bright view electronics co.,ltd tolerance 0.1 @ description dice material : gaalas/gaalas red light color : red color lens color : milky diffused absolute maximum ratings at ta = 25 unit mw ma ma v ma/ o c o c o c electrical / optical characteristics at ta = 25 symbol unit v f v i r ? a p n m d n m 2 e 1/2 deg bin grade limits ( i f = 20 ma ) luminous intensity / mcd bin t u v w x y min. 17 22 28 36 47 60 max. 22 28 36 47 60 78 tolerance 15%mcd * e 1/2 is the off-axis an g le where the luminous intensit y is one half the on-axis intensit y . ? a high brightness smd led BVS-166RU2 package configuration parameter max. power dissipation 55 continuous forward current 20 peak forward current ( 1/10 duty cycle , 0.1ms pulse width ) 80 reverse voltage 5 derating linear from 50 : 0.35 operating temperature range 40 to 100 storage temperature range 40 to 100 2.7 reflow soldering condition 230 : for 10 seconds parameter test cond. min. typ. max. forward voltage i f = 20 ma 2.1 100 reverse current v r = 5v peak emission wavelength i f = 20 ma 660 dominant wavelength i f = 20 ma 643 infrared soldering condition 260 : for 5 seconds 2003/12/24 *bright view reserves the rights to alter specifications and remove availability of products at any time without notice. *dominant wavelength, d is according to cie chromaticity diagram base on color of lamps. viewing angle i f = 20 m a 130 soldering terminal led die 0.4 0.8 p c .board resin polarity soldering terminal 0.7 0.8 0.8 soldering pattem cathode line cathode mark 1.6 1.0 1.0 0.3 0.6 0.8 0.4 0.8
bright view electronics co.,ltd smd application ( pb free soldering ) apply to bvs-3xx ? 1xx series. description: (1) manual soldering (we do not recommend this method strongly.) (1.1) to prevent cracking,please bake (65 : ,24hrs)before soldering. (1.2) temperature at tip of iron: 250 : max.(25w) (1.3) it's banned to load any stress on the resin during soldering. (1.4) soldering time: 3 sec. max.(one time only) (2) reflow soldering (2.3) never take next process until the component is cooled down to room temperature after reflow. (2.5) the recommended reflow soldering profile(measuring on the surface of the led resin)is following: 2005 / 10 / 20 - b (2.2) when soldering,do not put stress on the leds during heating. (2.4) after soldering,do not warp the circuit board. 0.5 : /sec max. 245 c max. 1 : /sec. max. time temperature 210 sec. min. 10 sec. max. 150 : 217 : the reflow temperature 240 : ~245 : is recommended and the soldering temperature should be not higher than 245 : (one time only) 100 sec. max. 50 sec. max. ~75 : ~25 : (2.1) to prevent cracking,please bake (65 : ,24hrs)before soldering. 217 :
bright view electronics co.,ltd bvs-166/167 series chip leds packing 2003 / 11 / 12 - a item no. device: q'ty pcs. n. w.: kgs. g. w.: kgs. re y 4.0 0.10 1.5 0.10 2.0 0.05 4.0 0.10 8.0 0.20 1.75 0.10 3.5 0.05 feeding direction 0.23 0.05 0.75 0.10 178 1.0 60 0.5 39 24 22 carton dimension(cm): 39*24*22 unit : mm unit : mm carton : 30 reels total : 120,000pcs electronics co.,ltd. bvs-16xxxx q'ty lot no.: grade: part no.: - pcs x- qa bright view label 1 reel : 4,000pcs electronics co.,ltd. electrostatic sensitive devices do not open or handle except at a static-free workstation part no.: grade: lot no.: bright view q'ty dbvujpo pcs qa label 2 anti-electrostatic bag normal x: bin grade : wavelength : vf cathode mark 1.80 0.10 12 0.5 - bvs-166 0.60 0.10 - bvs-167
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