IPD70P04P4-09 optimos ? -p2 power-transistor features ? p-channel - normal level - enhancement mode ? aec qualified ? msl1 up to 260c peak reflow ? 175c operating temperature ? green package (rohs compliant) ? 100% avalanche tested maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current i d t c =25c, v gs =-10v -73 a t c =100c, v gs =-10v 1) -52 pulsed drain current 1) i d,pulse t c =25c -292 avalanche energy, single pulse 1) e as i d =-36a 24 mj avalanche current, single pulse i as - -73 a gate source voltage v gs - 20 v power dissipation p tot t c =25 c 75 w operating and storage temperature t j , t stg - -55 ... +175 c iec climatic category; din iec 68-1 - - 55/175/56 value v ds -40 v r ds(on) 8.9 m i d -73 a product summary pg-to252-3-313 type package marking IPD70P04P4-09 pg-to252-3-313 4p0409 rev. 1.0 page 1 2010-05-26
IPD70P04P4-09 parameter symbol conditions unit min. typ. max. thermal characteristics 1) thermal resistance, junction - case r thjc - - - 2 k/w smd version, device on pcb r thja minimal footprint - - 62 6 cm 2 cooling area 2) --40 electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0v, i d = -1ma -40 - - v gate threshold voltage -v gs(th) v ds = v gs , i d =-120a 2.0 3.0 4.0 zero gate voltage drain current i dss v ds =-32v, v gs =0v, t j =25c - -0.04 -1 a v ds =-32v, v gs =0v, t j =125c 2) - -20 -200 gate-source leakage current i gss v gs =-20v, v ds =0v - - -100 na drain-source on-state resistance r ds(on) v gs =-10v, i d =-70a - 6.4 8.9 m values rev. 1.0 page 2 2010-05-26
IPD70P04P4-09 parameter symbol conditions unit min. typ. max. d y namic characteristics 1) input capacitance c iss - 3700 4810 pf output capacitance c oss - 1400 1820 reverse transfer capacitance c rss -4080 turn-on delay time t d(on) -19-ns rise time t r -12- turn-off delay time t d(off) -24- fall time t f -31- gate char g e characteristics 1) gate to source charge q gs -2026nc gate to drain charge q gd -1020 gate charge total q g -5470 gate plateau voltage v plateau - -5.4 - v reverse diode diode continous forward current 1) i s - - -73 a diode pulse current 1) i s,pulse - - -292 diode forward voltage v sd v gs =0v, i f =-70a, t j =25c - -1 -1.3 v reverse recovery time 1) t rr -50-ns reverse recovery charge 1) q rr -50-nc t c =25c values v gs =0v, v ds =-25v, f =1mhz v dd =-20v, v gs =-10v, i d =-73a, r g =3.5 v dd =-32v, i d =-70a, v gs =0 to -10v v r =-20v, i f =-50a, d i f /d t =-100a/s 1) defined by design. not subject to production test. 2) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. rev. 1.0 page 3 2010-05-26
IPD70P04P4-09 1 power dissipation 2 drain current p tot = f( t c ); v gs -6v i d = f( t c ); v gs = -10v 3 safe operating area 4 max. transient thermal impedance i d = f( v ds ); t c = 25 c; d = 0, smd z thjc = f( t p ) parameter: t p parameter: d = t p / t 1 s 10 s 100 s 1 ms 1 10 100 1000 0.1 1 10 100 -v ds [v] -i d [a] single pulse 0.01 0.05 0.1 0.5 10 0 10 -1 10 -2 10 -3 10 -4 10 -5 10 -6 10 1 10 0 10 -1 10 -2 10 -3 t p [s] z thjc [k/w] 0 20 40 60 80 0 50 100 150 200 t c [c] p tot [w] 0 20 40 60 80 0 50 100 150 200 t c [c] -i d [a] rev. 1.0 page 4 2010-05-26
IPD70P04P4-09 5 typ. output characteristics 6 typ. drain-source on-state resistance i d = f( v ds ); t j = 25 c r ds(on) = ( i d ); t j = 25 c parameter: - v gs parameter: v gs 7 typ. transfer characteristics 8 typ. drain-source on-state resistance i d = f( v gs ); v ds = -6v r ds(on) = f( t j ); i d = -70 a; v gs = -10 v parameter: t j 4 5 6 7 8 9 10 11 -60 -20 20 60 100 140 180 t j [c] r ds(on) [m ] -55 c 25 c 175 c 0 70 140 210 280 2345678 -v gs [v] -i d [a] 5v 6v 7v 8v 10v 0 70 140 210 280 0123456 -v ds [v] -i d [a] 7v 8v 10v 5 10 15 20 25 0 70 140 210 280 -i d [a] r ds(on) [m ] 6v 5v rev. 1.0 page 5 2010-05-26
IPD70P04P4-09 9 typ. gate threshold voltage 10 typ. capacitances v gs(th) = f( t j ); v gs = v ds c = f( v ds ); v gs = 0 v; f = 1 mhz parameter: - i d 11 typical forward diode characteristicis 12 drain-source breakdown voltage i f = f(v sd ) v br(dss) = f( t j ); i d = -1 ma parameter: t j 25 c 175 c 10 0 10 1 10 2 10 3 0 0.4 0.8 1.2 1.6 -v sd [v] -i f [a] ciss coss crss 10 5 10 4 10 3 10 2 10 1 0 5 10 15 20 25 30 -v ds [v] c [pf] 120a 1200a 1 1.5 2 2.5 3 3.5 4 -60 -20 20 60 100 140 180 t j [c] -v gs(th) [v] 35 36 37 38 39 40 41 42 43 44 45 -60 -20 20 60 100 140 180 t j [c] -v br(dss) [v] rev. 1.0 page 6 2010-05-26
IPD70P04P4-09 13 typ. gate charge 14 gate charge waveforms v gs = f( q gate ); i d = -73 a pulsed parameter: v dd v gs q gate q gs q gd q g v gs q gate q gs q gd q g -8v -32v 0 2 4 6 8 10 12 0 102030405060 q gate [nc] -v gs [v] rev. 1.0 page 7 2010-05-26
IPD70P04P4-09 published by infineon technologies ag 81726 munich, germany ? infineon technologies ag 2010 all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev. 1.0 page 8 2010-05-26
IPD70P04P4-09 revision history version 1.0 date 21.05.2010 changes final data sheet rev. 1.0 page 9 2010-05-26
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