doc. no : qw0905-la29b-1/4vgx-pf rev. : date : 29 - oct - 2008 a data sheet led array la29b-1/4vgx-pf ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
13.5min 1.0min 5.0 1.5max 0.5 typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lvg25820-pf + - 12.5min 1.0min 2.3typ + - 8.0 2.8 2.3typ 31.0 0.5 6.0x4=24 part no. la29b-1/4vgx-pf 5.0 9.5 0.5 typ vg 5.0 package dimensions page 1/5 2.7 x vgvgvg ligitek electronics co.,ltd. property of ligitek only
-40 ~ +100 tstg storage temperature 1.7 302.6 green diffused 565 gap green note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. la29b-1/4vgx-pf typical electrical & optical characteristics (ta=25 ) peak wave length pnm material part no emittedlens color forward voltage @ ma(v) luminous intensity @20ma(mcd) spectral halfwidth nm viewing angle 2 1/2 (deg) max. min. typ. min. 20 page 2/5 i f forward current reverse current @5v operating temperature t opr ir peak forward current duty 1/10@10khz power dissipationpd i fp parameter symbol absolute maximum ratings at ta=25 30 ma -40 ~ +85 10 a 100 mw 120 ma vg ratings unit ligitek electronics co.,ltd. property of ligitek only part no. la29b-1/4vgx-pf 6.5 12 170
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -4040 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 vg chip 3.5 page3/5 part no. la29b-1/4vgx-pf 100% 50% 75%25% 0 -60 -30 0 60 50% 25%75% 100% 30
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 60 seconds max note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 0 preheat 25 2 /sec max 120 260 temp( c) 50 100 time(sec) 150 5 /sec max 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) 2.wave soldering profile page 4/5 ligitek electronics co.,ltd. property of ligitek only part no. la29b-1/4vgx-pf
the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 page 5/5 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test operating life test reliability test: test condition test item description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 reference standard ligitek electronics co.,ltd. property of ligitek only part no. la29b-1/4vgx-pf
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