high speed CDSU4148 features designed for mounting on small surface. extremely thin/leadless package. high mounting capability, strong surge withstand, high reliability. mechanical data case: 0603 (1608) standard package, molded plastic. t erminals: gold plated, solderable per mil-std-750, method 2026. polarity: indicated by cathode band. mounting position: any. weight: 0.003 gram (approximately) smd switching diode smd switching diode parameter repetitive peak reverse voltage reverse voltageaverage forward current forward current , surge peak power dissipation storage temperaturejunction temperature conditions symbol v rrm v r i o i fsm p d t stg t j min -40 -40 max 100 75 150 150 +125 +125 typ 4 1 unit v v ma a mw www.com chip.co m.tw c o m c h ip c o m c h ip maximum rating ( at t a = 25 c unless otherwise noted ) electrical characteristics ( at t a = 25 c unless otherwise noted ) c c tp=1us tp=1ms preliminary unit v na ua pf ns parameter forward voltage reverse current capacitance between terminals reverse recovery time conditions i f = 50 ma d c v r = 20 v v r = 75 v f = 1mhz, and 0 vdc reverse voltage i f = i r = 10 ma, r l =100 ohms, i rr = 1ma symbol v f i r c t trr min typ max 1.0 25 2.5 4 4 rds0301003-b 0.0 71( 1.8 0) 0.0 63( 1.6 0) 0.0 10( 0.2 5) ty p. 0.0 39( 1.0 0) 0.0 31( 0.8 0) 0.0 33 ( 0.8 5) 0.0 27 ( 0.7 0) dim en sio ns in in ch es an d ( mi llim ete r) 06 03 (1 60 8) 0.0 12 ( 0.3 0) ty p. 0.0 14( 0.3 5) ty p. (lead-free device)
rating and characteristic cur ves (CDSU4148) smd switching diode smd switching diode www.com chip.co m.tw c o m c h ip c o m c h ip f o r w a r d c u r r e n t ( m a ) reverse voltage (v) r e v e r s e c u r r e n t ( a ) 0.2 0.4 0.8 1.4 0 1.0 0.6 10 0n 0.1 n 10 00 10 1 00 1u 10 u 10 n 1n 1.2 1 0.1 0.0 1 0 10 90 10 0 20 30 40 50 60 70 80 1.8 1.6 reverse voltage : (v) c a p a c i t a n c e b e t w e e n t e r m i n a l s : ( p f ) 0 5 10 15 20 25 30 35 0 1.0 2.0 3.0 4.0 5.0 f=1mhz ta = 25 c ambient temperature ( c) forward voltage (v) a v e r a g e f o r w a r d c u r r e n t ( % ) - 2 5 c 7 5 c 1 2 5 c 2 5 c -25 c 25 c 75 c 125 c rds0301003-b 0 20 40 60 80 10 0 0 25 50 75 100 125 150 mounting on glass epoxy pcbs fig. 1 - forw ard cha racte ristic s fig. 2 - rev erse ch aract eristi cs fig. 4 - curre nt d erating curve fig. 3 - cap acita nce bet ween te rmina ls chara cteris tics
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