agilent hlmp-ldxx, -sdxx, -mdxx, -rlxx, -rdxx, -slxx high performance 4 mm oval led lamps reliability data sheet description the following cumulative test results have been obtained from testing performed at agilent technologies in accordance with the latest revisions of jis c 7021. agilent tests parts at the absolute maximum rated conditions recommended for the device. the actual performance you obtain from agilent parts depends on the electrical and environmental characteristics of your application but will probably be better than the performance outlined in table 1. failure rate prediction the failure rate of semiconductor devices is determined by the junction temperature of the device. the relationship between ambient temperature and actual junction temperature is given by the following: t j ( c) = t a ( c) + q ja p avg where t a = ambient temperature in c q ja = thermal resistance of junction-to-ambient in c/watt p avg = average power dissipated in watts the estimated mtbf and failure rate at temperatures lower than the actual stress temperature can be determined by using an arrhenius model for temperature acceleration. results of such calculations are shown in the table on the following page using an activation energy of 0.43 ev (reference mil-hdbk-217). table 1. life tests demonstrated performance stress test total units units failure rate colors conditions device hrs. tested failed mtbf (% /1k hours) ts/as alingap t a = 55 c, 224,000 224 0 224,000 0.446 red/amber i f = 30 ma ts/as alingap t a = -40 c, 56,000 56 0 56,000 1.785 red i f = 30 ma point typical performance
www.semiconductor.agilent.com data subject to change. copyright ? 2000 agilent technologies, inc. 5980-1750e (5/00) table 2. environmental tests mil-std-883 jis c 7021 units units test name reference reference test conditions tested failed temperature cycle 1010 method a-4 a/i, wave solder (250 c 10 c for 5 sec) 14,900 0 and tmcl (-40 c to 120 c; 15 min. dwell, 5 min. transfer) for 100 cycles air to air 1011 agilent req. -40/110 c at dwell, 15 min transfer, 112 0 thermal soaking 15 min. 5 ~ 10 sec (vdo), 200 cycles high humidity agilent req. agilent req. 85 c, 85% rh, 1000 hours 56 0 temperature operating life
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