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lo q996 hyper chipled hyper-bright led 2001-11-30 1 besondere merkmale ? geh?usetyp: 0603 besonderheit des bauteils: kleinste bauform 1,6 mm x 0,8 mm x 0,8 mm wellenl ? nge: 606 nm (orange) abstrahlwinkel: extrem breite abstrahlcharakteristik (160 ) technologie: ingaalp optischer wirkungsgrad: 11 lm/w verarbeitungsmethode: f r alle smt-best cktechniken geeignet l ? tmethode: ir reflow l ? ten vorbehandlung: nach jedec level 2 gurtung: 8 mm gurt mit 4000/rolle, ? 180 mm anwendungen informationsanzeigen im au ? enbereich flache hinterleuchtung (lcd, handy, schalter, display) signal- und symbolleuchten markierungsbeleuchtung (z.b. stufen, fluchtwege, u. ? .) features package: 0603 feature of the device: smallest package 1.6 mm x 0.8 mm x 0.8 mm wavelength: 606 nm (orange) viewing angle: extremely wide (160 ) technology: ingaalp optical efficiency: 11 lm/w assembly methods: suitable for all smt assembly methods soldering methods: ir reflow soldering preconditioning: acc. to jedec level 2 taping: 8 mm tape with 4000/reel, ? 180 mm applications outdoor displays flat backlighting (lcd, cellular phones, switches, displays) signal and symbol luminaire marker lights (e.g. steps, exit ways, etc.)
2001-11-30 2 lo q996 helligkeitswerte werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 11% ermittelt. luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of 11%. anm.: -1 gesamter farbbereich, lieferung in einzelgruppen (siehe seite 5 ) die standardlieferform von serientypen beinhaltet eine untere bzw. eine obere familiengruppe, die aus nur 3 bzw. 4 halbgruppen besteht. einzelne halbgruppen sind nicht erh?ltlich. in einer verpackungseinheit / gurt ist immer nur eine halbgruppe enthalten. note: -1 total color tolerance range, delivery in single groups (please see page 5 ) the standard shipping format for serial types includes a lower or upper family group of 3 or 4 individual groups. individual half groups are not available. no packing unit / tape ever contains more than one luminous intensity half group typ type emissionsfarbe color of emission farbe der lichtaustritts- fl ? che color of the light emitting area lichtst ? rke luminous intensity i f = 20 ma i v (mcd) bestellnummer ordering code min. typ. lo q996-1 orange colorless clear 35.5 70 q62702-p5337
lo q996 2001-11-30 3 grenzwerte maximum ratings bezeichnung parameter symbol symbol wert value einheit unit betriebstemperatur operating temperature range t op ? 30 ? + 85 c lagertemperatur storage temperature range t stg ? 40 ? + 85 c sperrschichttemperatur junction temperature t j + 95 c durchlassstrom forward current i f 25 ma sto ? strom surge current t 10 s, d = 0.1 i fm 0.1 a sperrspannung reverse voltage v r 3v leistungsaufnahme power consumption p tot 65 mw w ? rmewiderstand thermal resistance sperrschicht/umgebung junction/ambient sperrschicht/l ? tpad junction/solder point montage auf pc-board fr 4 (padgr ?? e 16 mm 2 ) mounted on pc board fr 4 (pad size 16 mm 2 ) r th ja r th js 900 510 k/w k/w
2001-11-30 4 lo q996 kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol wert value einheit unit wellenl ? nge des emittierten lichtes (typ.) wavelength at peak emission i f = 20 ma peak 610 nm dominantwellenl ? nge 1) (typ.) dominant wavelength i f =20 ma dom 606 ?6 nm spektrale bandbreite bei 50 % i rel max (typ.) spectral bandwidth at 50 % i rel max i f = 20 ma ? 16 nm abstrahlwinkel bei 50 % i v (vollwinkel) (typ.) viewing angle at 50 % i v 2 ? 160 grad deg. durchlassspannung 2) (typ.) forward voltage (max.) i f = 20 ma v f v f 2.0 2.4 v v sperrstrom (typ.) reverse current (max.) v r = 3 v i r i r 0.01 10 a a temperaturkoeffizient von peak (typ.) temperature coefficient of peak i f = 20 ma; ? 10 c t 100 c tc peak 0.13 nm/k temperaturkoeffizient von dom (typ.) temperature coefficient of dom i f = 20 ma; ? 10 c t 100 c tc dom 0.07 nm/k temperaturkoeffizient von v f (typ.) temperature coefficient of v f i f = 20 ma; ? 10 c t 100 c tc v ? 1.7 mv/k optischer wirkungsgrad (typ.) optical efficiency i f = 20 ma opt 11 lm/w 1) wellenl ? ngengruppen werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von ? nm ermittelt. wavelength groups are tested at a current pulse duration of 25 ms and a tolerance of 1 nm. 2) spannungswerte werden mit einer stromeinpr ? gedauer von 1 ms und einer genauigkeit von ?,1 v ermittelt. voltages are tested at a current pulse duration of 1 ms and a tolerance of ?.1 v.
lo q996 2001-11-30 5 1) wellenl ? ngengruppen wavelength groups gruppe group wellenl ? nge wavelength einheit unit min. max. 2 600 603 nm 3 603 606 nm 4 606 609 nm 5 609 612 nm
2001-11-30 6 lo q996 relative spektrale emission i rel = f ( ), t a = 25 c, i f = 20 ma relative spectral emission v( ) = spektrale augenempfindlichkeit standard eye response curve abstrahlcharakteristik i rel = f ( ? ) radiation characteristic ohl01485 400 0 20 40 60 80 100 450 500 550 600 650 700 nm % i rel v orange 0 0.2 0.4 1.0 0.8 0.6 ? 1.0 0.8 0.6 0.4 0? 10? 20? 40? 30? ohl00408 50? 60? 70? 80? 90? 100? 0? 20? 40? 60? 80? 100? 120?
lo q996 2001-11-30 7 durchlassstrom i f = f ( v f ) forward current t a = 25 c maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current relative lichtst ? rke i v / i v(20 ma) = f ( i f ) relative luminous intensity t a = 25 c relative lichtst ? rke i v / i v(25 c) = f ( t a ) relative luminous intensity i f = 20 ma ohl00232 10 -1 1.4 1.8 2.2 2.6 3 v 3.4 0 10 1 10 10 2 5 5 ma 5 1 f v f i t ohl00873 0 f i 0204060 80 ? c 100 ma 5 10 15 20 25 30 temp. solder point temp. ambient t t s a t a t s v v (20 ma) 10 -1 0 10 10 12 10 ma 10 -3 5 ohl01271 i 5 -2 10 5 -1 10 0 10 1 10 i i 55 ohl01273 0 -20 0 20 40 60 ? c 100 0.4 0.8 1.2 2 v i v (25 ? c) i 1.6 t
2001-11-30 8 lo q996 ma ? zeichnung package outlines ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). gewicht / approx. weight: 1.4 mg geoy6023 cathode mark 1.7 (0.067) cathode mark 0.9 (0.035) 0.9 (0.035) 0.7 (0.028) 1.5 (0.059) 0.7 (0.028) 0.4 (0.016) 0.2 (0.008) 0.2 (0.008) 0.4 (0.016) 1.3 (0.051) 1.1 (0.043) 1.0 (0.039) 1.2 (0.047)
lo q996 2001-11-30 9 l ? tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 ir-reflow l ? tprofil (nach ipc 9501) ir reflow soldering profile (acc. to ipc 9501) ohla0685 0:00 0 t t ? c min 50 100 150 200 250 0:30 1:00 1:30 2:00 2:30 3:00 3:30 4:00 4:30 5:00 5:30 2-3 k/s 2-3 k/s t = 183 ? c = 70 s t max t = 245 ? c
2001-11-30 10 lo q996 empfohlenes l ? tpaddesign ir reflow l ? ten recommended solder pad ir reflow soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). empfohlenes l ? tpaddesign verwendbar f r hyper chipled und chipled - bauform 0603 ir reflow l ? ten recommended solder pad useable for hyper chipled and chipled - package 0603 ir reflow soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). empfohlene l ? tpastendicke: 120 m/ recommended thickness of solder paste: 120 m 0.8 (0.031) 0.7 (0.028) ohapy606 0.8 (0.031) 0.8 (0.031) ohpy0203 2.25 (0.089) 0.65 (0.026) 0.3 (0.012) 0.5 (0.020) 0.8 (0.031) 0.35 (0.014) 0.225 (0.009)
lo q996 2001-11-30 11 gurtung / polarit ? t und lage verpackungseinheit 4000/rolle, 180 mm method of taping / polarity and orientation packing unit 4000/reel, 180 mm ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohay0531 cathode mark a c 1.5 (0.059) 2 (0.079) 4 (0.157) 8 (0.315) 1.85 (0.073) 1.75 (0.069) 3.5 (0.138) 1 (0.039) 4 (0.157)
2001-11-30 12 lo q996 published by osram opto semiconductors gmbh & co. ohg wernerwerkstrasse 2, d-93049 regensburg ? all rights reserved. attention please! the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserved. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. if printed or downloaded, please find the latest version in the internet. packing please use the recycling operators known to you. we can also help you get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components 1 may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 2 life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. revision history: 2001-11-30 previous version: 2001-02-08 page subjects (major changes since last revision) 10 recommended solder pad

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