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TDF series chip dielectric filters ?? ?.???? (unit:mm) selection guide for standard devices ? the part numbers shown in the table below are standard devices, which are readily available. toko will design and manufacture modified and custom devices with specific characteristics to meet your requirements. if you do not find the device for your application in this catalog, please contact our sales or representative office. ? rohs compliant ? <gw t?b
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a^mh`?bwpzsl7w;mt&b??7u_p?sm ?xzpt? t ?hxeg3t]wxi^m{ ? 3p)4|?0 typical characteristics e ?
q? 1.25max. ka 2.4 2.1 out in gnd 0.5 2.0 1.4 0 5 10 15 20 25 30 35 40 45 50 return loss (db) 0 10 20 30 40 50 60 70 80 90 100 attenuation (db) center frequency :5,250mhz TDFu2a-5250x-10a attenuation return loss span :4,000mhz
a ?? TDFu2a-5250x-10a TDF series for wireless lan ? z???e????*oqvu0vuqvujnqfebodf
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: ??? toko center bandwidth insertion v.s.w.r. selectivity dimension (mm) part frequency loss in bw application pcs/reel number (mhz) (mhz) (db) max. max. (db) min. (mhz) w l t (max.) TDF2a-2450t-10a 2450.0 fo 50.0 2.00 2.00 20, 16 (fo ? 280, + 280) 5.7 5.1 2.25 2.4g-lan 2000 TDFm1a-2450t-10a 2450.0 fo 50.0 2.00 2.00 20, 16 (fo ? 280, fo + 280) 4.5 5.2 2.0 2.4g-lan 2000 TDFm1b-2450t-10a 2450.0 fo 50.0 2.30 2.00 35, 30 (fo ? 430, + 350) 6.5 5.1 2.0 2.4g-lan 1500 TDFm1c-2450t-10a 2450.0 fo 50.0 3.00 2.00 21, 32 (fo 150, ? 200) 9.0 5.15 2.0 2.4g-lan 1500 TDFs8a-2450t-13a 2450.0 fo 50.0 2.00 2.00 40 (fo ? 500) 3.2 3.0 1.8 2.4g-lan 2000 TDFu2a-2450t-10a 2450.0 fo 50.0 1.50 2.00 30 (1910~1990) 2.0 2.85 1.25 2.4g-lan 3000 TDF2a-2484e-11a 2484.0 fo 13.0 3.00 1.60 35, 30 (fo 350, 700) 5.7 5.1 2.25 2.4g-lan 2000 TDF2a-2484e-12a 2484.0 fo 13.0 2.00 1.60 25, 30 (fo 350, 700) 5.7 5.1 2.25 2.4g-lan 2000 TDFm1a-2484e-10a 2484.0 fo 13.0 2.00 2.00 25, 30 (fo 350, 700) 4.5 5.1 2.0 2.4g-lan 2000 TDFm1a-2484e-11a 2484.0 fo 13.0 3.00 2.00 35, 30 (fo 350, 700) 4.5 5.2 2.0 2.4g-lan 2000 TDFm1b-2546s-10a 2546.0 fo 46.5 1.80 2.00 44, 40 (fo 412.4, 868.5) 6.5 4.05 1.90 mmds 2000 TDFm1b-2639s-10a 2639.5 fo 46.5 1.50 2.00 33, 35 (fo 410.5, 866.5) 6.5 4.75 1.90 mmds 2000 TDFs1c-3449t-10a 3449.75 fo 50.25 1.50 2.00 40, 45 (fo ? 862, ? 406) 6.5 4.4 2.0 wi max 2000 TDFm2a-3549t-10a 3549.75 fo 50.25 1.40 2.00 31, 33 (fo ? 882, ? 406) 4.5 4.5 2.25 wi max 2000 TDFs1f-3960z-10a 3960.0 fo 792 1.80 2.00 40, 30 (fo ? 1460, fo + 1190) 8.5 3.5 1.9 uwb 2000 TDFs1f-4050z-10a-01 4050.0 fo 750 1.80 2.00 40,30 (fo ? 1550, fo + 1100) 8.5 3.4 1.9 uwb 2000 TDFm2a-4995x-10a-01 4995.0 fo 95.5 1.50 2.00 20 (fo ? 795) 4.5 3.3 2.25 5g-lan 2000 TDFm2c-4995x-10a 4995.0 fo 95.5 3.10 2.00 35, 50 (fo ? 560, fo + 560) 9.0 3.3 2.25 5g-lan 2000 TDFs8a-5075z-10a 5075.0 fo 175.0 1.25 2.00 20 (4200) 3.75 3.25 1.8 5g-lan 2000 TDFu2a-5125z-10a 5125.0 fo 100.0 1.30 2.00 35 (3800) 2.4 2.15 1.25 5g-lan 3000 TDFm2a-5250x-10a 5250.0 fo 100.0 1.50 2.00 20 (fo ? 800) 4.5 3.2 2.25 5g-lan 2000 TDFm2c-5250x-10a 5250.0 fo 100.0 3.00 2.00 35 (fo ? 400) 9.0 3.1 2.25 5g-lan 2000 TDFs8a-5250x-10a 5250.0 fo 100.0 1.50 2.00 20 (fo ? 800) 3.2 3.2 1.8 5g-lan 2000 TDFu2a-5250x-10a 5250.0 fo 100.0 1.30 2.00 30 (fo ? 1710) 2.4 2.1 1.25 5g-lan 3000 TDFs8b-5375z-10a 5375.0 fo 475.0 1.20 2.00 22 (fo ? 1475, fo + 2025) 4.5 3.0 1.7 5g-lan 2000 TDFs8a-5437z-10a 5437.5 fo 287.5 1.20 2.00 25 (fo ? 1937) 3.2 3.05 1.7 5g-lan 2000 TDFs8a-5500z-10a 5500.0 fo 350.0 1.00 2.00 25 ( 3500 ) 3.2 3.05 1.8 5g-lan 2000 TDFm2a-5775t-10a-01 5775.0 fo 50.0 3.30 2.70 28 (5225.0~5325.0) 4.5 2.9 2.25 5g-lan 2000 TDFm2a-5775v-11a 5775.0 fo 75.0 1.50 2.00 7 (fo ? 425) 4.5 2.9 2.25 5g-lan 2000
TDF series chip dielectric filters ?? ?.???? typical characteristics e ?
q? 3.0 1.3 54a 3.2 2.4 3.2 1.8 0.7 0.6 0.575 0.575 0.6 0.7 1.7max. out in g 0 5 10 15 20 25 30 35 40 45 50 return loss (db) 0 10 20 30 40 50 60 70 80 90 100 attenuation (db) center frequency :5,437.5mhz span :6,000mhz TDFs8a-5437z-10a attenuation return loss
a ?? TDFs8a-5437z-10a (unit: mm) typical characteristics e ?
q? 6.5 1.2 1.2 1.2 2.0max. 5.7 3.2 0.8 5.1 1.0 1.2 2.5 4.25 out in g g g g g b2450-10 toko
a ?? TDFm1b-2450t-10a (unit: mm) attenuation (db) return loss (db) TDFm1b-2450t-10a attenuation return loss center frequency : 2,450mhz span : 1,000mhz typical characteristics e ?
q? ea 2.0 2.85 1.25max. out in gnd 0.6 1.5 0.9 1.2 0 5 10 15 20 25 30 35 40 45 50 return loss (db) 0 10 20 30 40 50 60 70 80 90 100 attenuation (db) center frequency :2,450mhz span :2,000mhz TDFu2a-2450x-10a attenuation return loss
a ?? TDFu2a-2450t-10a (unit: mm)
TDF series chip dielectric filters ?? ?.???? part numbering system / ? j?
r dimensions / ?
go 3 a e 10 bandwidth code / a3? ??? center frequency / *t
: profile code / y??? toko's type name / f?
a ? specification code / ?7 #poles /
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:" # $ TDFm 1907 TDFs type 2 poles 3 poles 4 poles TDFm type TDF type TDFh type t1 2.25 max. 2.0 max. 1.8 max. t2 2.8 max. 2.25 max. 2.0 max. t3 3.0 max. 2.25 max. 2.0 max. t4 5.5 max. 4.0 max. ? the length, l, is different depending on the part number. refer to the separate table. ?^ -
x ? j?t?s??b{ ? for the details of shapes regarding individual part numbers, contact us separately x ? jtb? yw ?itmv?`oxzmsem?d<^m{ t1 3.2 l l l l l l l l l l l l 4.5 4.5 5.7 8.5 11.5 6.5 9.0 6.5 t1 t1 t2 yyyyyyyyyyyyyy t2 t2 t3 t3 t3 5.7 8.5 11.5 t4 t4 t4 unit:mm a p solder plate less / z?x?i?lv taping / a?e??
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* ?x?i ?z e 1. reflow solder conditions ?solderability when flux-mounted terminals are immersed in solder at following conditions, at least 95% of the surface should be covered by solder. conditins leaded process : 2305c for 30.5 seconds lead free process : 2605c for 30.5 seconds ?solder heat resistance no abnomalities under solder conditions of leaded process : 2305c for 5 seconds lead free process : 2605c for 5 seconds 2. rinsing after soldering, you should rinsing away the excess flux. any commercially available rinsing agent may be used. 3. other precautions perform soldering at as low a temperature as possible and for as short a time as possible. make sure that the silver electrode of resonators is not covered by solder. avoid applying external forces to terminals such as by bending or cutting them. 4. iron soldering perform iron soldering with iron at following conditions. conditins leaded process : 3505c for 5s. max. lead free process : 3905c for 5s. max. ??x?i e ~ x?i ?z
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?9s??zc? ?ozs temperature profile (land seface temperature) 9s???? ( ??? ? ?9s ) * 1 * 2 * 3 * 4 ? 230 150 180 190 210 ? 260 150 180 220 240 * 1 * 2 * 3 * 4 for lead free process for leaded process pre-heat conditions '? ? * 1 150 ? 160 ?y 60s. max. * 1 150 ? 160 ?y 60 ?o reflow conditions ?? ? * 2 160 ? min. y 45s. max. * 2 160 ?? y 45 ?o * 3 200 ? min. y 30s. max. * 3 200 ?? y 30 ?o * 4 230 5 ?y 5s. max. * 4 230 5 ?y 5 ?o pre-heat conditions '? ? * 1 150 ? 180 ?y 120s. max. * 1 150 ? 180 ?y 120 ?o reflow conditions ?? ? * 2 180 ? min. y 150s. max. * 2 180 ?? y 150 ?o * 3 230 ? min. y 40s. max. * 3 230 ?? y 40 ?o * 4 255 5 ?y 5s. max. * 4 255 5 ?y 5 ?o

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