1 mechanical key switch (smd) b3fs surface-mounting switches ideal for high-density mounting tape packing style also available. allows reflow soldering. incorporates a snap-action contact mechanism that ensures sharp switching operations. ordering information model number legend b3fs- 12345 1. appearance 1: 6 mm x 6 mm 2. ground terminal 0: none 3. height 0: 3.1 mm 4. operating force (of) 0: 100 gf 2: 150 gf 5. shipment package ---: bag p: embossed tape list of models model plunger type operating force (of) bag (see note 1) embossed tape (see note 2) 6 x 6 mm b3fs-1000 series flat type standard model 0.98 n {100 gf} b3fs-1000 b3fs-1000p high-force 1.47 n {150 gf} B3FS-1002 B3FS-1002p note: 1. orders must be made in units of 100 pieces. 2. orders must be made in units of 3,000 pieces. for the packing style, refer to key switch packing on page 4.
b3fs b3fs 2 specifications ratings/characteristics switching capacity 50 ma, 24 vdc (resistive load) insulation voltage 30 vdc contact configuration spst-no contact material silver plating contact resistance 100 m w max. (initial value) (rated: 1 ma, 5 vdc) insulation resistance 100 m w min. (at 100 vdc) dielectric strength 250 v ac, 50/60 hz for 1 min bounce time 5 ms max. v ibration resistance malfunction: 10 to 55 hz, 1.5-mm double amplitude shock resistance destruction: 1,000 m/s 2 min. {approx. 100g min.} malfunction: 100 m/s 2 min. {approx. 10g min.} life expectancy standard models: 1,000,000 operations min. high-force models: 300,000 operations min. ambient temperature operating: 40 c to 85 c (with no icing) ambient humidity operating: 35% to 85% weight approx. 0.2 g engineering data operating force (gf) stroke s (mm) operating force vs. stroke characteristics high-force model standard model
b3fs b3fs 3 dimensions note: all units are in millimeters unless otherwise indicated. unless otherwise specified, a tolerance of 0.4 mm applies to all dimensions. b3fs-1000 B3FS-1002 b3fs-1000p B3FS-1002p pcb pad (t op v iew) (one-side pcb t= 1.6) t erminal arrangement/ internal connection (t op v iew) 3 dia. 6.3 4.5 0.2 3.1 2.6 0.7 0.7 8 6.4 9.6 3.1 5.9 (4) (4) (3) (3) (2) (1) (1) (2) operating characteristics item b3fs-1000 series e standard model high-force model operating force (of) 0.98 0.29 n {100 30 gf} 1.47 0.49 n {150 50 gf} releasing force (rf) 0.2 n min. {20 gf} 0.49 n min. {50 gf} pretravel (pt) 0.25 mm +0.2 0.1 precautions operation do not repeatedly operate the switch with high force, apply addi- tional force to the plunger once it has stopped moving, or operate the switch with excessive force, otherwise the disc spring of the switch may deform and the switch may malfunction. be sure to set the switch so that the plunger will be pressed straight. a decrease in the life of the switch may result if the plunger is pressed of f-center or from an acute angle. the switch is not of enclosed construction. be sure to protect the switch with an appropriate sheet when using the switch in locations with excessive dust. protection sheet switch key top
b3fs b3fs 4 soldering do not apply flow soldering, otherwise fragments of solder and flux may have a bad influence on the operation of the pushbutton. apply reflow soldering according to the optimum heating curve shown below. reflow soldering equipment may have a high peak value. be sure to conduct a test before use. soldering may be repeated only once at a minimum interval of five minutes if the switch is not soldered properly . no flux can be wiped or cleaned after soldering the switch because the cleaning solvent will penetrate into the interior of the switch to - gether with the flux and dust on the pcb. as a result, the switch may malfunction. time (s) preheating t emperature ( c) room temperature note: the above curve is given on condition that the thickness of the pcb is 1.6 mm. key switch packing key switches are packed on tape as shown below . label t ape drawing direction t ape drawing direction reel 13 dia. 1.5 dia. +0.1 0 (18) 380 2 dia. standard conform to eiaj standards package 3,000 switches heat resistance 50 c for 24 hours (not be deformed) all dimensions shown are in millimeters. to convert millimeters into inches, multiply by 0.03937. t o convert grams into ounces, multiply by 0.03527. cat. no. a113-e1-1 omron corporation c&c components division h.q. mechanical-components division 28th fl., crystal t ower bldg., 1-2-27, shiromi, chuo-ku, osaka 540-6028 japan phone: (81)6-949-6017 fax: (81)6-949-6134 in the interest of product improvement, specifications are subject to change without notice. printed in japan 1098-1m (1098) a
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