www.vishay.com n1 VFC2512 vishay foil resistors document number: 63091 revision 14-nov-03 vishay foil ?france +33.4.93.37.28.24 fax: +33.4.93.37.27.31 ?germany +49.9287.710 fax: +49 9287.70435 ?israel +972.3.557.0945 fax: +972.3.558.9121 ?italy + 39.2.300.11919 fax: +39.2.300.11999 ?japan +81.3.5464.6411 fax: +81.3.5464.6433 ?singapore +65.788.6668 fax: +65.788.0988 ?sweden +46.8.594.70590 fax: +46.8.594.70581 ?uk +44 191 514 8237 fax: +44 1953 457 722 ?usa +1 610 407-4800 fax: +1 610 640-9081 features high precision: tolerance to 0.01% (see table 1) low temperature coefficient of resistance. nominal tcr: 0.5ppm/ c (- 55 c to + 125 c) resistance range: 10 ? to 100k ? load life stability: 0.01% maximum ? r under full rated power at + 70 c for 2000 hours shelf life stability: 50ppm/year (0.005%) maximum ? r non-hermetically sealed power rating at + 70 c: 750mw maximum weight: 35 mg voltage coefficient: < 0.00001%/volt (< 0.1ppm/v) current noise: < 0.01 v (rms)/volt of applied voltage non inductive: < 0.08 h table 1 - tolerance and tcr vs resistance value value standard maximum ? tolerance (%)* tcr** 100 ? to 100k ? 0.01 2.0ppm/ c 50 ? to < 100 ? 0.05 3.0ppm/ c 25 ? to < 50 ? 0.1 3.0ppm/ c 10 ? to < 25 ? 0.25 4.0ppm/ c test mil-prf-55342 VFC2512 characteristic e maximum ? r limits* ? r limits** temperature coefficient of 25ppm/ c see table 1 resistance thermal shock 0.10% 0.02% low temperature operation 0.10% 0.02% short time overload 0.10% 0.02% high temperature exposure 0.10% 0.03% resistance to bonding 0.20% 0.02% moisture resistance 0.20% 0.03% life 2000hrs at + 70 c 0.50% 0.01% table 2 - typical performance specifications notes: * as shown + 0.01 ? to allow for measurement error. **as shown + 0.01 ? to allow for measurement error for values less than 100 ? . high precision flip chip, patents pending (industrialized countries) * tighter tolerances are available. please contact vishay application engineering. **over mil range: (- 55 c to +125 c, + 25 c reference) the tcr for values < 100 ? are influenced by the termination composition and result in a deviation from this curve. VFC2512 is a precision surface mount flip chip resistor that utilizes ultra precision bulk metal ? ??foil (bmzf) for the resistive element. this product differs from other vishay bulk metal foil surface mount devices in as much as it is installed with the foil side facing the pcb. the foil element is isolated from the pcb by a protective overcoating. this overcoating plus the overall product design isolates the resistor from handling and installation stresses. the flip chip configuration is providing space saving on the pcb and is more economical for high volume, analog applications where high precision is required. the bmzf technology provides inherently an extremely low and predictable temperature coefficient of resistance (tcr), remarkable load life stability, low noise and availability of tight tolerance. the tcr is a process capability not a selection process and for most of the range is independant of ohmic value and lot varied relations. the tcr curve on fig.1 demonstrates the new revolutionary z foil with its tcr nominal of 0.5ppm/ c. a voltage divider can be fashioned by using two arbitrarily selected VFC2512s with a resultant tracking specification of < 3ppm/ c. extremely low tracking of < 1ppm/ c can be supplied upon request. the availability of tight absolute tolerance provides a good cost solution for the variability of other components when compiling the total error budget. bmzf offers the best stability available; and is an order of magnitude better than thin film technology. the noise generated by the resistor is non measurable and its design and construction make it well suited for high frequency applications. product may not be to scale z foil 0.5ppm/ c - 50 - 25 0 + 25 + 50 + 75 + 100 + 125 ? r r (ppm) ambient temperature ( c) + 150 + 100 + 50 0 - 50 - 100 - 150 - 200 - 55 figure 1 - nominal tcr z foil
document number: 63091 revision 14-nov-03 www.vishay.com n2 VFC2512 vishay foil resistors vishay foil ?france +33.4.93.37.28.24 fax: +33.4.93.37.27.31 ?germany +49.9287.710 fax: +49 9287.70435 ?israel +972.3.557.0945 fax: +972.3.558.9121 ?italy + 39.2.300.11919 fax: +39.2.300.11999 ?japan +81.3.5464.6411 fax: +81.3.5464.6433 ?singapore +65.788.6668 fax: +65.788.0988 ?sweden +46.8.594.70590 fax: +46.8.594.70581 ?uk +44 191 514 8237 fax: +44 1953 457 722 ?usa +1 610 407-4800 fax: +1 610 640-9081 l w d solder terminal (2) high purity alumina substrate resistive bulk metal foil solder protective coating figure 3 - chip configuration model chip size resistance value tolerance termination packaging vfc 2512 resistance letter multiplier t 0.01% b - solderable t = tape and range designator factor q 0.02% reel a 0.05% w = waffle pack 10 ? to <1k ? r x 1.0 b 0.1% example: 249r00 = 249 ? c 0.25% d 0.5% f 1.0% 1k to 100k k x 10 3 example: 10k000 = 10.0k ? table 3 - ordering information patent pending figure 2 - power derating curve bulk metal foil technology high precision flip chip, patent pending z gx bottom view (showing terminals for mounting): figure 4 - dimensions and land pattern in inches (millimeters) chip l w thickness d w1 z g x size 0.005 (0.13) 0.005 (0.13) maximum 0.003 (0.08) 0.003 (0.08) 0.003 (0.08) 0.003 (0.08) 0.003 (0.08) 0.250 0.125 0.025 0.024 0.123 0.250 0.196 0.126 2512 (6.35) (3.18) (0.64) (0.61) (3.12) (6.35) (4.98) (3.20) land pattern 125 100 75 50 25 0 -75 ?0 ?5 0 +25 +50 +75 +100 +125 +150 +175 ambient temperature ( c) percent of rated power ?5 c +70 c rated power w1 l - 0.003 (0.08)
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