 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| 100vg-anylan multimode fiber transceivers in low cost 1x9 package style technical data features ? full compliance with the optical performance requirements of the ieee 802.12 ? multisourced 1x9 package style with choice of duplex sc or st ? receptacles ? wave solder and aqueous wash process compatible ? manufactured in an iso 9002 certified facility ? 820 nm and 1300 nm led based transceivers applications ? multimode fiber backbone links ? multimode fiber wiring closet to desktop links description the hfbr-5106 and hfbr-5107 series transceivers from agilent technologies provide system designers with products to implement a range of multimode fiber 100vg-anylan physical layer solutions. the transceivers are all supplied in the new industry standard 1x9 sip package style with a choice of duplex sc or st ? connector interface. hfbr-5106/5106t 1300 nm hfbr-5107/5107t 820 nm 100vg-anylan backbone links the hfbr-5106/-5106t are 1300 nm products with optical performance compliant with the 100vg-anylan pmd developed by ieee 802.12. these transceivers are suitable for link lengths up to 2 km. alternative 800 nm, lower cost 500 m desktop links the hfbr-5107 is a lower cost 800 nm alternative to the hfbr- 5106 for 100vg-anylan links from the wiring closet to the desktop. it complies with the performance requirements of 802.12 as implemented by agilent at 800 nm wavelength. this transceiver will transfer the full range of 100vg-anylan signals at the required 1x10 C8 bit error rate over distances up to 500 meters using 62.5/125 m m multimode fiber cables. this product is intended for use in cost sensitive applications where the benefits of fiber optic links are important. transmitter sections the transmitter sections of the hfbr-5106 utilize 1300 nm surface emitting ingaasp leds and the hfbr-5107 uses a low cost 820 nm algaas led. these leds are packaged in the optical subassembly portion of the transmitter section. they are driven by a custom silicon ic which converts differential pecl logic signals, ecl referenced (shifted) to a +5 volt supply, into an analog led drive current. receiver sections the receiver section of the hfbr-5106 utilizes ingaas pin photodiodes coupled to a custom silicon transimpedance preampli- fier ic. the hfbr-5107 series uses the same preamplifier ic in conjunction with an inexpensive silicon pin photodiode. these are packaged in the optical subassembly portion of the receiver.
2 data out signal detect out data in electrical subassembly quantizer ic driver ic top view pin photodiode duplex sc receptacle optical subassemblies led preamp ic differential single-ended differential figure 1. block diagram. these pln/preamplifier combina- tions are coupled to a custom quantizer ic which provides the final pulse shaping for the logic output and signal detect function. the data output is differential. the signal detect output is single-ended. both data and signal detect outputs are pecl compatible, ecl referenced (shifted) to a +5 volt power supply. package the overall package concept for the agilent transceivers consists of the following basic elements; two optical subassemblies, an electrical subassembly, and the housing with integral duplex sc connector receptacles. this is illustrated in figure 1. the package outline and pinout are shown in figures 2 and 3. the details of this package outline and pinout are compliant with the multisource definition of the 1x9 sip. the low profile of the agilent transceiver design complies with the maximum height allowed for the duplex sc connector over the entire length of the package. the optical subassemblies utilize a high volume process together with low cost lens elements which result in a cost effective transceiver. the electrical subassembly con- sists of a high volume multi-layer printed circuit board on which the ic chips and various surface mount passive circuit elements are attached. the package includes internal shields for the electrical and optical subassemblies to ensure low emi and high immunity to electromagnetic fields. the outer housing, including the duplex sc connector receptacle, is molded of filled non-conductive plastic to provide mechanical strength and electrical isolation. the solder posts of the agilent design are isolated from the circuit design of the transceiver and do not require connection to a ground plane on the circuit board. the transceiver is attached to a printed circuit board with the nine signal pins and the two solder posts which exit the bottom of the housing. the two solder posts provide the primary mechanical strength to withstand the loads imposed on the duplex or simplex sc connectored fiber cables. application information the application engineering group in the agilent optical communications division is available to assist you with the technical understanding and design trade-offs associated with these transceivers. you can contact them through your hewlett-packard sales representative. the following information is provided to answer some of the most common questions about the use of these parts. transceiver optical power budget versus link length optical power budget (opb) is the available optical power for a fiber optic link to accommodate fiber cable losses plus losses due to inline connectors, splices, optical switches, and to provide margin for link aging and unplanned losses due to cable plant reconfiguration or repair. figure 4 illustrates the predicted opb associated with the two transceivers specified in this data sheet at the beginning of life (bol). these curves represent the attenuation and chromatic plus modal dispersion losses associated with the 62.5/125 m m and 50/125 m m fiber cables only. the area under the curve repre- sents the remaining opb at any link length, which is available for overcoming non-fiber cable related losses. agilent led technology has produced 800 nm led and 1300 nm led devices with lower aging characteristics than normally 3 figure 1a. st block diagram. figure 2. package outline drawing. data out signal detect out data in electrical subassembly quantizer ic driver ic top view pin photodiode duplex st receptacle optical subassemblies led preamp ic differential single-ended differential 39.12 (1.540) max. area reserved for process plug 12.70 (0.500) 25.40 (1.000) max. 12.70 (0.500) 10.35 (0.407) max. + 0.25 - 0.05 + 0.010 - 0.002 3.30 ?0.38 (0.130 ?0.015) hfbr-510x date code (yyww) country of origin 2.92 (0.115) 18.52 (0.729) 4.14 (0.163) 20.32 (0.800) [8x(2.54/.100)] 23.55 (0.927) 16.70 (0.657) 17.32 (0.682) 20.32 (0.800) 23.32 (0.918) 0.46 (0.018) note 1 (9x) note 1 0.87 (0.034) 23.24 (0.915) 15.88 (0.625) note 1: the solder posts and electrical pins are phosphor bronze with tin lead over nickel plating. dimensions are in millimeters (inches). 1.27 ( 0.050 + 0.08 - 0.05 + 0.003 - 0.002 0.75 ( 0.030 ) ) 4 figure 2a. st package outline drawing. figure 3. pin out diagram. 1 = v ee 2 = rd 3 = rd 4 = sd 5 = v cc 6 = v cc 7 = td 8 = td 9 = v ee top view n/c n/c 25.4 (1.000) max. 24.8 (0.976) 42 (1.654) max. 5.99 (0.236) 12.7 (0.500) 12.0 (0.471) max. 0.5 (0.020) 3.3 ?0.38 (0.130) (?0.015) + 0.08 - 0.05 + 0.003 - 0.002 + 0.25 - 0.05 + 0.010 - 0.002 20.32 ?0.38 (?0.015) hfbr-510xt date code (yyww) country of origin 3.2 (0.126) 2.6 (0.102) f 22.86 (0.900) 20.32 (0.800) [(8x (2.54/0.100)] 17.4 (0.685) 21.4 (0.843) 20.32 (0.800) 3.6 (0.142) 1.3 (0.051) 23.38 (0.921) 18.62 (0.733) note 1: phosphor bronze is the base material for the posts & pins with tin lead over nickel plating. dimensions in millimeters (inches). ( ( ( ( 0.46 (0.022) note 1 f 5 optical power budget (db) 4.0 14 0 fiber optic cable length (km) 0.5 1.5 2.0 2.5 12 10 8 6 4 3.5 2 1.0 3.0 0.15 hfbr-5106, 62.5/125 ? hfbr-5106, 50/125 ? hfbr-5107, 50/125 ? hfbr-5107, 62.5/125 ? figure 4. optical power budget at bol vs. fiber optic cable length. associated with these technologies in the industry. the industry convention is 3 db aging for 800 nm and 1.5 db for 1300 nm leds. the agilent leds will normally experience less than 1 db of aging over normal com- mercial equipment mission life periods. contact your agilent sales representatives for additional details. figure 4 was generated with an agilent fiber optic link module containing the current industry conventions for fiber cable specifications and the 100vg- anylan optical parameters. these parameters are reflected in the guaranteed performance of the transceiver specifications in this data sheet. this same model has been used extensively in the ansi x3t and ieee committees, including the ansi x3t12 committee, to establish the optical performance requirements for various fiber optic interface standards. the cable parameters used come from the iso/iec jtci/sc 25/wg3 generic cabling for customer premises per dis 11801 document and the eia/ tia568-a commercial building telecommunications cabling standard per sp-2840. transceiver signaling operating rate range and ber performance for purposes of definition, the symbol (baud) rate, also called signaling rate, is the reciprocal of the shortest symbol time. data rate (bits/sec) is the symbol rate divided by the encoding factor used to encode the data (symbols/bit). when used in 100vg anylan 100 mbps applications, the performance of the 1300 nm transceiver is guaranteed over the signaling rate of 10 mbd to 120 mbd to the full conditions listed in the individual product specification tables. the transceivers may be used for other applications at signaling rates outside of the 10 mbd to 120 mbd range with some penalty in the link optical power budget primarily caused by a reduction of receiver sensitivity. figure 5 gives an indication of the typical performance of these 1300 nm products at different rates. these transceivers can also be used for applications which require different bit error rate (ber) performance. figure 6 illustrates the typical trade-off between link ber and the receivers input optical power level. table 1 lists the hub control signals defined in ieee 802.12, section 18.5.4.1. these signal rates are below 10 mbd but they are transported with adequate accuracy for hub access control. transceiver jitter performance the agilent 1300 nm transceivers are designed to operate per the system interface jitter specifications listed in table 27 of section 18.9. of the ieee 802.12 (100vg-anylan standards). figure 5. transceiver relative optical power budget at constant ber vs. signaling rate. figure 6. bit error rate vs. relative receiver input optical power. transceiver relative optical power budget at constant ber (db) 0 200 3.0 0 signal rate (mbd) 25 75 100 125 2.5 2.0 1.5 1.0 175 0.5 50 150 conditions: 1. prbs 2 7 -1 2. data sampled at center of data symbol. 3. ber = 10 -6 4. t a = 25?c 5. v cc = 5 v dc 6. input optical rise/fall times = 1.0/2.1 ns. bit error rate -6 4 1 x 10 -2 relative input optical power ?db -4 2 -2 0 1 x 10 -4 1 x 10 -6 1 x 10 -8 2.5 x 10 -10 1 x 10 -11 hfbr-510x conditions: 1. 125 mbd 2. prbs 2 7 -1 3. center of symbol sampling. 4. t a = 25?c 5. v cc = 5 v dc 6. input optical rise/fall times = 1.0/2.1 ns. center of symbol 1 x 10 -12 1 x 10 -7 1 x 10 -5 1 x 10 -3 6 no internal connection no internal connection hfbr-510x top view v ee rd rd sd v cc v cc td td v ee 123456789 c1 c2 l1 l2 r2 r3 r1 r4 c5 c3 c4 r9 r10 v cc filter at v cc pins transceiver r5 r7 r6 r8 c6 rd rd sd v cc td td termination at phy device inputs notes: the split-load terminations for ecl signals need to be located at the input of devices receiving those ecl signals. recommend 4-layer printed circuit board with 50 ohm microstrip signal paths be used. termination at transceiver inputs r1 = r4 = r6 = r8 = r10 = 130 ohms. r2 = r3 = r5 = r7 = r9 = 82 ohms. c1 = c2 = c3 = c5 = c6 = 0.1 ?. c4 = 10 ?. l1 = l2 = 1 ? coil or ferrite inductor. rx rx tx tx v cc v cc figure 7. recommended decoupling and termination circuits. the agilent 1300 nm transmitters are allowed to generate the worst case active output jitter shown in table 27 of section 18.9 when driven by circuits optimized for these link applications. the active output specifications of the 100vg-anylan standard are met by the hfbr-5106. the agilent 1300 nm receivers tolerate the worst case input optical response time and systematic jitter shown in table 27 of section 18.9. the active input specification of the ieee 802.12 100vg-anylan standard are met by the hbfr-5106. the jitter specifications stated in the 1300 nm transceiver specification tables are derived from the values in table 27 of section 18.9 of the ieee 802.12 specification. they represent the worst case jitter contributions from the transceiver meeting the overall system jitter in annex e. in practice the typical jitter contribution of the agilent transceivers is well below these maximum allowed values. recommended handling precautions it is advised that normal static precautions be taken in the handling and assembly of these transceivers to prevent damage which may be induced by electrostatic discharge (esd). the hfbr-510x series of transceivers are certified as mil-std-883c method 3015.4 class 1 products. care should be used to avoid shorting the receiver data or signal detect outputs directly to ground without proper current limiting impedance. solder and wash process compatibility the transceivers are delivered with a protective process plug inserted into the duplex sc connector receptacle. this process plug protects the optical subassemblies during wave solder and aqueous wash processing and acts as a dust cover during shipping. these transceivers are compatible with either industry standard wave or hand soldering processes. shipping container the transceiver is packaged in a shipping container designed to protect it from mechanical and esd damage during shipment or storage. board layout C decoupling circuit and ground planes it is important to take care in the layout of your circuit board to achieve optimum performance from these transceivers. figure 7 provides a good example of a schematic for a power supply decoupling circuit that works 7 regulatory compliance table feature test method performance electrostatic discharge mil-std-883c certified to class 1 (0 to 1999 volts) withstand up (esd) to the electrical pins method 3015.4 to 1800 v applied between electrical pins. electrostatic discharge variation of typically withstand at least 25 kv without damage (esd) to the duplex sc iec 801-2 when the duplex sc connector receptacle receptacle is contacted by a human body model probe. electromagnetic fcc class b typically provide a 10 db margin to the noted interference (emc) cenelec cen55022 standard limits when tested at a certified test range class b (cispr 22b) with the transceiver mounted to a circuit card vcci class 2 without a chassis enclosure. immunity v ariation of iec 801-3 typically show no measurable effect from a 10 v/m field swept from 10 to 450 mhz applied to the transceiver when mounted to a circuit card without a chassis enclosure. well. it is further recommended that a contiguous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. this recommendation is in keeping with good high frequency board layout practices. board layout C hole pattern this agilent transceiver complies with the circuit board common transceiver footprint hole pattern defined in the original multisource announcement which defined the 1x9 package style. this drawing is reproduced in figure 8 with the addition of ansi y14.5n compliant dimensioning to be used as a guide in the mechanical layout of your circuit board. board layout C art work the applications engineering group has developed gerber file artwork for a multilayered printed circuit board layout incorporating the above recommendations. contact your local agilent sales representative for details. board layout C mechanical for applications providing a choice of either a duplex sc or a duplex st connector interface, while utilizing the same pinout on the printed circuit board, the st port needs to protrude from the chassis panel a minimum of 9.53 mm for sufficient clearance to install the st connector. please refer to figure 8a for a mechanical layout detailing the recommended location of the duplex sc and duplex st transceiver packages in relation to the chassis panel. regulatory compliance these transceiver products are intended to enable commercial system designers to develop equipment that complies with the various international regulations governing certification of infor- mation technology equipment. see the regulatory compliance table for details. additional information is available from your agilent sales representative. electrostatic discharge (esd) there are two design cases in which immunity to esd damage is important. the first case is during handling of the transceiver prior to mounting it on the circuit board. it is important to use normal esd handling precautions for esd sensitive devices. these precau- tions include using grounded wrist straps, work benches, and floor mats in esd controlled areas. the second case is static discharges to the exterior of the equipment chassis containing the transceiver parts. to the extent that the duplex sc connector is exposed to the outside of the equipment chassis it may be subject to whatever esd system level test criteria that the equip- ment is intended to meet. 8 figure 8. recommended board layout hole pattern. figure 8a. recommended common mechanical layout for sc and st 1x9 connectored transceivers. (8x) 2.54 .100 20.32 .800 20.32 .800 1.9 ?0.1 .075 ?.004 (2x) 0.000 ma 0.8 ?0.1 .032 ?.004 (9x) 0.000 ma ? top view 25.4 42.0 24.8 9.53 (note 1) 39.12 6.79 25.4 12.09 11.1 0.75 12.0 0.51 note 1: minimum distance from front of connector to the panel face. 9 electromagnetic interference (emi) most equipment designs utilizing these high speed transceivers from agilent will be required to meet the requirements of fcc in the united states, cenelec en55022 (cispr 22) in europe and vcci in japan. these devices are suitable for use in designs ranging from a desktop computer with a single transceiver to a concentrator or switch product with a large number of transceivers. immunity equipment utilizing these transceivers will be subject to radio frequency electromagnetic fields in some environments. these transceivers have a high immunity to such fields. transceiver reliability and performance qualification data the 1x9 transceivers have passed agilent reliability and performance qualification testing and are undergoing quality monitoring. details are available from your agilent sales representative. these transceivers are manufactured at the agilent singapore location which is an iso 9002 certified facility. ordering information the hfbr-5106 and hfbr-5106t 1300 nm products and hfbr-5107 and hfbr-5107t 820 nm devices are available for production orders through the agilent component field sales offices and authorized distributors worldwide. applications support material contact your local agilent component field sales office for information on how to obtain pcb layouts, test boards, and demo boards for the 1x9 transceivers. accessory duplex sc connectored cable assemblies agilent also offers two compatible duplex sc connec- tored jumper cable assemblies to assist you in the evaluation of these transceiver products. these cables may be purchased from agilent with the following part numbers. they are available through the agilent component field sales offices and authorized distributors worldwide. 1. hfbr-bkd001 C a duplex cable 1 meter long assembled with 62.5/125 m m fiber and duplex sc connector plugs on either end. 2. hfbr-bkd010 C a duplex cable 10 meters long assembled with 62.5/125 m m fiber and duplex sc connector plugs on either end. table 1. control signal generation the agilent transceivers are capable of transporting the following five control signals defined in ieee 802.12, section 18.5.4.1. control signal nrz encoded pattern frequency control signal 1 (cs1) 10 figure 10. -45 db time pm pm +4 db high_light low_light average optical power at al (dbm) 100 ? valid ieee 802.12 optical signals -45 db time pm pm +4 db high_light low_light average optical power at al (dbm) 350 ? valid ieee 802.12 optical signals 1 ? 11 recommended operating conditions parameter symbol min. typ. max. unit reference ambient operating temperature t a 070 c supply voltage v cc 4.75 5.25 v data input voltage - low v il - v cc C1.810 C1.475 v data input voltage - high v ih - v cc C1.165 C0.880 v data and signal detect output load r l 50 w note 2 transmitter electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference supply current i cc 145 185 ma note 3 power dissipation p diss 0.76 0.97 w data input current - low i il -350 0 m a data input current - high i ih 14 350 m a receiver electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference supply current i cc 102 145 ma note 4 power dissipation p diss 0.3 0.5 w note 5 data output voltage - low v ol - v cc C1.840 C1.620 v note 6 data output voltage - high v oh - v cc C1.045 C0.880 v note 6 data output rise time t r 0.35 2.2 ns note 7 data output fall time t f 0.35 2.2 ns note 7 signal detect output voltage - low v ol - v cc C1.840 C1.620 v note 6 signal detect output voltage - high v oh - v cc C1.045 C0.880 v note 6 signal detect output rise time t r 0.35 2.2 ns note 7 signal detect output fall time t f 0.35 2.2 ns note 7 hfbr-5106, -5107 series absolute maximum ratings parameter symbol min. typ. max. unit reference storage temperature t s C40 100 c lead soldering temperature t sold 260 c lead soldering time t sold 10 sec. supply voltage v cc C0.5 7.0 v data input voltage v i C0.5 v cc v differential input voltage v d 1.4 v note 1 output current i o 50 ma 12 hfbr-5106/5106t receiver optical and electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference input optical power p in min. (w) C29 dbm avg. note 16 minimum at window edge figure 9 input optical power p in min. (c) C33.5 dbm avg. note 17 minimum at eye center figure 9 input optical power maximum p in max. C14 dbm avg. note 16 operating wavelength l 1270 1380 nm systematic jitter contributed sj 1.4 ns p-p note 23 by the receiver random jitter contributed rj 2.90 ns p-p note 24 by the receiver signal detect - asserted p a p d + 1.5 db C31 dbm avg. note 18, 19 (high_light) figure 10 signal detect - deasserted p d C45 dbm avg. note 21, 22 (lo_light) figure 10 signal detect - hysteresis p a C p d 1.5 db figure 10 signal detect assert time as_max 0 100 m s note 8, 19 (off to on) figure 10 signal detect deassert time ans_max 0 350 m s note 21, 22 (off to on) figure 10 control signal detect cs1-5 C14 C29 dbm avg. see table 1 hfbr-5106/5106t transmitter optical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference output optical power p o -21.0 -14 dbm avg. note 9 62.5/125 m m, na = 0.275 fiber bol output optical power p o -24.8 -14 dbm avg. note 9 50/125 m m, na = 0.20 fiber bol output optical power at p o (0) -45 dbm avg. note 11 logic 0 state center wavelength l c 1270 1380 nm note 12 spectral width - fwhm dl 200 nm note 12 optical rise time t r 3.0 ns note 12, 13 optical fall time t f 3.0 ns note 12, 13 systematic jitter contributed by the sj 1.2 ns p-p note 23 transmitter random jitter contributed by the rj 0.69 ns p-p note 15 transmitter 13 hfbr-5107/5107t receiver optical and electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference input optical power p in min. (w) C27.5 dbm avg. note 16a minimum at window edge input optical power p in min. (c) C28 dbm avg. note 17a minimum at eye center input optical power maximum p in max. C12 dbm avg. note 16a operating wavelength l 800 900 nm systematic jitter contributed sj 1.2 ns p-p note 23 by the receiver random jitter contributed rj 2.6 ns p-p note 24 by the receiver signal detect - asserted p a p d + 1.5 db C29.5 dbm avg. note 18 figure 10 signal detect - deasserted p d C45 dbm avg. note 21 figure 10 signal detect - hysteresis p a C p d 1.5 db figure 10 signal detect assert time as_max 0 100 m s note 18 (off to on) figure 10 signal detect deassert time ans_max 0 350 m s note 21 (off to on) figure 10 control signal detect cs1-5 C14 C27.5 dbm avg. see table 1 hfbr-5107/5107t transmitter optical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference output optical power p o C17.0 C12 dbm avg. note 10 62.5/125 m m, na = 0.275 fiber bol output optical power p o C20.8 C12 dbm avg. note 10 50/125 m m, na = 0.20 fiber bol output optical power at p o (0) C45 dbm avg. note 11 logic 0 state center wavelength l c 800 900 nm note 12 spectral width - fwhm dl 100 nm note 12 optical rise time t r 4.5 ns note 12, 14 optical fall time t f 4.5 ns note 12, 14 systematic jitter contributed by the sj 1.7 ns p-p note 23 transmitter random jitter contributed by the rj 0.69 ns p-p note 24 transmitter 14 notes: 1. this is the maximum voltage that can be applied across the differential transmitter data inputs to prevent damage to the input esd protection circuit. 2. the outputs are terminated with 50 w connected to v cc C2 v. 3. the power supply current needed to operate the transmitter is supplied to differential ecl circuitry. this circuitry maintains a nearly constant current from the power supply. constant current operation helps to prevent unwanted electrical noise from being generated and conducted or emitted to neighboring circuitry. 4. this value is measured with the outputs terminated into 50 w connected to v cc C2 v and an input optical power level of C14 dbm average. 5. the power dissipation value is the power dissipated in the receiver itself. power dissipation is calculated as the sum of the products of supply voltage and currents, minus the sum of the products of the output voltages and currents. 6. this value is measured with respect to v cc with the output terminated into 50 w connected to v cc C2 v. 7. the output electrical rise and fall times are measured between 20% and 80% levels with the output connected to v cc C2 v through 50 w . 8. random jitter contributed by the receiver is specified with a 120 mbd (60 mhz square-wave) input signal. the input optical power level is at maximum "p in min . (w)". 9. these optical power values are measured with the following conditions: ? at the beginning of life (bol). the actual fddi specification is 1.5 db lower power at the end of life for the equipment. the definition of beginning of life (bol) to the end of live (eol) optical power degradation is assumed to be 1.0 db per the industry convention for 1300 nm leds. the actual degradation observed in normal commercial environments is considerably less than this amount with hewlett-packards 1300 nm led products. ? at the end of one meter of noted fiber with cladding modes removed. ? over the specified operating voltage and temperature ranges. ? (12.5 mhz square-wave) input signal. the average power value can be converted to a peak power value by adding 3 db. higher output optical power transmitters are available upon special request. 10. the same comments of note 9 apply except that industry convention for 800 nm led bol to eol aging is 3 db. this value for output optical power provides a minimum of 7.5 db optical power budget at the eol, which provides at least 500 meter link lengths with margin left over for overcoming normal passive losses, such as in-line connectors in the cable plant. the actual degradation observed in normal commercial environments is considerably less than this amount with hewlett-packard 800 nm led products. 11. the transmitter provides compliance with 802.12. an output optical power level of www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies, inc. 5965-7785e (11/99) |
Price & Availability of HFBR5106T
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |