1. product pro?le 1.1 general description cavity free cylindrical glass sod87 package through implotec? technology. this package is hermetically sealed and fatigue free as coef?cients of expansion of all used parts are matched. 1.2 features n glass passivated n high maximum operating temperature n low leakage current n excellent stability n shipped in 8 mm embossed tape n smallest surface mount recti?er outline 2. pinning information [1] the marking bar indicates the cathode. 3. ordering information byd47-20 fast soft-recovery recti?er rev. 04 4 february 2005 product data sheet table 1: pinning pin description simpli?ed outline symbol 1 cathode (k) [1] 2 anode (a) ka sym006 table 2: ordering information type number package name description version byd47-20 - hermetically sealed glass surface mounted package; implotec? technology; 2 connectors sod87
9397 750 14417 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 04 4 february 2005 2 of 10 philips semiconductors byd47-20 fast soft-recovery recti?er 4. limiting values 5. thermal characteristics [1] device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of cu-layer 3 40 m m, see figure 13 . 6. characteristics table 3: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v rsm non-repetitive peak reverse voltage - 2100 v v rrm repetitive peak reverse voltage - 2000 v i f(av) average forward current t tp = 105 c; see figure 1 ; averaged over any 20 ms period; see also figure 5 - 0.80 a t amb =25 c; printed-circuit board mounting (see figure 13 ); see figure 2 ; averaged over any 20 ms period; see also figure 5 - 0.34 a i frm repetitive peak forward current t tp =85 c; see figure 3 - 8.0 a t amb =65 c; see figure 4 - 2.8 a i fsm non-repetitive peak forward current t = 10 ms half sine wave; t j =t j(max) prior to surge; v r =v rrmmax -10a t stg storage temperature - 65 +175 c t j junction temperature see figure 6 - 65 +175 c table 4: thermal characteristics symbol parameter conditions typ unit r th(j-tp) thermal resistance from junction to tie-point 30 k/w r th(j-a) thermal resistance from junction to ambient [1] 150 k/w table 5: characteristics t j = 25 c; unless otherwise stated. symbol parameter conditions min typ max unit v f forward voltage i f = 1 a; t j = t j(max) ; see figure 7 - - 2.05 v i f = 1 a; see figure 7 - - 2.40 v i r reverse current v r = v rrmmax ; see figure 8 --5 m a v r = v rrmmax ; t j = 125 c; see figure 8 --50 m a t rr reverse recovery time when switched from i f = 0.5 a to i r =1a; measured at i r = 0.25 a; see figure 10 - - 300 ns c d diode capacitance f = 1 mhz; v r = 0 v; see figure 9 -15-pf maximum slope of reverse recovery current when switched from i f =1atov r 3 30 v and di f /dt = - 1a/ m s; see figure 11 --5a/ m s di r dt --------
9397 750 14417 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 04 4 february 2005 3 of 10 philips semiconductors byd47-20 fast soft-recovery recti?er a=i f(rms) /i f(av) = 1.42; v r =v rrmmax ; d = 0.5. switched mode application. a=i f(rms) /i f(av) = 1.42; v r =v rrmmax ; d = 0.5. device mounted as shown in figure 13 . switched mode application. fig 1. maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage) fig 2. maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage) t tp =85 c; r th(j-tp) = 30 k/w. v rrmmax during 1 -d ; curves include derating for t j(max) at v rrm = 2000 v. fig 3. maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor 0 200 1.6 0 mlc194 0.4 100 t tp ( c) i f(av) (a) 0.8 1.2 0 200 0 0.1 0.4 0.3 mlc195 100 i f(av) (a) t amb ( c) 0.2 mlc198 4 6 2 8 10 i frm (a) 0 t p (ms) 10 - 2 10 3 10 4 10 2 10 10 - 1 1 d = 0.05 0.1 0.2 0.5 1 t p t p t p t t d =
9397 750 14417 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 04 4 february 2005 4 of 10 philips semiconductors byd47-20 fast soft-recovery recti?er t amb =65 c; r th(j-a) = 150 k/w. v rrmmax during 1 -d ; curves include derating for t j(max) at v rrm = 2000 v. fig 4. maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor a=i f(rms) /i f(av) ; v r =v rrmmax ; d = 0.5. solid line: v rrm ; d = 0.5. dotted line: v rrm ; d = 0.1. fig 5. maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current fig 6. maximum permissible junction temperature as a function of reverse voltage mlc199 1 2 3 i frm (a) 0 t p (ms) 10 - 2 10 3 10 4 10 2 10 10 - 1 1 d = 0.05 0.1 0.2 0.5 1 t p t p t p t t d = 0 mlc193 3 0 2 1 a = 3 2.5 2 p (w) i f(av) (a) 0.4 0.8 1.57 1.42 200 0 2000 0 mlc197 1000 100 v r (v) t j ( c)
9397 750 14417 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 04 4 february 2005 5 of 10 philips semiconductors byd47-20 fast soft-recovery recti?er (1) t j = 175 c. (2) t j =25 c. v r =v rrmmax . fig 7. forward current as a function of forward voltage; maximum values fig 8. reverse current as a function of junction temperature; maximum values f = 1 mhz; t j =25 c. fig 9. diode capacitance as a function of reverse voltage; typical values 04 3 0 1 2 mlc192 2 i f (a) v f (v) (2) (1) mlc319 10 3 1 10 2 10 i r ( m a) t j ( c) 0 200 100 1 mlc317 10 10 2 10 3 1 10 v r (v) c d (pf)
9397 750 14417 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 04 4 february 2005 6 of 10 philips semiconductors byd47-20 fast soft-recovery recti?er 7. test information input impedance oscilloscope: 1 m w , 22 pf; t r 7ns. source impedance: 50 w ; t r 15 ns. fig 10. test circuit and reverse recovery time waveform and de?nition fig 11. reverse recovery de?nitions 10 w 1 w 50 w 25 v dut mam057 + t rr 0.5 0 0.5 1.0 i f (a) i r (a) t 0.25 10% 100% di f di r dt t t rr i f i r mgc499 dt
9397 750 14417 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 04 4 february 2005 7 of 10 philips semiconductors byd47-20 fast soft-recovery recti?er 8. package outline 9. mounting fig 12. package outline sod87 references outline version european projection issue date iec jedec jeita sod87 100h03 99-06-04 04-06-28 hermetically sealed glass surface mounted package; implotec tm(1) technology; 2 connectors sod87 unit d mm 2.1 2.0 2.0 1.8 3.7 3.3 0.3 d1 h l dimensions (mm are the original dimensions) h d d 1 ll (2) 0 1 2 mm scale notes 1. implotec is a trademark of koninklijke philips electronics n.v. 2. the marking indicates the cathode. ka fig 13. printed-circuit board for surface mounting msb213 4.5 2.5 1.25 50 50 dimensions in mm
9397 750 14417 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 04 4 february 2005 8 of 10 philips semiconductors byd47-20 fast soft-recovery recti?er 10. revision history table 6: revision history document id release date data sheet status change notice doc. number supersedes byd47-20_4 20050204 product data sheet - 9397 750 14417 byd47_series_3 modi?cations: ? the format of this data sheet has been redesigned to comply with the new presentation and information standard of philips semiconductors. ? type numbers byd47-16 and byd47-18 removed ? title changed to fast soft-recovery recti?er byd47_series_3 19991111 product speci?cation - 9397 750 06273 byd47_2 byd47_2 19960605 product speci?cation - n.a. byd47series_1 byd47series_1 19941114 product speci?cation - n.a. -
philips semiconductors byd47-20 fast soft-recovery recti?er 9397 750 14417 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 04 4 february 2005 9 of 10 11. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 12. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 13. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 14. trademarks implotec is a trademark of koninklijke philips electronics n.v. 15. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2005 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 4 february 2005 document number: 9397 750 14417 published in the netherlands philips semiconductors byd47-20 fast soft-recovery recti?er 16. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 thermal characteristics. . . . . . . . . . . . . . . . . . . 2 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 data sheet status . . . . . . . . . . . . . . . . . . . . . . . . 9 12 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 15 contact information . . . . . . . . . . . . . . . . . . . . . 9
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