data sheet doc. no : qw0905- rev. : date : - 2008 04 - feb. a LH24943-PF LH24943-PF ligitek electronics co.,ltd. property of ligitek only pb lead-free parts super bright cylindrical type led lamps
page 1/5 LH24943-PF part no. ligitek electronics co.,ltd. property of ligitek only package dimensions directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 60 30 0 100% 50% 025%75% -30 -60 50% 75% 100% 25% + - 2.2 3.4 0.5 typ 25.0min 1.0min 2.54typ 1.0 max 3.5 2.95
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 40 -40 ~ +100 -40 ~ +85 ir 10 ratings h 60 15 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page 2/5 112 viewing angle 2 1/2 (deg) min. 1.2 20 min. 1.7 forward voltage @ ma(v) max. 2.6 peak wave length pnm 697 spectral halfwidth nm 90 typ. luminous intensity @10ma(mcd) 3 emitted red part no LH24943-PF material gap lens color water clear part no. LH24943-PF
1000 ligitek electronics co.,ltd. property of ligitek only 3.0 fig.2 relative intensity vs. forward current 1000 100 10 forward current(ma) 2.5 2.0 0.5 1.0 1.5 0.0 1.0 5.0 4.0 3.0 2.0 forward voltage(v) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a h chip 1000 10 1.0 1.0 0.1 f o r w a r d c u r r e n t ( m a ) 100 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage 3.0 2.0 1.0 1.5 2.5 fig.4 relative intensity vs. temperature 100 40 20 06080 0.0 100-40 020406080 ambient temperature( ) -20 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.5 1.2 1.1 0.9 1.0 0.8 -40-20 1.0 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) 900 800 700 wavelength (nm) 0.5 0.0 600 r e l a t i v e i n t e n s i t y @ 2 0 m a page3/5 part no. LH24943-PF
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 260 c3sec max 5 /sec max 260 120 temp( c) time(sec) 150 50 100 2 /sec max 25 0 preheat 0 page 4/5 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. LH24943-PF
the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. solderability test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. thermal shock test high temperature high humidity test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 5/5 page this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) high temperature storage test low temperature storage test operating life test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: test item test condition description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 reference standard ligitek electronics co.,ltd. property of ligitek only part no. LH24943-PF
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