products for solder-to-board applications minitek? headers for pin-in-paste processes
minitek? pin-in-paste technical data unshrouded / stacking: shrouded: description m initek is fcis brand for board-to-board and wire/cable-to-board connectors in 2.00 mm pitch. the minitek product range includes pcb card connectors, shrouded and unshrouded headers and idc/ctw receptacles. fci is adding five new series of minitek headers to its product range, dedicated to pin-in-paste soldering proces- ses. this brochure gives additional information for the correct use of minitek pip connectors in the a pplication process. pin-in-paste pin-in-paste (pip) technology allows the use of tmt products in smt manufacturing processes. the connectors are automatically or manually placed on the board, then soldered in the same operation as the smt components. despite this, the mechanical strenght of the tmt soldering is maintained C still an important requirement for connectors nowadays in many industrial or automotive applications. connector design in or der to achieve optimum soldering r esults, fci launches dedicated pin-in-paste connectors in the basics+ pro- duct range. these connectors are fully adapted to pin-in-paste processing in all aspects, including plastic mate- rial, housing design, pin length, and packaging. plastic material: minitek pip headers ar e moulded in high temperature thermoplastic and are able to withstand exposur e to 260 peak temperature for 30 seconds maximum in a convection, infra-r ed or vapour phase reflow oven. housing design: standoffs raise the housing body slightly above the pcb surface and thus allow the molten solder paste to flow freely from its printed position into the board hole and around the pin. the standoffs are correctly positioned for a good solder paste deposit around the pin. please respect the stencil d esign guidelines below in order to avoid paste deposit around the standoffs. pin length: the connector lead length beyond the bottom of the pcb is shorter than for traditional tmt products. thus, the risk of pushing out the solder paste when inserting the pin into the pcb hole is very much limited. the solder paste will not stick on the pin tip or even fall off completely, but stays around the pin for free flow during soldering. fci uses a solder tail length of 2 0.2 mm for minitek headers for a standard pcb of 1.6 mm thickness. packaging: for combining smt and tmt components not only in the soldering process, but also in the assembly process, fci proposes a choice of pick-and-place packaging for pip connectors. the most common part numbers are available in tape-on-r eel packaging, all others in tube. materials housing: high temperatur e thermoplastic colour: black flammability rating: ul 94 v-o pin: phosphor br onze plating: gold and tin over 1,27 ? nickel electrical performance current rating: 1a continuous insulation r esistance: 1000 m q min. dielectric withstanding voltage: 650 v mechanical performance pin r etention: 7 n min. operating -55 to +125? temperatur e range pr ocessing information compatible with ir r eflow soldering processes rohs information this pr oduct is rohs compatible accor ding to the eur opean union dir ective 2002/95/iec reference information file no. e66906 file no. lr46923 pr oduct drawing: by 8-digit base part number product specification: dps-12-011 and gs-12-163 application specification: ta-895 reflow pr ofile: t a-842 materials housing: high temperatur e thermoplastic colour: cream flammability rating: ul 94 v-o pin: phosphor br onze plating: gold and tin over 1,27 ? nickel electrical performance current rating: 2a continuous insulation r esistance: 1000 m q min. dielectric withstanding voltage: 650 v mechanical performance pin r etention: 7 n min. operating -40 to +125? temperatur e range pr ocessing information compatible with ir r eflow soldering processes rohs information this pr oduct is rohs compatible accor ding to the eur opean union dir ective 2002/95/iec reference information file no. e66906 file no. lr46923 pr oduct drawing: by 8-digit base part num ber product specification: dps-12-011 and gs-12-163 application specification: ta-896 reflow pr ofile: t a-842
minitek? pin-in-paste application design guidelines for application in a pin-in-paste process, fci recommends the application design guidelines below. stencil design: the stencil design is crucial for a good solder joint. it determines t he quantity of paste and the position of the paste print on the board. each pcb hole has its own stencil aperture with enough spacing in between in order to have separate solder deposits. this prevents solder robbing from one hole to another and guarantees the correct quantity of solder paste for each hole. the print position is slightly asymmetrical so as to optimise the flow of molten solder paste paste application: the quantity of paste for each hole depends on the soldering p rocess parameters and the degree of hole filling. for the squeegee, fci recommends a 45 angle. you can use a smaller angle for an even greater degree of hole filling. the squeegee moves in parallel with the shorter sides of the stencil apertures. board layout: please use a hole of 0.8 mm (right angle headers) or 0.85 mm (vertical headers) 0.05 mm for an optimum paste deposit. for automatic pick-and-place, lean towards the upper end of the tolerance. refer also to ta-895 (for headers right angle shrouded and unshrouded) et ta-896 (for headers vertical shrouded and unshrouded). extract fr om application note t a-895
minitek? pin-in-paste fci - americas : 1 (800) 237 2374 - europe : 33 1 39 49 21 83 - asia/pacific : 65 6549 6666 www .fciconnect.com c d c - m i n i p i p - 0 2 / 0 7 - e f e m i n i p i p 0 2 0 7 e basics+ service program minitek is a part of the basics+ product range. basics+ program built around 2.54 mm and 2 mm pitch connectors for board-to-board, wire-to-board and cable-to-boar d applications. basics+ makes the entir e product design-in-process very simple, with easy-to-use product selection, technical hot line, fast sample service, and core range products. included are established, pr oven brands such as bergstik, dubox, quickie, minitek and bergcon pv. part number 8-digit base part number n o. of positions per row 0 2 t o 2 5 m initek unshrouded header 1 0075024 = vertical 1 0072353 = right angle u = tube without cap from 04 to 25 pos a = tape availability on request packaging g = 0.76 ? (30?) gold on contact area, 2 -6 ? (50--50?) tin on solder side f = gold flash on mating area, 2 -6 ? (50--50?) tin on solder side pin mating side solder side style mm mm 01 4.00 2.00 lf plating pin style 8-digit base part number total no. of positions 04 to 50 minitek shr ouded header 10075025 = vertical 10072354 = right angle u = tube without cap from 08 to 50 pos a = tape availability on request packaging g = 0.76 ? (30?) gold on contact area, 2-6 m (50-150?) tin on solder side f = gold flash on mating area, 2-6 ? (50--50?) tin on solder side pin mating side solder side style mm mm 01 4.00 2.00 lf plating pin style 5-digit base p art number no. of positions per row 02 to 25 minitek unshrouded stacking header 59362 = vertical stacking header packaging g = 0.76 ? (30?) gold on contact area, 0 .76 ? (30?) gold on tail t = 0.76 ? (30?) gold on contact area, 2 .54 ? (0.100?) 100 % matte tin on tail lf plating pin style u = tube without cap from 04 to 25 pos a = t ape availability on r e quest stack height xxx = mm specify mm (i.e., 037=03.7) in 0.1 mm increments pin style oal solder side mm 2 2 0 8.2 2.00 24 09.6 2.00 26 10.2 2.00 28 11.8 2.00 30 13.5 2.00 32 14.1 2.00 34 15.6 2.00 36 17.1 2.00 38 19.1 2.00 40 21.1 2.00
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