t-1 3 / 4 (5 mm) base lamp (alingap) reliability data description the following cumulative test results have been obtained from testing performed at agilent technologies in accordance with the latest revisions of mil-std-883 and jis c 7021. agilent tests parts at the absolute maximum rated conditions recommended for the device. the actual performance you obtain from agilent parts depends on the electrical and environmental characteristics of your application but will probably be better than the performance outlined in table 1. failure rate prediction the failure rate of semiconductor devices is determined by the junc- tion temperature of the device. the relationship between ambient temperature and actual junction temperature is given by the following: t j ( c) = t a ( c) + q ja p avg where t a = ambient temperature in c q ja = thermal resistance of junction-to-ambient in c/watt p avg = average power dissipated in watts the estimated mtbf and failure rate at temperatures lower than the actual stress temperature can be determined by using an arrhenius model for temperature acceleration. results of such cal- culations are shown in the table on the following page using an activa- tion energy of 0.43 ev (reference mil-hdbk-217). table 1. life tests demonstrated performance stress test total units units failure rate colors conditions device hrs. tested failed mtbf (% /1k hours) red t a = 55 c, 112,000 112 0 112,000 0.893 (626 nm i f = 50 ma dominant) red t a = -40 c, 112,000 112 0 112,000 0.893 (626 nm i f = 50 ma dominant) point typical performance hlmp-c008/c208/c608/ c025/c225/c325/c625
2 example of failure rate calculation assume a device operating 8 hours/day, 5 days/week. the utilization factor, given 168 hours/week is: (8 hours/day) x (5 days/week) / (168 hours/week) = 0.25 the point failure rate per year (8760 hours) at 55 c ambient temperature is: (0.893% / 1k hours) x (0.25) x (8760 hours/year) = 1.96% per year similarly, 90% confidence level failure rate per year at 55 c: (2.056% / 1k hours) x (0.25) x (8760 hours/year) = 4.50% per year table 2. reliability predictions (i f = 50 ma) [4] point typical performance performance in time [1] in time [2] (60% confidence) (90% confidence) ambient junction failure rate failure rate temperature ( c) temperature ( c) mtbf [1] (%/1k hours) mtbf [2] (%/1k hours) 55 88 112,000 0.893 49,000 2.056 45 78 166,000 0.602 72,000 1.692 35 68 252,000 0.396 110,000 0.912 25 58 393,000 0.254 171,000 0.585 notes: [1] the point typical mtbf (which represents 60% confidence level) is the total device hours divided by the number of failures. in the case of zero failures, one failure is assumed for this calculation. [2] the 90% confidence mtbf represents the minimum level of reliability performance which is expected from 90% of all samples. this confidence interval is based on the statistics of the distribution of failures. the assumed distribution of failures is exponential. this particular distribution is commonly used in describing useful life failures. refer to mil-std-690b for details on this methodology. [3] a failure is any led which is open, shorted, or fails to emit light. [4] calculated from data generated at 55 c biased at 50 ma.
3 table 3. environmental tests mil-std-883 jis c 7021 units units test name reference reference test conditions tested failed temperature cycle 1010 method a-4 -40 c to 120 c; 30 min. dwell, 2,300 0 5 min. transfer, 500 cycles resistance to 2003 method a-1 260 c for 10 sec. 264 0 soldering heat cond. a resistance to 2003 method a-1 260 c for 5 sec. / 2x dip. 264 0 soldering heat cond. a solderabilty 2003 method a-2 230 c for 5 sec. 1 to 1.5 mm 80 0 from body, 95% solder coverage of immersed area high temp. storage 1005 method 120 c for 1,000 hours 28 0 b-10 low temp. storage 1005 -40 c for 1,000 hours 28 0 temperature shock agilent req. agilent req. -30 c to 100 c, 30 min. dwell and 500 0 <20 second transfer. 200 cycles power temp. cycle agilent req. agilent req. -40 c to 85 c; 18 min. dwell, 168 0 42 min. transfer and 5 min. on/off @ 20 ma. 1000 cycles humidity life agilent req. agilent req. 85 c, 85%rh, 10 ma, 1000 hours 28 0 resistance to 2015 n/a 1. z propanol/mineral spirit solution 22 0 solvents (1:3 by volume). 2. propylene glycol monomethylether/monoethanolamine/ di water solution(1:1:42 by volume). 3. semiaquous solvent with a minimum of 60% limonene and skysol 600. moisture resistance n/a method 60 c, 90-95% r/h. 1,000 hours. 28 0 b-11 performed 1,000 hours cond.b table 4. mechanical tests mil-std-883 units units test name reference test conditions tested failed mechanical shock 2002 1,500 gs applied by 5 shocks in each 22 0 axis x1, y1 and z1. terminal strength 2004 1/2 pound for 30 seconds, 22 0 cond. a 15 degree bend, 1x.
www.semiconductor.agilent.com data subject to change. copyright ? 2000 agilent technologies, inc. obsoletes 5968-6070e 5980-2996en (8/00)
|
