common mode noise filter array design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. e 1 x 2 c 3 1 4 8 5 c 6 e 7 9 8 0 9 0 10 u 11 12 noise filter high speed differential transmission e coupled type the first two digits are significant figure of impedance value, and the third one denotes the number of zeros following packing embossed carrier taping 5000 pcs. code u product code type characteristics size nominal impedance form suffix c number of terminals 8te rminals dimensions(mm) 1.6 0.8 0.4 (l) (w) (h) code 1 ferrite inner conductor electrode a c b f d e 65 34 87 12 87 12 65 34 common mode noise filter array t ype: exc18ce fe atures 2 common mode noise ? lters in one package small size and low-pro? le (l 1.6 mm w 0.8 mm h 0.4 mm) filtering the noise of high-speed differential signaling lines and minimizing deformations of transmitted signal waveforms low dc resistance and insertion loss rigidly layered and sintered structure with high resistance to re? ow heat and mounting reliability lead, halogen, and antimony free recommended applications mobile phone, dsc, notebook pcs, and digital displays noise reduction of high-speed data lines such as usb, l vds, and hdmi lines explanation of part numbers construction dimensions in mm (not to scale) circuit con? guration(no polarity) t ype (inches) dimensions (mm) mass (weight) [mg/pc.] abcdef exc18c (0603) 0.8?.1 1.6?.1 0.4?.1 0.2?.1 0.4?.1 0.2?.1 2.6 jun. 2009
common mode noise filter array design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. 1 10 100 1000 11 0 100 1000 10000 1 10 100 1000 11 0 100 1000 10000 1 10 100 1000 11 01 00 1000 10000 frequency (mhz) impedance ( ) impedance ( ) frequency (mhz) impedance ( ) common mode differential mode common mode differential mode common mode differential mode frequency (mhz) (b) differential mode (a) common mode z z EXC18CE650U exc18ce201u exc18ce900u impedance characteristics (typical) ratings part number impedance ( ) at 100 mhz rated voltage (v dc) rated current (ma dc) dc re sis tance ( ) max. common mode differential mode EXC18CE650U 65 ?0 % 18 max. 5 140 1.8 exc18ce900u 90 ?0 % 20 max. 5 130 2.0 exc18ce201u 200 ?0 % 22 max. 5 100 3.5 measurement circuit pa c kaging methods(taping) and recommended land pattern design refer 126 page. recommended soldering conditions and safety precations refer 127 page. jun. 2009
common mode noise filters design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. t 1 t 2 d 0 p 1 p 2 a b fe w p 0 chip component sprocket hole compartment t ape running direction e t w d c a t b t 1 t 2 p 1 p 2 p 0 a b fe w d 0 chip component sprocket hole compartment ta pe running direction pa c kaging methods (taping) standard quantity embossed carrier taping ta ping reel standard reel dimensions embossed carrier dimensions part number kind of taping pitch (p 1 ) quantity exc14c u embossed carrier taping 2 mm 10000 pcs./reel exc18c u 4 mm 5000 pcs./reel exc24c u (mm) t ype a b c d exc14c exc18c exc24c 180.0?.0 60.0?.0 13.0?.5 21.0?.8 embossed carrier taping t ype e w t t exc14c exc18c exc24c 2.0?.5 9.0?.3 11.4?.5 1.2?.2 (mm) embossed carrier dimensions (mm) t ype a b w f e p 1 exc14c 0.75?.10 0.95?.10 8.0?.2 3.50?.05 1.75?.10 2.0?.1 t ype p 2 p 0 d 0 t 1 t 2 exc14c 2.0?.1 4.0?.1 1.5 +0.1 0.25?.05 0.85?.15 ? t ype a b w f e p 1 exc18c 1.00?.10 1.80?.10 8.0?.2 3.5?.1 1.75?.10 4.0?.1 exc24c 1.20?.15 1.45?.15 t ype p 2 p 0 d 0 t 1 t 2 exc18c 2.0?.1 4.0?.1 1.5 +0.1 0.25?.05 0.50?.05 exc24c 0.90?.15 ? jun. 2009
common mode noise filters design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. preheating peak heating temperature time a dc d efe b a d c d e f b recommended land pattern design recommended soldering conditions recommendations and precautions are described below safety precations the following are precautions for individual products. please also refer to the precautions common to emi filters, esd suppressors, fuses, and mr sensors shown on page el113 of this catalog. 1. use rosin-based ? ux or halogen-free ? ux. 2. for cleaning, use an alcohol-based cleaning agent. before using any other type, consult with our sales person in advance. 3. do not apply shock to c ommon mode noise filters (hereafter called the filters) or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, their bodies may be chipped, affecting their performance. excessive me- chanical stress may damage the filters. handle with care. 4. store the ? lters in a location with a temperature ranging from 5 c to +40 c and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 5. use the ? lters within half a year after the date of the outgoing inspection indicated on the packages. preheat with a blast of hot air or similar method. use a soldering iron with a tip temperature of 350 ? or less. solder each electrode for 3 seconds or less. never touch this product with the tip of a soldering iron. temp erature time preheating 140 c to 160 c 60 s to 120 s main heat ing above 200 c 30 s to 40 s peak 235 10 c max. 10 s temp erature time preheating 150 c to 170 c 60 s to 120 s main heat ing above 230 c 30 s to 40 s peak max. 260 ? max. 10 s recommended soldering conditions for re ow for solderin g (example : sn-37pb) for lead-f ree solder ing (example : sn/3ag/0.5cu) ?re ow soldering shall be performed a maximum of two times. ?please contact us for ad ditional information when used in conditions other than those speci ed. ?please meas ure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. t ype dimensions (mm) abcdef exc18 c 1.4 1.4 0.4 0.5 0.2 0.4 t ype dimensions (mm) abcdef exc14c 0.80 to 1.00 0.80 0.30 0.25 to 0.35 0.30 0.20 exc24 c 1.60 to 2.00 0.95 0.70 0.45 to 0.65 0.35 0.25 exc14c , exc24c exc18c flow soldering ? we do not recommend ow soldering , because ow soldering may cause brid ges betwwn the electrodes. jun. 2009
? el113 ? safety precautions (common precautions for emi filters, esd suppressors, fuses, and mr sensors) when using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the speci? cations with us in advance. the design and speci? cations in this catalog are subject to change without prior notice. do not use the products beyond the speci? cations described in this catalog. this catalog explains the quality and performance of the products as individual components. before use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signi? cant dam age, such as damage to vehicles (automobile, train, vessel), traf? c lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ? systems equipped with a protection circuit and a protection device ? systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault (1) precautions for use these products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. av equipment, home electric appliances, of? ce equipment, information and communication e quipment) these products are not intended for use in the following special conditions. before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. electric static discharge (esd) environment (except esd suppressors) these components are sensitive to static electricity and can be damaged under static shock (esd). please take measures to avoid any of these environments. smaller componen ts are more sensitive to esd environment. 5. electromagnetic environment avoid any enviro nment wher e strong electromagnetic waves exist. 6. in an environment where these products cause dew condensation 7. sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials these products generate joule heat when energized. carefully position these products so that their heat will not affect the other components. carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. do not mount or place heat-generating components or in? ammables, such as vinyl-coated wires, near these products (except thermal cutoffs). note that non-cleaning solder, halogen-based highly active ? ux, or water-soluble ? ux may deteriorate the performance or reliability of the products. carefully select a ? ux cleaning agent for use after soldering. an unsuitable agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. otherwise, the insulation performance may be deteriorated. (2) precautions for storage the performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 c to 35 c and a relative humidity of 45 % to 85 %. (micro chip fuses: guaranteed for 6 months from the date of arrival at your company) the performance of emi filters is guaranteed for 6 months or a year from the out go ing inspection date indicated on the packages, provided that they are stored at a temperature of -5 c to +40 c and a relative humidity of 40 % to 60 %. check the guarantee period in the speci? cations. the performance of thermal cut offs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 c to +40 c and a relative humidity of 30 % to 75 %. even within the above guarantee periods, do not store these products in the following conditions. otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package markings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. jan. 2008
|
