? semiconductor components industries, llc, 2004 march, 2004 ? rev. 3 1 publication order number: srda05?4r2/d SRDA05-4R2 low capacitance surface mount tvs for high-speed data interfaces the srda05?4 transient voltage suppressor is designed to protect equipment attached to high speed communication lines from esd, eft, and lightning. features: ? so?8 package ? peak power ? 500 watts 8 x 20 s ? esd rating: iec 61000?4?2 (esd) 15 kv (air) 8 kv (contact) iec 61000?4?4 (eft) 40 a (5/50 ns) iec 61000?4?5 (lightning) 23 (8/20 s) ? ul flammability rating of 94v?0 typical applications: ? high speed communication line protection maximum ratings rating symbol value unit peak power dissipation 8 x 20 s @ t a = 25 c (note 1) p pk 500 w junction and storage temperature range t j , t stg ?55 to +150 c lead solder temperature ? maximum 10 seconds duration t l 260 c 1. non?repetitive current pulse 8 x 20 s exponential decay waveform so?8 low capacitance voltage suppressor 500 watts peak power 6 volts srda5= device code l = location code y = year ww = work week marking diagram device package shipping 2 ordering information srda05?4r2 so?8 2500/tape & reel srda5 lyww so?8 case 751 plastic pin configuration and schematic i/o 1 1 ref 1 2 ref 1 3 i/o 2 4 8 ref 2 7 i/o 4 6 i/o 3 5 ref 2 http://onsemi.com 1 8 2for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d.
srda05?4r2 http://onsemi.com 2 electrical characteristics characteristic symbol min typ max unit reverse breakdown voltage @ i t = 1.0 ma v br 6.0 ? ? v reverse leakage current @ v rwn = 5.0 volts i r n/a ? 10 a maximum clamping voltage @ i pp = 1.0 a, 8 x 20 s v c n/a ? 9.8 v maximum clamping voltage @ i pp = 10 a, 8 x 20 s v c n/a ? 12 v between i/o pins and ground @ v r = 0 volts, 1.0 mhz capacitance ? 10 15 pf between i/o pins @ v r = 0 volts, 1.0 mhz capacitance ? 5 8 pf electrical characteristics (t a = 25 c unless otherwise noted) unidirectional (circuit tied to pins 1 and 3 or 2 and 3) symbol parameter i pp maximum reverse peak pulse current v c clamping voltage @ i pp v rwm working peak reverse voltage i r maximum reverse leakage current @ v rwm v br breakdown voltage @ i t i t test current v br maximum temperature coefficient of v br i f forward current v f forward voltage @ i f z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i zk uni?directional tvs i pp i f v i i r i t v rwm v c v br v f
srda05?4r2 http://onsemi.com 3 typical characteristics ?100 0 9 figure 1. reverse breakdown versus temperature ?50 t, temperature ( c) 100 200 4 1 0 figure 2. reverse leakage versus temperature v z , reverse breakdown (v) 8 7 6 5 4 3 2 1 0 ?100 ?50 50 100 t, temperature ( c) 200 50 150 2 3 8 5 6 7 0 150 i r , reverse leakage ( a) figure 3. 8 20 s pulse waveform 100 90 80 70 60 50 40 30 20 10 0 0204060 t, time ( s) % of peak pulse current t p t r pulse width (t p ) is defined as that point where the peak current decay = 8 s peak value i rsm @ 8 s half value i rsm /2 @ 20 s 80 figure 4. clamping voltage versus peak pulse current 35 30 25 20 15 10 5 0 0204060 i pp , peak pulse current (a) 80 v c , clamping voltage (v) 10 30 50 70 90
srda05?4r2 http://onsemi.com 4 package dimensions so?8 case 751?07 issue ab seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751-01 thru 751-06 are obsolete. new standaard is 751-07 a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ?x? ?y? g m y m 0.25 (0.010) ?z? y m 0.25 (0.010) z s x s m *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 srda05?4r2/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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