general information aeroflex / kdis series of high power surface mount terminations are ideal for high frequency applications where small size and low costs are an important design criteria. the ability of these chips to be directly mounted to the pc board eliminates the need for expensive mounting flanges and input tabs. large solderable surface areas on the bottom of the chips allows for higher power dissipation in smaller sizes. all kac series chips are manufac- tured using environmentally friendly aluminum nitride ceramic and are classified as rohs compliant. ordering information series kac surface mount terminations (smt) high power, aluminum nitride (aln), 10 - 150 watts note tinnning with sn96 lead free high temperature solder will maintain rohs compliance. general specifications substrate aluminum nitride solderable terminals electroplated silver over nickel resistive element proprietary thick film operating temperature -55 to +150oc impedance (nominal) 50 ohms physical dimensions example: typical model no. npc t 100-200a x g prefix tinning (optional) size terminal type ohmic value 50r0 kac z h = sn96 t = sn62 tolerance, g = 2% (standard) performance specifications w l t a b c power frequency model prefix in (mm) in (mm) in (mm) in (mm) in (mm) in (mm) vswr cw ghz kac 60 C 120a 0.060 (1,52) 0.120 (3,05) 0.025 (0,64) 0.054 (1,37) 0.026 (0,66) 0.013 (0,33) 1.25 10 dc C 4.0 kac 100 C 200a 0.100 (2,5) 0.200 (5,1) 0.040 (1,02) 0.050 (1.27) 0.025 (0,64) 0.035 (0,89) 1.25 20 dc C 2.5 kac 250 C 250a 0.250 (6,4) 0.250 (6,4) 0.040 (1,02) 0.040 (1,02) 0.043 (1,09) 0.020 (0,51) 1.25 75 dc C 4.0 kac 250 C 375a 0.250 (6,4) 0.375 (9,5) 0.040 (1,02) 0.135 (3,43) 0.058 (1,47) 0.060 (1,52) 1.25 100 dc C 3.0 kac 375 C 375a 0.375 (9,5) 0.375 (9,5) 0.040 (1,02) 0.125 (3,18) 0.057 (1,48) 0.030 (0,76) 1.25 150 dc C 3.0 rev 04/11 300 dino drive, ann arbor, mi 48103 tel: 888-244-6638 or 734-426-5553 ? fax: 734-426-5557 www.aeroflex.com/inmet ? inmetsales@aeroflex.com key : inches [millimeters] .xx .03 .xxx .010 [.x 0.8 .xx 0.25]
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