smt chip fuse 3216lv subminiature surface mount fuses 125v ac/dc form no. 3216lv page 1 of 2 bif doc #3006 bussmann r rev. a sb98107 12-16-98 electrical characteristics current mark typical melting typical total typ. resistance typ. voltage rating appearing integral @ 50a clearing integral @ 2 10% rated drop @ rated part number (ampere) on part (a 2 * sec) @ 50a (a 2 * sec) current (ohms) current (volts) (xx=package code) ac dc ac dc xx/3216lv-250ma .250 .25 .00016 .000084 .00017 .0001 4.50 1.4 xx/3216lv-375ma .375 white dot .001 .0002 .0010 .0009 1.80 .73 xx/3216lv-500ma .500 0.5 .0014 .0019 .0016 .0026 1.15 .66 xx/3216lv-750ma .750 .75 .0033 .00095 .0033 .0042 .75 .63 xx/3216lv-1a 1 1 .020 .0084 .022 .0098 .52 .63 xx/3216lv-1.25a 1.25 white ? .035 .021 .038 .027 .40 .62 xx/3216lv-1.5a 1.5 1.5 .038 .024 .044 .033 .26 .49 general notes: 1. ac interrupting rating, melting integral and total clearing integral measured at 125v, unity power factor. 2. dc interrupting rating, melting integral and total clearing integral measured at 125v with a battery source. 3. voltage drop measured at 23 3? ambient temperature with the device mounted on a suitable circuit board trace. 4. it is recommended that fuses be mounted with ceramic (white) side facing up. 5. device designed to carry rated current for four hours minimum. an operating current of 80% or less of rated current is recommen ded, with further derating required at elevated ambient temperatures. 6. contact bussmann if higher ampere ratings are needed. catalog symbol: 3216lv voltage rating: 125v ac/dc interrupting rating: 50 amp ac/dc physical size: eia socm-3216ac (equivalent to 1206) 3.2 ? 1.6 ? 0.90mm 0.126 ? 0.063 ? 0.035 in. agency approvals: ul recognized, std. 248-14, file e19180, guide jdyx2 csa component acceptance, file 53787, class 1422-30 general information: bussmann smt chip fuses utilize thick and thin metal film technologies for superior fusing action and enhanced reliability. the fuse element is bonded to a ceramic substrate and encapsulated with glass, providing excellent short-circuit performance and environmental integrity. predicted reliability of the 3216lv chip fuse is 30 times greater than that of the typical chip capacitor (consult bussmann for details). substrate and coating thermal expansion coefficients are closely matched to that of fr-4 epoxy-glass circuit board for superior solder joint reliability. the end terminations are over-plated with nickel and tin-lead. 1.60 0.2 (0.063 0.008) 3.20 0.2 (0.126 0.008) 0.50 0.25 (0.020 0.010) .75 0.90 + 0.20, -0.15 (0.035 + 0.008, -0.006) 123 4 5 67 8 construction ce logo denotes compliance with european union low voltage directive (50-1000 vac, 75-1500 vdc). refer to bif document #8002 or contact bussmann application engineering at 314-527-1270 for more information. time-current characteristics: fast-acting fuse: will carry 100% of rated current for a mini- mum of 4 hours, and will open within 5 seconds at 250% of rated current. 1. ceramic substrate 2. glass cover 3. termination pad 4. metal film element 5. silver end termination 6. nickel barrier (5.1?0.2?) 7. 90/10 tin-lead plating (7.6?2.7 ?) 8. marking drawing is not to scale. packaging and ordering information: tape and reel: standard 8mm tape, in compliance with eia-rs481 (equivalent to iec 286, part 3). fuses are orientated in embossed pockets with ceramic side facing up to facilitate proper mounting (see electrical characteristics, general note 4). product rated current symbol package code tr = 3,000 pieces on tape on a 178mm reel. tr1 = 15,000 pieces on tape on a 330mm reel. sp = 50 pieces on tape in a plastic box. contact bussmann if other package quantities are required. 3216lv (see table) dimensions - mm (inches)
smt chip fuse 3216lv subminiature surface mount fuses 125v ac/dc form no. 3216lv page 2 of 2 bif doc #3006 bussmann the only controlled copy of this bif document is the electronic read-only version located on the bussmann network drive. all ot her copies of this bif document are by definition uncontrolled. this bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with de sign applications. bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. bussmann also reserves the rig ht to change or update, without notice, any technical information contained in this bulletin. once a product has been selected, it should be tested by the user in all possible applications. e p 2 p 0 p 1 a 0 d 0 f b 0 w 2.80 1.80 to 2.00 1.60 1.20 to 1.40 4.20 to 4.40 carrier dimensions - mm w 8.0 + 0.3 / -0.1 f 3.5 0.05 e 1.75 0.1 p 2 2.0 0.05 p 0 4.0 0.1 p 1 4.0 0.1 a 0 1.73 0.2 b 0 3.56 0.2 d 0 1.5 + 0.1 / -0.0 recommended land pattern - mm (inches) note: trace geometry may affect fuse performance (time-cur- rent characteristics 2 300% of rated current and voltage drop at rated current). current in amperes 10 1 .1 .01 .001 time in seconds 10 1 40 current rating .1 750ma 250ma 375ma 500ma 1a 1.25a 1.5a time-current characteristic curve (full size curves available) r environmental specifications operating temperature range: -65 to +125?, with proper derating. thermal shock: mil-std-202, method 107, test condition b (-65 to 125?), 1000 cycles, fuses soldered to fr-4 glass-epoxy circuit board. vibration: mil-std-202, method 204, test condition c (55 to 2000 hz, 10g). solderability: withstands 60 seconds above 200?, 260? maximum. moisture resistance: mil-std-202, method 106, 10 day cycle. solder leach resistance & terminal adhesion: eia-576 (30 seconds submersion in 260? tin-lead solder). rev. a sb98107 12-16-98
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