pb rohs ep1145hsettsc-4.94304m ep11 45 hs et ts c -4.94304m series rohs compliant (pb-free) 5.0v 8 pin dip metal thru-hole hcmos/ttl programmable oscillator frequency tolerance/stability 50ppm maximum package operating temperature range -40c to +85c nominal frequency 4.94304mhz output logic type cmos pin 1 connection tri-state (disabled output: high impedance) duty cycle 50 10(%) electrical specifications nominal frequency 4.94304mhz frequency tolerance/stability 50ppm maximum (inclusive of all conditions: calibration tolerance at 25c, frequency stability over the operating temperature range,supply voltage change, output load change, first year aging at 25c, shock, and vibration) aging at 25c 5ppm/year maximum operating temperature range -40c to +85c supply voltage 5.0vdc 10% input current 45ma maximum (unloaded) output voltage logic high (voh) vdd-0.4vdc minimum (ioh=-16ma) output voltage logic low (vol) 0.4vdc maximum (iol=+16ma) rise/fall time 4nsec maximum (measured at 20% to 80% of waveform) duty cycle 50 10(%) (measured at 1.4vdc with ttl load; measured at 50% of waveform with hcmos load) load drive capability 50pf hcmos load maximum output logic type cmos pin 1 connection tri-state (disabled output: high impedance) pin 1 input voltage (vih and vil) +2.0vdc minimum to enable output, +0.8vdc maximum to disable output, no connect to enable output. standby current 50a maximum (pin 1 = ground) disable current 30ma maximum (pin 1 = ground) peak to peak jitter (tpk) 500psec maximum, 90psec typical rms period jitter (trms) 50psec maximum, 13psec typical start up time 10msec maximum storage temperature range -55c to +125c environmental & mechanical specifications fine leak test mil-std-883, method 1014, condition a gross leak test mil-std-883, method 1014, condition c lead integrity mil-std-883, method 2004 mechanical shock mil-std-202, method 213, condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007, condition a www.ecliptek.com | specification subject to change without notice | rev e 8/12/2010 | page 1 of 7
ep1145hsettsc-4.94304m mechanical dimensions (all dimensions in millimeters) pin connection 1 tri-state (high impedance) 4 case/ground 5 output 8 supply voltage line marking 1 ecliptek 2 ep11ts ep11=product series 3 4.9430m 4 xxyzz xx=ecliptek manufacturing code y=last digit of the year zz=week of the year www.ecliptek.com | specification subject to change without notice | rev e 8/12/2010 | page 2 of 7 7.620 0.203 7.620 0.203 13.2 max 13.2 max 1 4 8 5 dia 0.457 0.1 (x4) 5.08 min 5.6 max 0.8 0.1 (x3) marking orient a tion output disable (high imped ance st a te) output w a veform & timing dia gram v oh v ol 80% or 2.0v dc 50% or 1.4v dc 20% or 0.8v dc f all time rise time t w t duty cycle (%) = t w /t x 100 v ih v il t plz t pzl clock output tri-st a te input
ep1145hsettsc-4.94304m www.ecliptek.com | specification subject to change without notice | rev e 8/12/2010 | page 3 of 7 supply v oltage (v dd ) t est cir cuit f or ttl output output no connect or t r i-state ground + + + + _ _ _ _ p o w er supply v oltage meter current meter 0.01 f (note 1) 0.1 f (note 1) c l (note 3) r l (note 4) p o w er supply oscilloscope f requency counter probe (note 2) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . note 4: resistance v alue r l is sho wn in t ab le 1. see applicab le specification sheet f or 'load dr iv e capability'. note 5: all diodes are mmbd7000, mmbd914, or equiv alent. t ab le 1: r l resistance v alue and c l capacitance v alue vs . output load dr iv e capability output load drive capability r l v alue (ohms) c l v alue (pf) 10ttl 5ttl 2ttl 10lsttl 1ttl 390 780 1100 2000 2200 15 15 6 15 3
ep1145hsettsc-4.94304m www.ecliptek.com | specification subject to change without notice | rev e 8/12/2010 | page 4 of 7 supply v oltage (v dd ) t est cir cuit f or cmos output output no connect or t r i-state ground + + + _ _ _ p o w er supply 0.01 f (note 1) 0.1 f (note 1) c l (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . v oltage meter current meter oscilloscope f requency counter probe (note 2)
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ep1145hsettsc-4.94304m high temperature solder bath (wave solder) ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev e 8/12/2010 | page 5 of 7
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ep1145hsettsc-4.94304m low temperature infrared/convection 185c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 185c maximum target peak temperature (tp target) 185c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev e 8/12/2010 | page 6 of 7
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ep1145hsettsc-4.94304m low temperature solder bath (wave solder) ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 245c maximum target peak temperature (tp target) 245c maximum 1 time / 235c maximum 2 times time within 5c of actual peak (tp) 5 seconds maximum 1 time / 15 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev e 8/12/2010 | page 7 of 7
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