbol values unit min. typ. max. operating case temperature 1) 1) worst case thermal location, see figure 12 . see also environment: thermal management recommendations . t c 070c transceiver total power consumption p 3.4 3.8 w supply voltage +5.0 v v cc5 4.75 5.0 5.25 v supply current +5.0 v i cc5 50 ma supply voltage +3.3 v v cc3 3.14 3.3 3.47 v supply current +3.3 v i cc3 550 ma supply voltage aps v cc aps 1.746 1.8 1.854 v supply current aps i cc aps 700 ma
v23833-gx005-a1x1 technical data preliminary product information 12 2004-05-13 optical characteristics ( v cc5 = 4.75 v to 5.25 v, v cc3 = 3.14 v to 3.47 v, v cc aps = 1.746 v to 1.854 v, t c = 0c to 70c) parameter symbol values unit min. typ. max. transmitter launch power in oma 1) p o-oma ?2.8 dbm average launch power p o-avg ?3 ?2 ?1 dbm center wavelength range 1) c-tx 840 850 860 nm rms spectral width 1) i 0.4 0.45 nm extinction ratio er 3 5.5 db relative intensity noise 12 oma rin ?128 db/hz eye mask definition according to ieee and fibre channel transmitter and dispersion penalty tdp 3.9 db encircled flux ef at 19 m 86%, at 4.5 m 30% optical return loss tolerance orl t 12 db average launch power of off transmitter p o-off ?30 dbm receiver stressed receiver sensitivity in oma p in-s ?7.5 dbm sensitivity in oma 2) p in ?11.1 dbm average receive power p in-max ?1 dbm signal detect deassert level p sdl ?30 dbm signal detect assert level p sd ?20 ?13 dbm signal detect hysteresis p sd 124db receiver reflectance ref rx ?12 db center wavelength range c-rx 840 860 nm electrical 3 db upper cut-off frequency 3db co 12.3 ghz 1) conforms to ieee triple trade off between center wavelength, rms spectral width and minimum oma. 2) receiver sensitivity, which is defined for an ideal input signal is informative only.
v23833-gx005-a1x1 technical data preliminary product information 13 2004-05-13 electrical dc characteristics ( v cc5 = 4.75 v to 5.25 v, v cc3 = 3.14 v to 3.47 v, v cc aps = 1.746 v to 1.854 v, t c = 0c to 70c) parameter symbol values unit min. typ. max. 1.2 v cmos (1.8 v cmos compatible 1) ) i/o dc characteristics (prtad; lasi; reset; tx_onoff) 1) for 1.8 v cmos v oh = 1.65 v min., v ol = 0.15 v max., v ih = 1.17 v min., v il = 0.63 v max. external pull-up resistor for open drain r pullup 10 22 k ? output high voltage 2) 2) r pull-up = 10 k ? to 1.8 v. v oh 1v output low voltage 2) v ol 0.15 v input high voltage v ih 0.84 1.854 v input low voltage v il 0.36 v input pull-down current 3) 3) v in = 1.8 v. i pd 20 120 a xaui i/o dc characteristics (txlane[0..3]; rxlane[0..3]) differential input amplitude (pk-pk) 4) 4) ac coupled. v in_xaui 200 2500 mv differential output amplitude (pk-pk) 4) v out_xaui 800 1600 mv mdio i/o dc characteristics (mdio; mdc) output low voltage 5) 5) i ol = 100 a. v ol ?0.3 0.2 v output low current i ol 4ma input high voltage v ih 0.84 1.854 v input low voltage v il ?0.3 0.36 v pull-up supply voltage v pu 1.746 1.8 1.854 v input capacitance c in 10 pf load capacitance c load 470 pf external pull-up resistance r load 200 ?
v23833-gx005-a1x1 technical data preliminary product information 14 2004-05-13 electrical ac characteristics ( v cc5 = 4.75 v to 5.25 v, v cc3 = 3.14 v to 3.47 v, v cc aps = 1.746 v to 1.854 v, t c = 0c to 70c) parameter symbol values unit min. typ. max. xaui input ac characteristics (txlane[0..3]) baud rate fibre channel ethernet r xauiin 3.1875 3.125 gbit/s baud rate tolerance r tolxaui ?100 100 ppm differential input impedance z inxaui 80 100 120 ? differential return loss 1) | s 11 | 10 db input differential skew 2) t skewin 75 ps jitter amplitude tolerance 3) j xauitol xaui output ac characteristics (rxlane[0..3]) baud rate fibre channel ethernet r xauiout 3.1875 3.125 gbit/s baud rate variation r xauivar ?100 100 ppm rise and fall times 20% - 80% t r, t f 40 100 ps output differential skew t skewout 15 ps output differential impedance z outxaui 80 100 120 ? differential output return loss 1) | s 22 | 10 db total jitter 4) tj xaui 0.35 ui deterministic jitter 4) dj xaui 0.17 ui power-on reset ac characteristics power-on reset and tx_onoff characteristics according to xenpak msa issue 3.0 draft 4.0, 2002-9-9
v23833-gx005-a1x1 technical data preliminary product information 15 2004-05-13 mdio i/o ac characteristics (mdio; mdc) mdio data hold time t hold 10 ns mdio data setup time t su 10 ns delay from mdc rising edge to mdio data change t delay 300 ns mdc clock rate f max 2.5 mhz 1) 100 mhz to 2.5 ghz. 2) at crossing point. 3) per ieee std 802.3ea. 4) at near-end. no pre-equalization. 1 ui = 320 ps. mechanical characteristics parameter symbol values unit min. typ. max. module retention force (latch strength) f ret 200 n module insertion force f in 40 n module extraction force (with kick-out) f ext-k 16 n module extraction force (without kick-out) f ext 25 n 0-80 unf screw torque 1) 1) two 0-80 unf screws are used to secure the xpak module (no bail de-latch version v23833-gxxxx-ax1x) in the cage. the xpak module is supplied with the screws assembled, and removal is required prior to insertion into the cage. 0-80 unf 10 cnm electrical ac characteristics (cont?d) ( v cc5 = 4.75 v to 5.25 v, v cc3 = 3.14 v to 3.47 v, v cc aps = 1.746 v to 1.854 v, t c = 0c to 70c) parameter symbol values unit min. typ. max.
v23833-gx005-a1x1 eye safety preliminary product information 16 2004-05-13 eye safety this laser based multimode transceiver is a class 1m product. it complies with iec 60825-1 and fda 21 cfr 1040.10 and 1040.11 except for deviations pursuant to laser notice 50, dated july 26, 2001. invisible laser radiation do not view directly with optical instruments class 1m laser product to meet laser safety requirements the transceiver shall be operated within the absolute maximum ratings. attention: all adjustments have been made at the factory prior to shipment of the devices. no maintenance or alteration to the device is required. tampering with or modifying the performance of the device will result in voided product warranty. note: failure to adhere to the above restrictions could result in a modification that is considered an act of ?manufacturing?, and will require, under law, recertification of the modified product with the u.s. food and drug administration (ref. 21 cfr 1040.10 (i)). figure 3 required labels figure 4 laser emission laser data wavelength 850 nm accessible emission limit (as defined by iec: 7 mm aperture at 100 mm distance) 749 w beam divergence (full angle) 22 class 1m laser product iec complies with 21 cfr 1040.10 and 1040.11 fda file: 2412 tx rx laser emission file: 2308 top view
v23833-gx005-a1x1 application notes preliminary product information 17 2004-05-13 application notes nvram register contents address group xenpak msa 3.0 value comment dec hex definition dec hex 32775 8007 header xenpak msa version supported 30 1e rev. 3.0 32776 8008 nvr size in bytes 1 1 256 32777 8009 00 32778 800a number of bytes used 0 0 181 32779 800b 181 b5 32780 800c basic field address 11 b b 32781 800d customer field address 119 77 77 32782 800e vendor field address 167 a7 a7 32783 800f extended vendor field address 0 0 0 32784 8010 000 32785 8011 reserved 0 0 0 32786 8012 basic transceived type 4 4 xpak 32787 8013 connector 2 2 lc 32788 8014 encoding 1 1 nrz 32789 8015 bit rate 40 28 10313 32790 8016 73 49 32791 8017 protocol 1 1 10gbe 32792 8018 standards compliance codes 1 1 sr 32793 8019 0 0 not used 32794 801a 0 0 not used 32795 801b 0 0 not used 32796 801c 0 0 not used 32797 801d 0 0 not used 32798 801e 0 0 not used 32799 801f 0 0 not used 32800 8020 0 0 not used 32801 8021 0 0 not used 32802 8022 range 0 0 0.3 km 32803 8023 30 1e
v23833-gx005-a1x1 application notes preliminary product information 18 2004-05-13 32804 8024 basic fiber type 1 1 mm 32805 8025 00 32806 8026 wavelength channel 0 1 1 850 nm 32807 8027 76 4c 32808 8028 88 32809 8029 wavelength channel 1 0 0 not used 32810 802a 0 0 not used 32811 802b 0 0 not used 32812 802c wavelength channel 2 0 0 not used 32813 802d 0 0 not used 32814 802e 0 0 not used 32815 802f wavelength channel 3 0 0 not used 32816 8030 0 0 not used 32817 8031 0 0 not used 32818 8032 package oui 1 1 00-0a-cb 32819 8033 67 43 32820 8034 76 4c 32821 8035 32 20 32822 8036 vendor oui 3 3 00-13-19 32823 8037 34 22 32824 8038 96 60 32825 8039 00 32826 803a vendor name 73 49 i 32827 803b 78 4e n 32828 803c 70 46 f 32829 803d 73 49 i 32830 803e 78 4e n 32831 803f 69 45 e 32832 8040 79 4f o 32833 8041 78 4e n nvram register contents (cont?d) address group xenpak msa 3.0 value comment dec hex definition dec hex
v23833-gx005-a1x1 application notes preliminary product information 19 2004-05-13 32834 8042 basic vendor name 32 20 32835 8043 70 46 f 32836 8044 79 4f o 32837 8045 32 20 32838 8046 71 47 g 32839 8047 109 6d m 32840 8048 98 62 b 32841 8049 72 48 h 32842 804a vendor part number 86 56 v 32843 804b 50 32 2 32844 804c 51 33 3 32845 804d 56 38 8 32846 804e 51 33 3 32847 804f 51 33 3 32848 8050 45 2d - 32849 8051 71 47 g 32850 8052 1) 1) 1) 32851 8053 48 30 0 32852 8054 48 30 0 32853 8055 53 35 5 32854 8056 65 41 a 32855 8057 49 31 1 32856 8058 2) 2) 2) 32857 8059 49 31 1 32858 805a vendor revision 66 42 b 32859 805b 50 32 2 nvram register contents (cont?d) address group xenpak msa 3.0 value comment dec hex definition dec hex
v23833-gx005-a1x1 application notes preliminary product information 20 2004-05-13 32860 805c basic vendor serial number 80 50 32861 805d 80 50 32862 805e 80 50 32863 805f 80 50 32864 8060 80 50 32865 8061 80 50 32866 8062 80 50 32867 8063 80 50 32868 8064 80 50 32869 8065 80 50 32870 8066 80 50 32871 8067 80 50 32872 8068 80 50 32873 8069 80 50 32874 806a 80 50 32875 806b 80 50 32876 806c year code 32877 806d 32878 806e 32879 806f 32880 8070 month code 32881 8071 32882 8072 day code 32883 8073 32884 8074 lot code 32885 8075 32886 8076 5 v stressed environment reference 1150 ma 32887 8077 3.3 v stressed environment reference 1 1 550 ma 32888 8078 aps stressed environment reference 2 2 750 ma nvram register contents (cont?d) address group xenpak msa 3.0 value comment dec hex definition dec hex
v23833-gx005-a1x1 application notes preliminary product information 21 2004-05-13 32889 8079 basic nominal aps voltage 20 14 +1.8 v 32890 807a dom capability 193 c1 default 32891 807b optional capability 0 0 none 32892 807c reserved 0 0 32893 807d basic checksum 32894 to 32941 807e to 80ad customer area 32942 to 33030 80ae to 8106 vendor specific 1) v23833-g2005-a101: dec = 50, hex = 32, comment = 2 V23833-G6005-A101: dec = 54, hex = 36, comment = 6 v23833-g6005-a111: dec = 54, hex = 36, comment = 6 2) v23833-g2005-a101: dec = 48, hex = 30, comment = 0 V23833-G6005-A101: dec = 48, hex = 30, comment = 0 v23833-g6005-a111: dec = 49, hex = 31, comment = 1 nvram register contents (cont?d) address group xenpak msa 3.0 value comment dec hex definition dec hex
v23833-gx005-a1x1 application notes preliminary product information 22 2004-05-13 pcb cage footprints figure 5 standard mounting figure 6 belly-to-belly mounting dimensions in mm [inches] file: 2203 dimensions in mm [inches] file: 2204
v23833-gx005-a1x1 application notes preliminary product information 23 2004-05-13 host board layouts figure 7 host pcb, board connector layout and bezel opening 35.51 [1.398] 35.51 [1.398] 41.91 [1.65] 40.23 [1.584] 41.91 [1.65] 38.1 [1.5] 4.24 [.167] 1.02 [.04] 1) 2) 0.51 [.02] 3) 39.12 0.12 [1.54 .005] 1) 2) 36.5 0.12 [1.437 .005] 3) 1) tall profile 2) low profile 3) flangeless ? 0.25 [.01] g h j 25.3 0.12 [.996 .005] 1) 12.85 0.12 [.506 .005] 2) 10.31 0.12 [.406 .005] 3) 11.76 [.463] 1) 6.4 [.252] 2) 6.43 [.253] 3) 65.66 [2.585] 62.36 [2.455] 55.88 [2.2] 47.8 [1.882] 31.75 [1.25] 19.05 [.75] 44.07 [1.735] ? 0.15 [.006] g h j 10x ? 2 0.08 [.079 .003] h j g 59.69 [2.35] 44.45 [1.75] 55.88 [2.2] 38.1 [1.5] 12.7 [.5] 25.4 [1] 6.6 0.38 [.26 .015] 1) 2) 7.39 0.38 [.291 .015] 3) 3.94 [.155] 9.14 [.36] 1) 2) 6.35 [.25] dimensions in mm [inches] file: 2504 29.6 14.8 ? 1.55 0.05 13.8 13.8 13.4 13.4 4.1 4.1 pad detail see below 0.5 0.03 (70x) 0.8 (34x) 2 0.05 (70x) pad detail pad spacing
v23833-gx005-a1x1 application notes preliminary product information 24 2004-05-13 figure 8 host board pad layout 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 upper row toward bezel lower row prtad2 prtad1 prtad0 vend specific aps set reserved aps sense aps aps 3.3 v 3.3 v 5.0 v gnd gnd gnd gnd 5.0 v 3.3 v 3.3 v aps aps lasi reset vend specific tx on/off reserved mod detect vend specific vend specific mdio mdc prtad4 prtad3 gnd gnd gnd gnd gnd gnd gnd reserved reserved gnd tx lane3 ? tx lane3+ gnd tx lane2 ? tx lane2+ gnd tx lane1 ? tx lane1+ gnd tx lane0 ? tx lane0+ gnd gnd rx lane2 ? rx lane2+ gnd rx lane1 ? rx lane1+ gnd rx lane0 ? rx lane0+ gnd reserved reserved rx lane3 ? rx lane3+ gnd gnd file: 2505
v23833-gx005-a1x1 package outlines preliminary product information 25 2004-05-13 package outlines figure 9 xpak with bail de-latch mechanism figure 10 xpak with no de-latch mechanism dimensions in mm mezzanine profile version shown with lc receptacle file: 2201 dimensions in mm [inches] file: 2210 a) a) for 0-80 unf screw assembly see mechanical characteristics
v23833-gx005-a1x1 package outlines preliminary product information 26 2004-05-13 figure 11 label description figure 12 xpak temperature reference point laser class optional marking (ms/es) country of origin description part number yyyy: ww: nnnnnnnn: mmmmm: 2.6 17.45 year of production week of production serial number month of production 8.5 33.5 dimensions in mm file: 2401 dimensions in mm file: 2205
edition 2004-05-13 published by infineon technologies ag, st.-martin-strasse 53, 81669 mnchen, germany ? infineon technologies ag 2004. all rights reserved. attention please! the information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. terms of delivery and rights to technical change reserved. we hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. v23833-g2005-a101, v23833-g 6005-a101, v23833-g6005-a111 revision history: 2004-05-13 ds3 previous version: 2004-02-23 page subjects (major changes since last revision) v23833-g6005-a111 added 1 , 2optical features changed 2 electrical features changed 9 environment: thermal management recommendations changed 9 fibers and connectors changed 9 cage requirement changed 11 table ? recommended operating conditions ? changed 14 table ? electrical ac characteristics ? changed 15 table ? mechanical characteristics ? added 16 eye safety changed table ? laser data ? added figure 3 required labels added figure 4 laser emission added 17 nvram register contents added 25 figure 10 xpak with no de-latch mechanism added

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