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  z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 25 (rev.00) 1 features applications description SZWW4A0A * the appearance and specifications of the product can be changed for improvement without notice. the z-power series is designed for high current ope ration and high flux output applications. it incorporates state of the art smd design and low thermal resistant material. the z power led is ideal light sources for general illumination applications, custom designed solutions, automotive , large lcd backlights and high performance torches. ? super high flux output and high luminance ? designed for high current operation ? smt solderable ? lead free product ? rohs compliant ? bulb specification
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com x 9 x 10 x 11 x 12 x 13 part number of z4 ( SZWW4A0A) x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 x 1 company s ssc x 2 package series z z-power x 3 color w warm white x 4 w x 5 z-power series number 4 z4 series x 6 lens type a dome type x 7 pcb type 0 emitter x 8 revision no. a rev0 x 9 x 10 brightness bin - - x 11 x 12 color bin - - x 13 vf bin - - 1. part number form : x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 C x 9 x 10 x 11 x 12 x 13 2. sticker diagram on reel & aluminum vinyl bag 2
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 3 outline dimensions notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.20mm
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 4 characteristics of z4 (SZWW4A0A) 1. warm white 1-1 electro-optical characteristics at 120ma 1-2 absolute maximum ratings parameter symbol value unit min typ max luminous flux [1] v [2] 100 lm correlated color temperature [3] cct - 3000 - k cri r a 80 - - forward voltage [4] v f 8.1 8.6 9.1 v thermal resistance (j to s) r j-s 5.6 k /w view angle 2 ? 135 deg. parameter symbol value unit forward current i f 240 ma power dissipation p d 2.5 w junction temperature t j 125(@ i f 240ma) oc operating temperature t opr -40 ~ +100 oc storage temperature t stg -40 ~ +100 oc esd sensitivity [5] - 6,000v hbm - *notes : [1] ssc maintains a tolerance of 10% on flux and power measurements. [2] v is the total luminous flux output as measured with an integrating sphere. [3] correlated color temperature is derived from th e cie 1931 chromaticity diagram. cct 5% tolerance. [4] tolerance is 0.06v on forward voltage measurements [5] a zener diode is included to protect the product from esd.
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 5 color spectrum t a =25 300 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 1.2 relative radiant power [a.u.] wavelength [nm] warm white
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 6 forward current vs. normalized relative luminous flux , ta=25 forward voltage vs. forward current, ta=25 forward current characteristics 0 40 80 120 160 200 240 0.0 0.5 1.0 1.5 2.0 cool white relative luminous flux [a.u] foward current [ma] 0 2 4 6 8 10 12 0 40 80 120 160 200 240 average forward current [ma] forward voltage [v]
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 7 25 50 75 100 125 0 20 40 60 80 100 120 relative luminous flux [%] junction temperature [ o c] 1. relative light output vs. junction temperature a t if=120ma, ta=25 junction temperature characteristics 2. forward voltage shift vs. junction temperature at if =120ma 25 50 75 100 125 -1.6 -1.4 -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 foward voltage variaton [vf] junction temperature [ o c]
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 8 3. color coordinate shift vs junction temperature at if=120ma, ta=25 junction temperature characteristics 0.40 0.41 0.42 0.43 0.44 0.45 0.46 0.47 0.48 0.40 0.42 0.44 0.46 60c 80c 40c 125c 100c cie y cie x 25c
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 9 radiation pattern 0 30 60 90 -80 -60 -40 -20 0 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous flux angle(deg.)
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 10 maximum forward current vs. ambient temperature 0 25 50 75 100 125 0 40 80 120 160 200 240 280 rja t = 15 o c/w rja t = 25 o c/w rja t = 35 o c/w current [ma] ambient temperature [ o c] 0 25 50 75 100 125 0 40 80 120 160 rja t = 35 o c/w rja t = 45 o c/w rja t = 55 o c/w current [ma] ambient temperature [ o c]
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 11 binning structure if=120ma, ta=25 * note red area is ansi bin. 0.40 0.42 0.44 0.46 0.48 0.36 0.38 0.40 0.42 0.44 cie y cie x h7 h6 h5 h4 h3 h2 h1 h0 h9 h8 g7 g6 g9 g8 g5 g4 g3 g2 g1 2600k 2700k 2900k 3000k 3200k g0
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 12 recommended solder pad notes : [1] all dimensions are in millimeters. [2] scale : none [3] this drawing without tolerances are for referen ce only temperature check point
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 13 reflow soldering conditions / profile * caution 1. reflow soldering should not be done more than one ti me. 2. repairs should not be done after the leds have been s oldered. when repair is unavoidable, suitable tools must be used. 3. die slug is to be soldered. 4. when soldering, do not put stress on the leds during h eating. 5. after soldering, do not warp the circuit board. 6. recommend to use a convection type reflow machine with 7 ~ 8 zones. pre-heating 200 180 150 ~ 0 [c] 220 240 260 rising 5 c/sec tm : reflow machine setting temp (max 30 sec.) ts : surface temp of pcb (min) ts : surface temp of pcb (max) ts : surface temp of pcb (recommend) cooling -5 c/sec time [ hr]
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 14 ? storage to avoid the moisture penetration, we recommend sto ring z power leds in a dry box with a desiccant . the recommended storage temperat ure range is 5c to 30c and a maximum humidity of 50%. ? use precaution after opening the packaging use proper smd techniques when the led is to be sol dered dipped as separation of the lens may affect the light output efficiency. pay attention to the following: a. soldering should be done immediately after openi ng the package (within 24hrs). b. required conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than 30% c. if the package has been opened more than 1 week or the color of the desiccant changes, components should be dried for 10-12hr at 60 5 ? do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. ? do not rapidly cool device after soldering. ? components should not be mounted on warped (non cop lanar) portion of pcb. ? radioactive exposure is not considered for the pro ducts listed here in. ? gallium arsenide is used in some of the products l isted in this publication. these products are dangerous if they are burned or shredded in the pro cess of disposal. it is also dangerous to drink the liquid or inhale the gas generated by suc h products when chemically disposed of. ? this device should not be used in any type of flui d such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) s hould be used. ? when the leds are in operation the maximum current should be decided after measuring the package temperature. ? leds must be stored properly to maintain the device . if the leds are stored for 3 months or more after being shipped from ssc, a sealed contain er with a nitrogen atmosphere should be used for storage. ? the appearance and specifications of the product m ay be modified for improvement without notice. ? long time exposure of sunlight or occasional uv ex posure will cause lens discoloration. ? the slug is isolated. ? attaching leds, do not use adhesives that outgas o rganic vapor. precaution for use
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 april. 2011 april. 2011 www.seoulsemicon.com www.seoulsemicon.com 15 the z-power led is encapsulated with a silicone res in for the highest flux efficiency. notes for handling: ? avoid touching silicone resin parts especially with sharp tools such as pincette (tweezers) ? avoid leaving fingerprints on silicone resin parts . ? silicone resin will attract dust so use covered co ntainers for storage. ? when populating boards in smt production, there ar e basically no restrictions regarding the form of the pick and place nozzle, ex cept that excessive mechanical pressure on the surface of the resin must be preven ted. ? it is not recommend to cover the silicone resin of the leds with other resin (epoxy, urethane, etc) handling of silicone resin leds


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