?mounting instructions high temperature soldering guaranteed: 260 ? ?10 sc. recommended mounting torque: 8 kg.cm. fbi5.1b 1m1 100 40 fbi5.1b1m1.......fbi5.1j1m1 5 amp. glass passivated bridge rectifier dimensions in mm. maximum ratings, according to iec publication no. 134 recurrent peak forward current 10 ms. peak forward surge current i 2 t value for fusing (t = 10 ms) dielectric strength (terminals to case, ac 1 min.) operating temperature range storage temperature range i frm i fsm i 2 t v dis t j t stg 5.0 a at 100 ? 3.0 a at 25 ? 30 a 400 a 800 a 2 sec 1500 v ?40 to + 150 ? ?40 to +150 ? electrical characteristics at tamb = 25? v f max. forward voltage drop per element at i f = 5 a i r 1.1 v max. reverse current per element at v rrm voltage 100 to 600 v. current 5.0 a. v rrm v r i f(av) peak recurrent reverse voltage (v) recommended input voltage (v) max. average forward current with heatsink without heatsink plastic case 5 a fbi5.1d 1m1 200 80 fbi5.1f 1m1 300 125 fbi5.1j 1m1 600 250 maximum thermal resistance junction-case. with heatsink. junction-ambient. without heatsink. 2.2 ?/w 22 ?/w r th (j-c) r th (j-a) 25 3.2 7.5 7.5 10 1 0.7 3.5 1 + 0.05 + _ l suffix 17.5 8 ? ?glass passivated junction chips. ul recognized under component index file number e130180. lead and polarity identifications. case: molded plastic. ideal for printed circuit board (p.c.b.). high surge current capability. the plastic material carries u/l recognition 94 v-o. jan - 00 70 v rms maximum rms voltage (v) 140 210 420
maximum non-repetitive peak forward surge current number of cycles at 50 hz. 10 100 0 100 200 300 400 1 1 3 4 tamb, ambient temperature ( c) 2 0 50 100 150 175 0 125 25 75 forward current derating curve 5 v f , instantaneous forward voltage (v) 0.6 1.0 1.4 0 0.1 1.0 10 tamb = 25?c characteristic curves fbi5.1 - 1m1 typical forward characteristic heatsink tc tc sine wave r-load on heatsink + _ on glass-epoxi substrate p.c.b. soldering land 5 mm sine wave r-load free in air jan - 00 + _
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