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data sheet the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. document no. p15553ej1v0ds00 (1st edition) date published may 2001 ns cp(k) printed in japan laser diode NX7304BG-CC 1 310 nm ingaasp mqw-fp laser diode coaxial module for fiberoptic communications ? 2001 description the NX7304BG-CC is a 1 310 nm multiple quantum well (mqw) structured fabry-perot (fp) laser diode coaxial module with single mode fiber. this module is ideal as a light source for itu-t recommended synchronous digital hierarchy (sdh) system, for fiberoptic communications as sonet and for digital transmission. features ? center wavelength l c = 1 310 nm ? optical output power p f = 2.0 mw min. ? low threshold current l th = 10 ma ? high cut-off frequency f c = 2.0 ghz ? wide operating temperature range t c = - 40 to +85 c ? ingaas monitor pin-pd ? with sc-upc connector ? based on telcordia reliability
data sheet p15553ej1v0ds 2 NX7304BG-CC package dimensions (unit: mm) 7.00.2 f 8.00.3 2.2 3.2 20.41.0 27.61.0 2.2 f 20.01.0 1.20.2 p.c.d. = 2.0 f 6.0 12.70.2 17.00.2 0.9 f 4.00.2 1.00.1 7.20.3 3.70.3 optical fiber (smf) length: 0.5 m with sc connector pin connections bottom view 1 2 3 4 4 1 3 2 pd ld case 0.450.05 f optical fiber characteristics parameter specification unit mode field diameter 9.5 1 m m cladding diameter 125 2 m m maximum cladding noncircularity 2 % maximum core/cladding concentricity 1.6 % outer diameter 0.9 0.1 mm cut-off wavelength 1 100 to 1 270 nm minimum fiber bending radius 30 mm fiber length 500 50 mm flammability ul1581 vw-1 sc-upc connector fiber length: 50050 mm 352 mm 8.990.5 mm data sheet p15553ej1v0ds 3 NX7304BG-CC ordering information part number flange type available connector NX7304BG-CC flat mount flange with sc-upc connector absolute maximum ratings parameter symbol ratings unit optical output power from fiber p f 2.0 mw forward current of ld i f 150 ma reverse voltage of ld v r 2.0 v forward current of pd i f 10 ma reverse voltage of pd v r 20 v operating case temperature t c - 40 to +85 c storage temperature t stg - 40 to +85 c lead soldering temperature t sld 260 (10 sec.) c relative humidity (noncondensing) rh 85 % data sheet p15553ej1v0ds 4 NX7304BG-CC electro-optical characteristics (t c = 25 c, unless otherwise specified) parameter symbol conditions min. typ. max. unit operating voltage v op p f = 2.0 mw 1.1 1.3 v threshold current i th 10 25 ma t c = 85 c2550 modulation current i mod p f = 2.0 mw 15 20 ma differential efficiency h d 0.100 0.150 w/a t c = 85 c 0.075 0.100 center wavelength l c p f = 2.0 mw, rms ( - 20 db) 1 290 1 310 1 330 nm t c = - 40 to +85 c 1 260 1 360 temperature dependence of center wavelength d l / d tt c = - 40 to +85 c0.40.5nm/ c spectral width s p f = 0.2 mw, rms ( - 20 db) 1.3 2.5 nm t c = 85 c1.54.0 rise time t r 10-90 % 0.2 0.5 ns fall time t f 90-10 % 0.3 0.5 ns monitor current i m v r = 5 v, p f = 2.0 mw 100 700 m a monitor dark current i d v r = 5 v 0.1 10 na tracking error g *1 i m = const., t c = - 40 to +85 c1.0db *1 tracking error: g 0 i m i m t c = 25 ?c t c = C40 to +85 ?c p f (mw) p f 2.0 (ma) g = 10 log [db] p f 2.0 data sheet p15553ej1v0ds 5 NX7304BG-CC typical characteristics (t c = - - - - 40 to +85 c) operating current and threshold current vs. case temperature case temperature t c (?c) operating current i op (ma), threshold current i th (ma) temperature depenedence of differential efficiency case temperature t c (?c) differential efficiency d (w/a) h forward current i f (ma) optical output power from fiber p f (mw) optical output power from fiber vs. forward current temperature dependence of center wavelength case temperature t c (?c) center wavelength l c (nm) C60 1 260 1 280 1 300 1 320 1 340 1 360 C40 C20 0 20 40 60 80 100 C60 1 2 3 5 10 20 30 50 100 C40 C20 0 20 40 60 80 100 C60 C40 C20 0 20 40 60 80 100 i th i op (@p f = 2.0 mw) +25 ?c +70 ?c +85 ?c 50 0 1.0 2.0 3.0 4.0 5.0 100 150 t c = C40 ?c 0.1 0 0.2 0.3 remark the graphs indicate nominal characteristics. data sheet p15553ej1v0ds 6 NX7304BG-CC typical characteristics (t c = 25 c) forward current vs. forward voltage forward current i f (ma) forward voltage v f (v) spectrum relative intensity wavelength l (nm) optical output power from fiber p f (mw) monitor current i m (ma) optical output power from fiber vs. monitor current 1 300 1 310 1 320 0 10 20 30 40 50 12 0.5 0 1.0 3.0 1.0 1.5 2.0 remark the graphs indicate nominal characteristics. data sheet p15553ej1v0ds 7 NX7304BG-CC fp-ld family absolute maximum ratings electro-optical characteristics (t c = - 40 to +85 c) part number t c ( c) t stg ( c) p f (mw) l c (nm) s (nm) applications package typ. min. max. max. nx7300ba-cc nx7300ch-cc - 40 to +85 - 40 to +85 0.7 1 266 1 360 4.0 2.5 gb/s: stm-16 (i-16) coaxial nx7301ba-cc nx7301ch-cc - 40 to +85 - 40 to +85 0.2 1 261 1 360 4.0 156 mb/s: stm-1 (i-1, s-1.1) coaxial 622 mb/s: stm-4 (i-4) nx7302ba-cc nx7302ch-cc - 40 to +85 - 40 to +85 0.2 1 274 1 356 2.5 622 mb/s: stm-4 (s-4.1) coaxial nx7303ba-cc nx7303ch-cc - 40 to +85 - 40 to +85 1.0 1 263 1 360 4.0 156 mb/s: stm-1 (l-1.1) coaxial NX7304BG-CC - 40 to +85 - 40 to +85 2.0 *1 1 260 1 360 4.0 for fiberoptic communications coaxial *1 min. data sheet p15553ej1v0ds 8 NX7304BG-CC reference document name document no. optical semiconducrtor devices for fiberoptic communications selection guide p12480e opto-electronics devices pamphlet p13623e opto-electronics devices (cd-rom) p12944x nec semiconductor device reliability/quality control system c 11159e quality grades on nec semiconductor devices c11531e semiconductor selection guide - products and packages - x13769e data sheet p15553ej1v0ds 9 NX7304BG-CC [memo] data sheet p15553ej1v0ds 10 NX7304BG-CC [memo] data sheet p15553ej1v0ds 11 NX7304BG-CC safety information on this product danger invisible laser radiation avoid direct exposure to beam output power mw max wavelength nm class lllb laser product avoid exposure-invisible laser radiation is emitted from this aperture nec corporation nec building, 7-1, shiba 5-chome, minato-ku, tokyo 108-01, japan type number: manufactured: serial number: this product conforms to fda regulations as applicable to standards 21 cfr chapter 1. subchapter j. semiconductor laser warning laser beam a laser beam is emitted from this diode during operation. the laser beam, visible or invisible, directly or indirectly, may cause injury to the eye or loss of eyesight. ? do not look directly into the laser beam. ? avoid exposure to the laser beam, any reflected or collimated beam. caution gaas products the product contains gallium arsenide, gaas. gaas vapor and powder are hazardous to human health if inhaled or ingested. ? do not destroy or burn the product. ? do not cut or cleave off any part of the product. ? do not crush or chemically dissolve the product. ? do not put the product in the mouth. follow related laws and ordinances for disposal. the product should be excluded from general industrial waste or household garbage. caution optical fiber a glass-fiber is attached on the product. handle with care. ? when the fiber is broken or damaged, handle carefully to avoid injury from the damaged part or fragments. NX7304BG-CC the export of this product from japan is prohibited without governmental license. to export or re-export this product from a country other than japan may also be prohibited without a license from that country. please call an nec sales representative. m8e 00. 4 the information in this document is current as of may, 2001. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). |
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