semix251d12fs ? by semikron rev. 9 ? 25.03.2010 1 semix ? 13 d bridge rectifier module (uncontrolled) semix251d12fs features ? terminal height 17 mm ? chips soldered directly to isolated substrate typical applications* ? fast input bridge rectifier for ac/dc motor control ? power supply ? high frequency applications absolute maximum ratings symbol conditions values unit rect. diode i f t j = 150 c t c =85c 250 a t c = 100 c 215 a i fsm 10 ms t j =25c 1660 a t j = 150 c 1330 a i 2 t t j =25c 13700 a 2 s t j = 150 c 8800 a 2 s v rsm 1200 v v rrm 1200 v t j -40 ... 150 c module t stg -40 ... 125 c v isol ac sinus 50hz 1min 4000 v 1s 4800 v characteristics symbol conditions min. typ. max. unit rectifier diode v f t j =25c 2.5 v v (to) t j = 150 c 1.2 v r t t j = 150 c 7m ? i rd t j = 150 c, v rd = v rrm ;v rd = v rrm 40 ma r th(j-c) per diode 0.26 k/w k/w module r th(c-s) per chip k/w per module 0.04 k/w m s to heat sink (m5) 3 5 nm m t to terminals (m6) 2.5 5 nm a 5 * 9,81 m/s 2 w350g
semix251d12fs 2 rev. 9 ? 25.03.2010 ? by semikron fig. 4l: power dissipation per module vs. direct current fig. 4r: power dissipation per module vs. case temperature fig. 6: transient thermal impedance vs. time fig. 7: on-state characteristics fig. 8: surge overload current vs. time
semix251d12fs ? by semikron rev. 9 ? 25.03.2010 3 this is an electrostatic discharge sensitive device (esds), international standard iec 60747-1, chapter ix * the specifications of our components may not be considered as an assurance of component characteristics. components have to b e tested for the respective application. adjustments may be necessary. t he use of semikron products in life support appliances and syste ms is subject to prior specification and written approval by semikron . we therefore strongly recommend prior consultation of our pers onal. spring configuration semix 13
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