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lsy a676 hyper multi sideled ? hyper-bright led 2002-08-01 1 besondere merkmale ? geh ? usetyp: wei ? es smt geh ? use besonderheit des bauteils: ideal zur einkopplung in lichtleiter; farbmischung m ? glich wellenl ? nge: 633 nm (super-rot), 587 nm (gelb) abstrahlwinkel: lambertscher strahler (120 ) technologie: ingaalp optischer wirkungsgrad: 11 lm/w (gelb), 7 lm/w (super-rot) gruppierungsparameter: lichtst ? rke verarbeitungsmethode: f r alle smt-best cktechniken geeignet l ? tmethode: ir reflow l ? ten und wellenl ? ten (ttw) vorbehandlung: nach jedec level 2 gurtung: 12 mm gurt mit 2000/rolle, ? 330 mm anwendungen einkopplung in lichtleiter hinterleuchtung (lcd, schalter, tasten, displays, werbebeleuchtung, allgemeinbeleuchtung) innenbeleuchtung im automobilbereich (z.b. instrumentenbeleuchtung, u. ? .) features package: white smt package feature of the device: ideal for coupling in light guides; color mixing is possible wavelength: 633 nm (super-red), 587 nm (yellow) viewing angle: lambertian emitter (120 ) technology: ingaalp optical efficiency: 11 lm/w (yellow), 7 lm/w (super-red) grouping parameter: luminous intensity assembly methods: suitable for all smt assembly methods soldering methods: ir reflow soldering and ttw soldering preconditioning: acc. to jedec level 2 taping: 12 mm tape with 2000/reel, ? 330 mm applications optical indicators coupling into light guides backlighting (lcd, switches, keys, displays, illuminated advertising, general lighting) interior automotive lighting (e.g. dashboard backlighting, etc.)
2002-08-01 2 lsy a676 helligkeitswerte werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 11 % ermittelt. luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of 11 %. anm.: die standardlieferform von serientypen beinhaltet eine familiengruppe. einzelne gruppen sind nicht erh?ltlich. in einer verpackungseinheit / gurt ist immer nur eine gruppe pro farbe enthalten. note: the standard shipping format for serial types includes a family group. individual groups are not available. no packing unit / tape ever contains more than one luminous intensity group per color. typ type emissions- farbe color of emission farbe der lichtaustritts- fl ? che color of the light emitting area lichtst ? rke luminous intensity i f = 20 ma i v (mcd) bestellnummer ordering code super-red yellow lsy a676 lsy a676-p+p lsy a676-p+q lsy a676-p+r lsy a676-q+q lsy a676-q+r super-red / yellow colorless clear 45 ... 112 45 ... 71 45 ... 71 45 ... 71 71 ... 112 71 ... 112 45 ... 180 45 ... 71 71 ... 112 112 ... 180 71 ... 112 112 ... 180 q62703q3374
lsy a676 2002-08-01 3 grenzwerte maximum ratings bezeichnung parameter symbol symbol werte values einheit unit ls ly betriebstemperatur operating temperature range t op ? 40 ? + 100 c lagertemperatur storage temperature range t stg ? 40 ? + 100 c sperrschichttemperatur junction temperature t j + 100 c durchlassstrom forward current i f 30 ma sto ? strom surge current t 10 s, d = 0.005 i fm 10.2a leistungsaufnahme power consumption p tot 80 mw w ? rmewiderstand thermal resistance sperrschicht/umgebung junction/ambient sperrschicht/l ? tpad junction/solder point montage auf pc-board fr 4 (padgr ?? e 16 mm 2 ) mounted on pc board fr 4 (pad size 16 mm 2 ) r th ja r th js 530 300 k/w k/w
2002-08-01 4 lsy a676 kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol werte values einheit unit ls ly wellenl ? nge des emittierten lichtes (typ.) wavelength at peak emission i f = 20 ma peak 645 591 nm dominantwellenl ? nge 1) (typ.) dominant wavelength 1) i f = 20 ma dom 633 ?6 587 ? 7/+8 nm spektrale bandbreite bei 50 % i rel max (typ.) spectral bandwidth at 50 % i rel max i f = 20 ma ? 16 15 nm abstrahlwinkel bei 50 % i v (vollwinkel) (typ.) viewing angle at 50 % i v 2 ? 120 120 grad deg. durchlassspannung 2) (typ.) forward voltage 2) (max.) i f = 20 ma v f v f 2.0 2.4 2.0 2.4 v v temperaturkoeffizient von peak (typ.) temperature coefficient of peak i f = 20 ma; ? 10 c t 100 c tc peak 0.14 0.13 nm/k temperaturkoeffizient von dom (typ.) temperature coefficient of dom i f = 20 ma; ? 10 c t 100 c tc dom 0.05 0.10 nm/k temperaturkoeffizient von v f (typ.) temperature coefficient of v f i f = 20 ma; ? 10 c t 100 c tc v ? 2.0 ? 2.5 mv/k optischer wirkungsgrad (typ.) optical efficiency i f = 20 ma opt 711lm/w 1) wellenl ? ngen werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 1 nm ermittelt. wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm. 2) durchlassspannungen werden mit einer stromeinpr ? gedauer von 1 ms und einer genauigkeit von 0,1 v ermittelt. forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ?.1 v.
lsy a676 2002-08-01 5 relative spektrale emission i rel = f ( ), t a = 25 c, i f = 20 ma relative spectral emission v( ) = spektrale augenempfindlichkeit standard eye response curve abstrahlcharakteristik i rel = f ( ? ) radiation characteristic ohl01061 400 0 20 40 60 80 100 450 500 550 600 650 700 nm % i rel v yellow super-red 0 0.2 0.4 1.0 0.8 0.6 ? 1.0 0.8 0.6 0.4 0? 10? 20? 40? 30? ohl01660 50? 60? 70? 80? 90? 100? 0? 20? 40? 60? 80? 100? 120?
lsy a676 2002-08-01 6 durchlassstrom i f = f ( v f ) forward current t a = 25 c maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current relative lichtst ? rke i v / i v(20 ma) = f ( i f ) relative luminous intensity t a = 25 c relative lichtst ? rke i v / i v(25 c) = f ( t a ) relative luminous intensity i f = 20 ma ohl00232 10 -1 1.4 1.8 2.2 2.6 3 v 3.4 0 10 1 10 10 2 5 5 ma 5 1 f v f i ohl01296 0 0 20 40 60 80 ? c 100 t i f temp. ambient temp. solder point a s t t 5 10 15 20 25 30 35 ma a t s t i ohl01062 f -1 10 v i 10 -3 -2 -1 0 1 10 10 10 10 10 0 10 1 10 2 5 5 5 55ma (20 ma) i v super-red yellow t ohl01068 0 v i -20 0 20 40 60 ? c 100 a 0.4 0.8 1.2 1.6 2.0 i v (25 ? c) yellow super-red super-red yellow
lsy a676 2002-08-01 7 zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c ls zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c ly ohl00318 f i 10 10 -5 -4 -3 10 10 -2 10 -1 10 0 s 10 1 10 2 p t 0.05 0.5 0.2 0.1 d 0.02 0.01 0.005 = -2 10 -1 10 0 10 5 5 a d t t = p t t p i f ohl00316 f i 10 10 -5 -4 -3 10 10 -2 10 -1 10 0 s 10 1 10 2 p t 0.05 0.5 0.2 0.1 d 0.02 0.01 0.005 = -2 10 -1 10 0 10 5 5 a d t t = p t t p i f
2002-08-01 8 lsy a676 ma ? zeichnung package outlines ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). gewicht / approx. weight: 76 mg gply6950 spacing (r1) 1 package marking (2.9 (0.114)) 3.8 (0.150) 4.2 (0.165) (1.4 (0.055)) 3.8 (0.150) (0.3 (0.012)) 2 2.8 (0.110) 2.4 (0.094) 2.54 (0.100) 0.9 (0.035) 1.1 (0.043) 4.2 (0.165) 3.8 (0.150) (2.4 (0.094)) 3.4 (0.134) 0.7 (0.028) (2.85 (0.112)) ac ca emission color 2 emission color 1 lsya676 led emission color 1 emission color 2 package cathode: pin 1 cathode: pin 2
lsy a676 2002-08-01 9 l ? tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 ir-reflow l ? tprofil (nach ipc 9501) ir reflow soldering profile (acc. to ipc 9501) ohly0597 0 0 50 100 150 200 250 50 100 150 200 250 300 t t ? c s 240-245 ? c 10-40 s 183 ? c 120 to 180 s defined for preconditioning: up to 6 k/s ramp-down rate up to 6 k/s ramp-up rate up to 6 k/s defined for preconditioning: 2-3 k/s
2002-08-01 10 lsy a676 wellenl ? ten (ttw) (nach cecc 00802) ttw soldering (acc. to cecc 00802) ohly0598 0 0 50 100 150 200 250 50 100 150 200 250 300 t t c s 235 c 10 s c ... 260 1. welle 1. wave 2. welle 2. wave 5 k/s 2 k/s ca 200 k/s cc ... 130 100 2 k/s zwangsk ? hlung forced cooling normalkurve standard curve grenzkurven limit curves
lsy a676 2002-08-01 11 empfohlenes l ? tpaddesign wellenl ? ten (ttw) recommended solder pad ttw soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohpy1302 4.2 (0.165) 4.5 (0.177) 1.7 (0.067) solder resist padgeometrie f ? r paddesign for improved heat dissipation verbesserte w ? rmeableitung pick up area l ? tstopplack cu fl ? che cu-area > 16 mm per pad 2
2002-08-01 12 lsy a676 empfohlenes l ? tpaddesign ir reflow l ? ten recommended solder pad ir reflow soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). gurtung / polarit ? t und lage verpackungseinheit 2000/rolle, 330 mm method of taping / polarity and orientation packing unit 2000/reel, 330 mm ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). 3.7 (0.146) 1.2 (0.047) 3.0 (0.118) cu-area > 16 mm cu-fl ? che > 16 mm paddesign for improved heat dissipation w ? rmeableitung f ? r verbesserte padgeometrie l ? tstopplack solder resist ohlpy965 2 2 ohay6822 cathode identification a c 1.5 (0.059) 4 (0.157) 2 (0.079) 8 (0.315) 4.25 (0.167) 3.95 (0.156) 5.5 (0.217) 1.75 (0.069) 12 (0.472) c a emission color 2 emission color 1
lsy a676 2002-08-01 13 published by osram opto semiconductors gmbh wernerwerkstrasse 2, d-93049 regensburg ? all rights reserved. attention please! the information describes the type of component and shall not be considered as assured characteristics. all typical data and graphs are basing on representative samples, but don t represent the production range. if requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. terms of delivery and rights to change design reserved. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. if printed or downloaded, please find the latest version in the internet. packing please use the recycling operators known to you. we can also help you get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components 1 may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 2 life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. revision history: 2002-08-01 date of change previous version: 2002-07-25 page subjects (major changes since last revision) 11 recommended solder pad (ttw soldering) 13 annotations 2002-07-25 4 value ( tc dom from 0.01 to 0.05 nm/k) 2002-07-25 12 recommended solder pad (ir reflow soldering) 2002-08-01

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