? semiconductor components industries, llc, 2004 june, 2004 ? rev. 5 1 publication order number: BSP16t1/d BSP16t1 preferred device high voltage transistors pnp silicon features ? pb?free package is available maximum ratings rating symbol value unit collector-emitter voltage v ceo ?300 vdc collector-base voltage v cbo ?350 vdc emitter-base voltage v ebo ?6.0 vdc collector current i c ?1000 madc total device dissipation @ t a = 25 c (note 1) p d 1.5 w storage temperature range p d ?65 to +150 c junction temperature t j 150 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. thermal characteristics characteristic symbol max unit thermal resistance, junction?to?ambient r ja 83.3 c/w 1. device mounted on a glass epoxy printed circuit board 1.575 in x 1.575 in x 0.059 in; mounting pad for the collector lead min. 0.93 sq. in. device package shipping 2 ordering information BSP16t1 to?223 1000/tape & reel BSP16t1g to?223 case 318e style 1 marking diagram bt2 = specific device code d = date to?223 (pb?free) http://onsemi.com 2for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. collector 2,4 base 1 emitter 3 1 2 3 4 1000/tape & reel preferred devices are recommended choices for future use and best overall value. bt2d pnp silicon high voltage transistor surface mount
BSP16t1 http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min max unit off characteristics collector ?emitter breakdown voltage (i c = ?50 madc, i b = 0, l = 25 mh) v (br)ceo ?300 ? vdc collector ?base breakdown voltage (i c = ?100 adc, i e = 0) v (br)cbo ?300 ? vdc collector?emitter cutoff current (v ce = ?250 vdc, i b = 0) i ces ? ?50 adc collector?base cutoff current (v cb = ?280 vdc, i e = 0) i cbo ? ?1.0 adc emitter?base cutoff current (v eb = ?6.0 vdc, i c = 0) i ebo ? ?20 adc on characteristics dc current gain (v ce = ? 10 vdc, i c = ?50 madc) h fe 30 120 ? collector-emitter saturation voltage (i c = ? 50 madc, i b = ? 5.0 madc) v ce(sat) ? ?2.0 vdc dynamic characteristics current gain ? bandwidth product (v ce = ? 10 vdc, i c = ?10 madc, f = 30 mhz) f t 15 ? mhz collector?base capacitance (v cb = ? 10 vdc, i e = 0, f = 1.0 mhz) c obo ? 15 pf
BSP16t1 http://onsemi.com 3 package dimensions to?223 (to?261) case 318e?04 issue k 1.5 0.059 mm inches scale 6:1 3.8 0.15 2.0 0.079 6.3 0.248 2.3 0.091 2.3 0.091 2.0 0.079 style 1: pin 1. base 2. collector 3. emitter 4. collector h s f a b d g l 4 123 0.08 (0003) c m k j dim a min max min max millimeters 0.249 0.263 6.30 6.70 inches b 0.130 0.145 3.30 3.70 c 0.060 0.068 1.50 1.75 d 0.024 0.035 0.60 0.89 f 0.115 0.126 2.90 3.20 g 0.087 0.094 2.20 2.40 h 0.0008 0.0040 0.020 0.100 j 0.009 0.014 0.24 0.35 k 0.060 0.078 1.50 2.00 l 0.033 0.041 0.85 1.05 m 0 10 0 10 s 0.264 0.287 6.70 7.30 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
BSP16t1 http://onsemi.com 4 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 BSP16t1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
|
