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tle42744 low dropout linear voltage regulator data sheet, rev. 1.1, january 2010 automotive power
tle42744 type package marking TLE42744DV50 pg-to252-3 42744v5 tle42744gv50 pg-to263-3 42744v5 tle42744ev50 pg-ssop-14 exposed pad 42744v5 tle42744dv33 pg-to252-3 42744v33 tle42744gv33 pg-to263-3 42744v33 tle42744gsv33 pg-sot223-4 42744v33 data sheet 2 rev. 1.1, 2010-01-13 pg-to252-3 pg-to263-3 pg-ssop-14 exposed pad pg-sot223-4 low dropout linear voltage regulator 1overview features ? very low current consumption ? output voltages 5 v and 3.3 v 2% ? output current up to 400 ma ? very low dropout voltage ? output current limitation ? reverse polarity protection ? overtemperature shutdown ? wide temperature range from -40 c up to 150 c ? green product (rohs compliant) ? aec qualified description the tle42744 is a monolithic integrated low dropout voltage regulator for load currents up to 400 ma. an input voltage up to 40 v is regulated to v q,nom = 5 v / 3.3 v with a precision of 2%. the device is designed for the harsh environment of automotive applications. therefore it is protected against ov erload, short circuit and overtemperature conditions by the implemented outpu t current limitation and the overtemperature shutdown circuit. the tle42744 can be also us ed in all other applicat ions requiring a stabilized 5 v / 3.3 v voltage. due to its very low quiescent current the tle42744 is dedicated for use in applications permanently connected to v bat .
data sheet 3 rev. 1.1, 2010-01-13 tle42744 block diagram 2 block diagram figure 1 block diagram aeb01959 gnd q bandgap reference control amplifier sensor temperature buffer saturation control and protection circuit
tle42744 pin configuration data sheet 4 rev. 1.1, 2010-01-13 3 pin configuration 3.1 pin assignment pg-to252-3, pg-to263-3 and pg-sot223-4 figure 2 pin configuration (top view) 3.2 pin definitions and functions pg -to252-3, pg-to263-3and pg-sot223-4 pin no. symbol function 1i input block to ground directly at the ic with a ceramic capacitor 2gnd ground internally connected to heat slug 3q output block to ground with a capacitor close to the ic terminals, respecting the values given for its capacitance and esr in ?functional range? on page 7 heat slug / 4 ? heat slug internally connected to gnd; connect to gnd and heatsink area aep02561 13 q gnd gnd q aep02281 pinconfig_pg-sot223- 4 .vsd 123 4 i gnd gnd q
data sheet 5 rev. 1.1, 2010-01-13 tle42744 pin configuration 3.3 pin assignment pg -ssop-14 exposed pad figure 3 pin configuration (top view) 3.4 pin definitions and functi ons pg-ssop-14 exposed pad pin no. symbol function 1, 2, 3, 5, 6, 7 n.c. not connected can be open or connected to gnd 4gnd ground 8, 10, 11, 12, 14 n.c. not connected can be open or connected to gnd 9q output block to ground with a capacitor close to the ic terminals, respecting the values given for its capacitance and esr in ?functional range? on page 7 13 i input block to ground directly at the ic with a ceramic capacitor pad ? exposed pad connect to gnd and heatsink area qf qf 4 qf qf qf , qf qf qf qf *1' qf qf 7/(b3,1&21),*b6623 69*
tle42744 general product characteristics data sheet 6 rev. 1.1, 2010-01-13 4 general product characteristics 4.1 absolute maximum ratings note: stresses above the ones listed here may cause perm anent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. note: integrated protection functions are designed to prevent ic destruction under fault conditions described in the data sheet. fault conditions are considered as ?outside? normal operating range. protection functions are not designed for continuous repetitive operation. absolute maximum ratings 1) t j = -40 c to 150 c; all voltages with respect to ground, (unless otherwise specified) 1) not subject to production test, specified by design pos. parameter symbol limit values unit test condition min. max. input i 4.1.1 voltage v i -42 45 v ? output q 4.1.2 voltage v q -1 40 v ? temperature 4.1.3 junction temperature t j -40 150 c? 4.1.4 storage temperature t stg -50 150 c? esd susceptibility 4.1.5 esd absorption v esd,hbm -4 4 kv human body model (hbm) 2) 2) esd susceptibility human body model ?h bm? according to aec-q100-002 - jesd22-a114 4.1.6 v esd,cdm -1000 1000 v charge device model (cdm) 3) at all pins 3) esd susceptibility charged device model ?cdm? according to esda stm5.3.1
data sheet 7 rev. 1.1, 2010-01-13 tle42744 general product characteristics 4.2 functional range note: within the functional or operating range, the ic operat es as described in the circuit description. the electrical characteristics are specif ied within the conditions given in th e electrical char acteristics table. 4.3 thermal resistance note: this thermal data was generated in accordance wit h jedec jesd51 standards. fo r more information, go to www.jedec.org . pos. parameter symbol limit values unit remarks min. max. 4.2.1 input voltage v i 5.5 40 v TLE42744DV50, tle42744gv50, tle42744ev50 4.2.2 input voltage v i 4.7 40 v tle42744gv33, tle42744dv33, tle42744gsv33 4.2.3 output capacitor?s requirements for stability c q 22 ? f 1) 1) the minimum output capacitance requirement is appl icable for a worst case capacitance tolerance of 30% 4.2.4 esr(c q ) ?3 ? 2) 2) relevant esr value at f =10khz 4.2.5 junction temperature t j -40 150 c? pos. parameter symbol limit values unit conditions min. typ. max. TLE42744DV50, tle42744dv33 (pg-to252-3) 4.3.1 junction to case 1) r thjc ? 3.6 ? k/w measured to heat slug 4.3.2 junction to ambient 1) r thja ?27?k/w 2) 4.3.3 ? 115 ? k/w footprint only 3) 4.3.4 ? 52 ? k/w 300 mm2 heatsink area 3) 4.3.5 ? 40 ? k/w 600 mm2 heatsink area 3) tle42744gv50, tle42744gv33 (pg-to263-3) 4.3.6 junction to case 1) r thjc ? 3.6 ? k/w measured to heat slug 4.3.7 junction to ambient 1) r thja ?22? 2) 4.3.8 ? 74 ? k/w footprint only 3) 4.3.9 ? 42 ? k/w 300 mm2 heatsink area 3) 4.3.10 ? 34 ? k/w 600 mm2 heatsink area 3)
tle42744 general product characteristics data sheet 8 rev. 1.1, 2010-01-13 tle42744ev50 (pg-ssop-14 exposed pad) 4.3.11 junction to case 1) r thjc ? 7 ? k/w measured to exposed pad 4.3.12 junction to ambient 1) r thja ?43?k/w 2) 4.3.13 ? 120 ? k/w footprint only 3) 4.3.14 ? 59 ? k/w 300 mm2 heatsink area 3) 4.3.15 ? 49 ? k/w 600 mm2 heatsink area 3) tle42744gsv33 (pg-sot223-4) 4.3.16 junction to case 1) r thjc ? 17 ? k/w measured to heat slug 4.3.17 junction to ambient 1) r thja ?54?k/w 2) 4.3.18 ? 139 ? k/w footprint only 3) 4.3.19 ? 73 ? k/w 300 mm2 heatsink area 3) 4.3.20 ? 64 ? k/w 600 mm2 heatsink area 3) 1) not subject to production test, specified by design. 2) specified r thja value is according to jedec jesd51-2,-5,-7 at natural convection on fr4 2s2p board; the product (chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm3 bo ard with 2 inner copper layers (2 x 70m cu, 2 x 35m cu). where applicable a thermal via array under the ex posed pad contacted the first inner copper layer. 3) specified r thja value is according to jedec jesd 51-3 at natural convection on fr4 1s0p board; the product (chip+package) was simulated on a 76.2 114.3 1.5 mm 3 board with 1 copper layer (1 x 70m cu). pos. parameter symbol limit values unit conditions min. typ. max.
data sheet 9 rev. 1.1, 2010-01-13 tle42744 electrical characteristics 5 electrical characteristics 5.1 electrical character istics voltage regulator electrical characteristics v i =13.5 v; t j = -40 c to 150 c; all voltages with respect to ground (unless otherwise specified) pos. parameter symbol limit va lues unit measuring condition min. typ. max. output q 5.1.1 output voltage v q 4.9 5.0 5.1 v TLE42744DV50, tle42744gv50, tle42744ev50 5ma< i q <400ma 6v< v i <28v 5.1.2 output voltage v q 4.9 5.0 5.1 v TLE42744DV50, tle42744gv50, tle42744ev50 5ma< i q <200 ma 6v< v i <40v 5.1.3 output voltage v q 3.23 3.3 3.37 v tle42744gv33, tle42744dv33, tle42744gsv33; 5ma< i q <400ma 4.7 v < v i <28v 5.1.4 output voltage v q 3.23 3.3 3.37 v tle42744gv33, tle42744dv33, tle42744gsv33; 5ma< i q <200 ma 4.7 v < v i <40v 5.1.5 dropout voltage v dr ? 250 500 mv TLE42744DV50, tle42744gv50, tle42744ev50 i q =250ma v dr = v i ? v q 1) 5.1.6 load regulation ? v q, lo ? 20 50 mv TLE42744DV50, tle42744gv50, tle42744ev50; i q = 5 ma to 400 ma v i =6v 5.1.7 load regulation ? v q, lo ? 40 70 mv tle42744gv33, tle42744dv33, tle42744gsv33; i q = 5 ma to 300 ma 5.1.8 line regulation ? v q, li ? 1025mv v l = 12 v to 32 v i q =5ma 5.1.9 output current limitation i q 400 600 1100 ma 1) 5.1.10 power supply ripple rejection 2) psrr ?60?db f r =100hz; v r =0.5vpp
tle42744 electrical characteristics data sheet 10 rev. 1.1, 2010-01-13 5.1.11 temperature ou tput voltage drift 2) ?0.5?mv/k? 5.1.12 overtemper ature shutdown threshold t j,sd 151 ? 200 c t j increasing 2) 5.1.13 overtemper ature shutdown threshold hysteresis t j,sdh ?25?c t j decreasing 2) current consumption 5.1.14 quiescent current i q = i i ? i q i q ?100220 a i q =1ma 5.1.15 current consumption i q = i i ? i q i q ?815ma i q =250ma 5.1.16 i q ? 15 25 ma TLE42744DV50, tle42744gv50, tle42744ev50; i q =400ma 5.1.17 ? 20 30 ma tle42744gv33, tle42744dv33, tle42744gsv33; i q =400ma 1) measured when the output voltage v q has dropped 100 mv from the nominal value obtained at v i = 13.5 v. 2) not subject to production test, specified by design electrical characteristics v i =13.5 v; t j = -40 c to 150 c; all voltages with respect to ground (unless otherwise specified) pos. parameter symbol limit va lues unit measuring condition min. typ. max. dv q dt ---------- -
data sheet 11 rev. 1.1, 2010-01-13 tle42744 electrical characteristics 5.2 typical performance characteristics voltage regulator current consumption i q versus output current i q current consumption i q versus low output current i q output voltage variation ? v q versus junction temperature t j dropout voltage v dr versus output current i q (5 v versions only) 01_iq_iq.vsd 0 2 4 6 8 10 12 14 16 0 100 200 300 400 i q [ma] i q [ma] v i = 13.5 v t j = 25 c 02_iq_iqlow.vsd 0 0,2 0,4 0,6 0,8 1 1,2 1,4 0 20406080100 i q [ma] i q [ma] v i = 13.5 v t j = 25 c 03_vq_tj.vsd -0,5 -0,4 -0,3 -0,2 -0,1 0 0,1 0,2 0,3 0,4 0,5 -40 0 40 80 120 t j [c] ? v q [%] i q = 5 ma v i = 13.5 v 150 04_vdr_iq.vsd 0 50 100 150 200 250 300 350 400 450 500 0 100 200 300 400 i q [ma] v dr [mv] t j = 150 c t j = 25 c t j = -40 c
tle42744 electrical characteristics data sheet 12 rev. 1.1, 2010-01-13 dropout voltage v dr versus junction temperature (5 v versions only) maximum output current i q versus input voltage v i region of stability: output capacitor?s esr esr(c q ) versus output current i q 05_vdr_tj.vsd 0 50 100 150 200 250 300 350 400 450 500 -40 0 40 80 120 160 t j [c] v dr [mv] i q = 400 ma i q = 100 ma i q = 10 ma 0 6 _ iq max_ vi.vsd 0 100 200 300 400 500 600 700 800 900 010203040 v i [v] i q,max [ma] v q = v q,nom - 100 mv t j = -40 c t j = 25 c t j = 150 c 07_esr_iq.vsd 0,01 0,1 1 10 0 100 200 300 400 i q [ma] esr(c q ) [ ? ] c q = 22 f v i = 13.5 v stable region unstable region
data sheet 13 rev. 1.1, 2010-01-13 tle42744 package outlines 6 package outlines figure 4 pg-to252-3 5.4 ?.1 -0.10 6.5 +0.15 a ?.5 9.9 6.22 -0.2 1 ?.1 ?.15 0.8 0.15 ?.1 max. per side 0.75 2.28 4.57 +0.08 -0.04 0.9 2.3 -0.10 +0.05 b min. 0.51 ?.1 1 +0.08 -0.04 0.5 0...0.15 b a 0.25 m 0.1 all metal surfaces tin plated, except area of cut. 3 x
tle42744 package outlines data sheet 14 rev. 1.1, 2010-01-13 figure 5 pg-to263-3 b a 0.25 m 0.1 typical ?.2 gpt09362 10 8.5 1) 7.55 1) (15) ?.2 9.25 ?.3 1 0...0.15 5.08 2.54 0.75 ?.1 1.05 ?.1 1.27 4.4 b 0.5 ?.1 ?.3 2.7 4.7 ?.5 0.05 1) 0.1 all metal surfaces: tin plated, except area of cut. 2.4 metal surface min. x=7.25, y=6.9 a 0...0.3 b 8? max.
data sheet 15 rev. 1.1, 2010-01-13 tle42744 package outlines figure 6 pg-ssop-14 exposed pad pg-ssop-14-1,-2,-3-po v02 1 7 14 8 14 17 8 14x 0.25 ?.05 2) m 0.15 d c a-b 0.65 c stand off 0 ... 0.1 (1.45) 1.7 max. 0.08 c a b 4.9 ?.1 1) a-b c 0.1 2x 1) does not include plastic or metal protrusion of 0.15 max. per side 2) does not include dambar protrusion bottom view ?.2 3 ?.2 2.65 0.2 ?.2 d 6 m d 8x 0.64 ?.25 3.9 ?.1 1) 0.35 x 45? 0.1 cd +0.06 0.19 8 ? max. index marking exposed diepad
tle42744 package outlines data sheet 16 rev. 1.1, 2010-01-13 figure 7 pg-sot223-4 green product (rohs compliant) to meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. green products are rohs-compliant (i.e pb-free finish on leads and suitable for pb-free soldering according to ipc/jedec j-std-020). sot223-po v04 12 3 3 4 ?.1 0.04 0.5 min. 0.28 0.1 max. 6.5 ?.2 a 4.6 2.3 0.7 ?.1 0.25 m a 1.6 ?.1 7 ?.3 b 0.25 m ?.2 3.5 b 0...10? for further information on alternativ e packages, please vi sit our website: http://www.infineon.com/packages . dimensions in mm
data sheet 17 rev. 1.1, 2010-01-13 tle42744 revision history 7 revision history revision date changes 1.1 2010-01-13 updated version data sheet: version tle42744ev50 in pg-ssop-14 exposed pad and all related description added; 3.3v versions tle42744gv33 in pg-t o263-3, tle42744dv33 in pg-to252-3 and tle42744gsv33 in pg-sot223-4 and all related description added 1.0 2009-01-14 initial version final data sheet
edition 2010-01-13 published by infineon technologies ag 81726 munich, germany ? 2010 infineon technologies ag all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infine on technologies hereby disclaims any and all warranties and liabilities of any kind, including witho ut limitation, warranties of non-infrin gement of intellectua l property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies compon ents may be used in life-su pport devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that de vice or system. life support devices or systems are intended to be implanted in the hu man body or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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