rohs eh1400sjtts-88.000m tr eh14 00 sj t ts -88.000m tr series rohs compliant 5.0v plastic j-lead smd hcmos/ttl high frequency oscillator frequency tolerance/stability 100ppm maximum package operating temperature range 0c to +70c packaging options tape & reel nominal frequency 88.000mhz pin 1 connection tri-state (disabled output: high impedance) duty cycle 50 5(%) electrical specifications nominal frequency 88.000mhz frequency tolerance/stability 100ppm maximum (inclusive of all conditions: calibration tolerance at 25c, frequency stability over the operating temperature range, supply voltage change, output load change, 1st year aging at 25c, shock, and vibration) aging at 25c 5ppm/year maximum operating temperature range 0c to +70c supply voltage 5.0vdc 10% input current 50ma maximum (no load) output voltage logic high (voh) 2.4vdc minimum with ttl load, vdd-0.4vdc minimum with hcmos load, ioh = -16ma output voltage logic low (vol) 0.4vdc maximum with ttl load, 0.5vdc maximum with hcmos load, iol = +16ma rise/fall time 4nsec maximum (measured at 0.8vdc to 2.0vdc with ttl load; measured at 20% to 80% of waveform with hcmos load) duty cycle 50 5(%) (measured at 50% of waveform with ttl load or with hcmos load) load drive capability 5ttl load or 15pf hcmos load maximum output logic type cmos pin 1 connection tri-state (disabled output: high impedance) tri-state input voltage (vih and vil) +2.2vdc minimum to enable output, +0.8vdc maximum to disable output (high impedance), no connect to enable output. absolute clock jitter 250psec maximum, 100psec typical one sigma clock period jitter 50psec maximum, 30psec typical start up time 10msec maximum storage temperature range -55c to +125c environmental & mechanical specifications esd susceptibility mil-std-883, method 3015, class 1, hbm: 1500v fine leak test mil-std-883, method 1014, condition a (internal crystal only) flammability ul94-v0 gross leak test mil-std-883, method 1014, condition c (internal crystal only) mechanical shock mil-std-202, method 213, condition c moisture resistance mil-std-883, method 1004 resistance to soldering heat mil-std-202, method 210, condition k resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010, condtion b vibration mil-std-883, method 2007, condition a www.ecliptek.com | specification subject to change without notice | rev e 3/12/2011 | page 1 of 6
eh1400sjtts-88.000m tr mechanical dimensions (all dimensions in millimeters) pin connection 1 tri-state (high impedance) 2 ground 3 output 4 supply voltage line marking 1 ecliptek 2 88.000m 3 xxxxxx xxxxxx=ecliptek manufacturing identifier 5.8 3.81 1.27 (x4) 3.0 (x4) www.ecliptek.com | specification subject to change without notice | rev e 3/12/2011 | page 2 of 6 marking orient a tion 9.8 max 14.0 max 1 2 3 4 4.7 max 0.25 min 5.080 0.203 7.620 0.203 0.510 0.203 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
eh1400sjtts-88.000m tr www.ecliptek.com | specification subject to change without notice | rev e 3/12/2011 | page 3 of 6 output disable (high imped ance st a te) output w a veform & timing dia gram v oh v ol 80% or 2.0v dc 50% or 1.4v dc 20% or 0.8v dc f all time rise time t w t duty cycle (%) = t w /t x 100 v ih v il t plz t pzl clock output tri-st a te input supply v oltage (v dd ) t est cir cuit f or ttl output output no connect or t r i-state ground + + + + _ _ _ _ p o w er supply v oltage meter current meter 0.01 f (note 1) 0.1 f (note 1) c l (note 3) r l (note 4) p o w er supply oscilloscope f requency counter probe (note 2) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . note 4: resistance v alue r l is sho wn in t ab le 1. see applicab le specification sheet f or 'load dr iv e capability'. note 5: all diodes are mmbd7000, mmbd914, or equiv alent. t ab le 1: r l resistance v alue and c l capacitance v alue vs . output load dr iv e capability output load drive capability r l v alue (ohms) c l v alue (pf) 10ttl 5ttl 2ttl 10lsttl 1ttl 390 780 1100 2000 2200 15 15 6 15 3
eh1400sjtts-88.000m tr www.ecliptek.com | specification subject to change without notice | rev e 3/12/2011 | page 4 of 6 supply v oltage (v dd ) t est cir cuit f or cmos output output no connect or t r i-state ground + + + _ _ _ p o w er supply 0.01 f (note 1) 0.1 f (note 1) c l (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . v oltage meter current meter oscilloscope f requency counter probe (note 2)
dia 50 min dia 20.2 min dia 13.0 0.2 2.5 min width 10.0 min depth t ape slot in core f or t ape star t dia 40 min access hole at slot location 1.5 min tape & reel dimensions *compliant to eia 481a eh1400sjtts-88.000m tr 24.0 0.3 11.5 0.1 10.75 0.10 4.0 0.2 2.0 0.1 12.0 0.1 b0* 1.5 +1.0/-0.0 a0* 0.3 0.1 k0* 30.4 max 360 max quantity per reel: 1,000 units 24.4 +2.0/-0.0 www.ecliptek.com | specification subject to change without notice | rev e 3/12/2011 | page 5 of 6
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eh1400sjtts-88.000m tr low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev e 3/12/2011 | page 6 of 6
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