rev.1.00 jun 08, 2005 page 1 of 5 hzm6.2zmwa silicon planar zener diode for surge absorb rej03g1208-0100 (previous: ade-208-1514) rev.1.00 jun 08, 2005 features ? hzm6.2zmwa has two devices in a monolithic, and can absorb surge. ? low capacitance (c = 8.5 pf max) and can protect esd of signal line. ? mpak package is suitable for high density surface mounting and high speed assembly. ordering information type no. laser mark package name package code (previous code) hzm6.2zmwa 62n mpak plsp0003zc-a (mpak) pin arrangement 1. cathode 2. cathode 3. anode (top view) 3 2 1
hzm6.2zmwa rev.1.00 jun 08, 2005 page 2 of 5 absolute maximum ratings (ta = 25 c) item symbol value unit power dissipation pd * 1 200 mw junction temperature tj 150 c storage temperature tstg ? 55 to +150 c note: 1. two device total, see fig.2. electrical characteristics * 1 (ta = 25 c) item symbol min typ max unit test condition zener voltage v z 5.90 ? 6.50 v i z = 5 ma, 40 ms pulse reverse current i r ? ? 3 a v r = 5.5 v capacitance c ? ? 8.5 pf v r = 0 v, f = 1 mhz dynamic resistance r d ? ? 60 ? i z = 5 ma esd-capability * 2 ? 13 ? ? kv c = 150 pf, r = 330 ? , both forward and reverse direction 10 pulse notes: 1. per one device 2. failure criterion ; i r > 3 a at v r = 5.5 v.
hzm6.2zmwa rev.1.00 jun 08, 2005 page 3 of 5 main characteristic t ta = 25 c nonrepetitive fig.3 surge reverse power ratings time t (s) 1.0 10 nonrepetitive surge reverses power p rsm (w) 10 2 10 3 10 4 10 ?2 10 ?1 1.0 10 ?5 10 ?4 10 ?3 p rsm 02 10 8 6 4 250 200 150 100 50 200 150 100 50 0 0 1.0mm 0.8mm fig.2 power dissipation vs. ambient temperature ambient temperature ta ( c) power dissipation pd (mw) printed circuit board 25 62 1.6t mm material: glass epoxy resin+cu foil cu foil 10 ?5 10 ?6 10 ?4 10 ?3 10 ?2 fig.1 zener current vs. zener voltage zener voltage v z (v) zener current i z (a)
hzm6.2zmwa rev.1.00 jun 08, 2005 page 4 of 5 1.0 10 10 2 10 3 10 4 10 10 2 10 3 10 ?2 10 ?1 1.0 time t (s) transient thermal impedance zth ( c/w) fig.4 transient thermal impedance * note: measurement value by forward bias.
hzm6.2zmwa rev.1.00 jun 08, 2005 page 5 of 5 package dimensions pattern of terminal position areas e e 1 l 1 b 2 b c a ? a section d a a b e h e e a a 1 q c l a1.0-1.3 a 1 0 - 0.1 b 0.35 0.4 0.5 c 0.1 0.16 0.26 d2.7-3.1 e 1.35 1.5 1.65 - 0.95 - -- e h e 2.2 2.8 3.0 l 0.65 b 2 - - 0.55 -1.95- e 1 l 1 - - 1.05 q-0.3- dimension in millimeters min nom max reference symbol sc-59a 0.011g mass[typ.] mpak(d) / mpak(d)v plsp0003zc-a renesas code jeita package code previous code
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