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triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 1 april 6, 2006 10.7gb/s linear optical modulator dr iver TGA4819-SL oc-192 metro and long haul applications surface mount package key features and performance ? up to 10 v pp linear output voltage ? 20 db gain ? internal dc blocks ? single-ended input / output ? small form factor - 11.4 x 8.9 x 2 mm - 0.450 x 0.350 x 0.080 inches primary applications ? mach-zehnder linear modulator driver for metro and long haul preliminary measured performance bias conditions: v d = 8v, v ctrl = +1v, i d = 310ma prbs 2 31 -1; 10.7gbps; vin = 1vpp; cpc = 50% description the triquint TGA4819-SL is part of a series of optical driver amp lifiers suitable for a variety of driver applications. the TGA4819-SL is a medium power wideband agc amplifie r that typically provides 20db small signal gain with 20db agc range. the TGA4819-SL is an excellent choice for applications requirin g high drive combined with high linearity. the TGA4819-SL has demonstrated capability to deliver 10vpp while maintaining outp ut harmonic levels near -30dbc for a 2ghz fundamental. the TGA4819-SL requir es a low frequency choke and control circuitry. note: this device is early in the characterization process prio r to finalizing all electrical specifications. specifications are subject to change without notice.
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 2 april 6, 2006 TGA4819-SL table i maximum ratings symbol parameter value notes v d drain voltage 9 v 1/ 2 / v g gate voltage range -3v to 0v 1/ v ct rl control voltage range -3v to v d /2 1/ i d drain supply current (quiescent) 400 ma 1/ 2 / | i g | gate supply current 5 ma 1/ p in input continuous wave power 23 dbm 1/ 2 / v in 10.7gb/s prbs input voltage 4 v pp 1/ 2 / p d power dissipation 3.1 w 1/ 2 / 3 / t ch operating channel temperature 150 0 c4/ t m mounting temperature (10 seconds) 230 0 c t stg storage temperature -65 to 150 0 c 1/ these ratings represent the maximum operable values for this device 2/ combinations of supply voltage, supply current, input power, and output power shall not exceed p d at a package base temperature of 70 c 3/ when operated at this bias condition with a baseplate temperature of 70 c, the mttf is reduced to 1.0e+6 hours 4/ junction operating temperature will directly affect the device median time to failure (mttf). for maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. table ii thermal information parameter test conditions t ch ( c) r jc ( c/w) mttf (hrs) r jc thermal resistance (channel to backside of package) v d = 8v i d = 350ma p diss = 2.8w t base = 70 c 142.8 25.7 1.9e6 note: thermal transfer is conducted th rough the bottom of the TGA4819-SL package into the motherboard. the motherboard must be designed to assure adequate thermal transfer to the base plate.
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 3 april 6, 2006 TGA4819-SL table iii rf characterization table (t a = 25 c, nominal) (v d = 8v, v ctrl = +1v, i d = 310ma 5% , v g -0.3v) parameter test conditions typ units notes small signal bandwidth 8 ghz small signal gain 100 mhz ? 4 ghz 6 ghz 10 ghz 14 ghz 20 19 17 12 db 1/ 2 / input return loss 100 mhz ? 14 ghz 15 db 1/ 2 / output return loss 100 mhz ? 14 ghz 13 db 1/ 2 / small signal agc range midband 20 db output power @ p 1db 2 ghz 25.5 dbm 3/ note: table iii lists the rf characteristics of typical devices as determined by fixtured measurements. 1/ verified at package level rf test 2/ package rf test bias: v d = 8v, v ct rl = +1v, adjust v g to achieve i d =310 ma 3/ verified at die level on-wafer probe
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 4 april 6, 2006 measured performance v d = 8v; v ctrl = +1v; i d = 310ma; v g -0.3v TGA4819-SL 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 2 4 6 8 101214161820 frequency (ghz) gain (db) -30 -25 -20 -15 -10 -5 0 0 2 4 6 8 101214161820 frequency (ghz) return loss (db) s11 s22
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 5 april 6, 2006 measured performance v d = 8v; v ctrl = +1v; i d = 310ma; v g -0.3v TGA4819-SL 0 1 2 3 4 5 6 7 8 9 10 11 12 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 vin (vpp) vout (vpp)
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 6 april 6, 2006 measured performance v d = 8v; v ctrl = +1v; i d = 310ma; v g -0.3v prbs 2 31 -1; 10.7gbps; cpc = 50% TGA4819-SL vin = 500mv pp vin = 1v pp input signal vin = 1v pp includes 8ghz bessel filter
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 7 april 6, 2006 application circuit note: 1. c1 extends low frequency performance to 30 khz. for applications requiring low frequency performance to only 100 khz, c1 may be omitted 2. c2 is a power supply decoupling capacitor and may be omitted when driven directly with an op-amp. TGA4819-SL tga4819 vctrl vd vg c2 vctrl c1 vg l1 l2 r1 r2 c4 vd rf in rf out vd_byp c3
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 8 april 6, 2006 designator description manufacturer part number c1, c3 10uf capacitor mlc ceramic avx 0802yc106kat c2 0.01 ufcapacitor mlc ceramic avx 0603yc103kat c4 10 uf capacitor tantalum avx taja106k016r l1 220 uh inductor belfuse s581-4000-14 l2 330 nh inductor panasonic coilcraft elj-far33mf2 0603ls-331xjb r1, r2 274 ? resistor panasonic erj-2rkf2740x recommended components: application circuit (continued) TGA4819-SL
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 9 april 6, 2006 bias on 1. disable the output of the ppg 2. set v d = 0v, v ctrl = 0v & v g = 0v 3. set v g = -1.5v 4. increase v d to 8v observing id - assure i d = 0ma 5. set v ctrl = +1v -i d should still be 0ma 6. make v g more positive until i d = 310ma. v g will be approximately -0.3v. 7. enable the output of the ppg. 8. output swing adjust : adjust v ctrl slightly positive to increase output swing or adjust v ctrl slightly negative to decrease the output swing. 9. crossover adjust : adjust v g slightly positive to push the crossover down or adjust v g slightly negative to push the crossover up. bias off 1. disable the output of the ppg 2. set v ctrl = 0v 3. set v d = 0v 4. set v g = 0v laboratory - bias on/off procedure vd=8v, cpc=50% TGA4819-SL
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 10 april 6, 2006 mechanical drawing TGA4819-SL 13 6 7 8 9 19 12 10 11 3 4 5 1 2 18 16 14 15 17 notes: 1. maximize number of vias on attachment area of pcb for bond pad #19. this is required electrical and thermal conduction 2. pad sizes for rf input and output (#18, #9) are shown for soldermask opening. solder should not be applied outside of this area. dimensions : inches tolerances : length & width: 0.003" height: 0.006" adjacent pad to pad spacing: 0.0002" pad size: 0.001" package backside material : material: ro4003 (0.008" thk) w/ 0.5oz cu (0.0007" thk) plating: 100 - 350in ni underplate w/ 5 - 10in au overplate 0.025" x 0.041" 0.018" x 0.041" 0.018" x 0.041" 0.018" x 0.041" 0.018" x 0.041" 0.018" x 0.041" 0.018" x 0.041" 0.018" x 0.041" 0.020" x 0.018" 0.018" x 0.041" n/c n/c n/c n/c n/c vg n/c n/c rf out n/c bond pad #1 bond pad #2 bond pad #3 bond pad #4 bond pad #5 bond pad #6 bond pad #7 bond pad #8 bond pad #9 bond pad #10 bond pad #11 bond pad #12 bond pad #13 bond pad #14 bond pad #15 bond pad #16 bond pad #17 bond pad #18 bond pad #19 n/c vd n/c n/c n/c vd_byp vctrl rf in gnd 0.018" x 0.041" 0.018" x 0.041" 0.018" x 0.041" 0.018" x 0.041" 0.018" x 0.041" 0.018" x 0.041" 0.018" x 0.041" 0.020" x 0.018" 0.334" x 0.187" .000 .024 .175 .326 .350 .000 .013 .047 .235 .087 .127 .167 .207 .206 .327 .367 .407 .412 .438 .450 orientation mark
triquint semiconductor texas : (972)994 8465 fax (972)994 8504 web: www.triquint.com advance product datasheet 11 april 6, 2006 assembly of a TGA4819-SL package onto a motherboard manual assembly for prototypes 1. clean the motherboard with acetone and rinse with alcohol and di water. allow the motherboard to fully dry. 2. using a standard sn63 or lead-free solder paste, dispens e solder paste dots of 5 to 15 mil in diameter to the motherboard. assure that there is a minimum of 5 mils and a maximum of 10 mils between the edge of each solder paste area and the closest edge of the ground pad. 3. manually place a TGA4819-SL on the motherboard with correct orientation and good alignment. the alignment can be determined manually by centering the package on the motherboard. the rf traces (pin 1 and pin 10) are located along the center horizontal axis of the package. 4. reflow the assembly on a hot plate with the surface temperature of the plate near 230 o c for 5 to 6 seconds (for snpb). 5. let the assembly completely cool down. this package has little or no tendency to self- align during the reflow. 6. clean the assembly with acetone and rinse with alcohol and di water. caution: the TGA4819-SL contains gaas mmic devices that are susceptible to damage from electrostatic discharge. proper precautions should be observed during handling, assembly and test. TGA4819-SL typical solder reflow profiles reflow profile snpb pb free ramp-up rate 3 c/sec 3 c/sec activation time and temperature 60 ? 120 sec @ 140 ? 160 c 60 ? 180 sec @ 150 ? 200 c time above melting point 60 ? 150 sec 60 ? 150 sec max peak temperature 240 c 260 c time within 5 c of peak temperature 10 ? 20 sec 10 ? 20 sec ramp-down rate 4 ? 6 c/sec 4 ? 6 c/sec

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