1 is-705rh radiation hardened power-up/down microprocessor reset circuit is-705rh the radiation hardened is-705rh is a monolithic device that monitors the powe r supply voltage used by satellite control units and provides a reset output pulse during power-up and power- down. the reset threshold is 4.65v (typ) and the reset pulse width is set at 200ms (typ). a watchdog circuit is incorporated for easy interfacing with microprocessors and controllers. if the watchdog input has not been toggled within a preset 1.6s (typ) time period, an ou tput signal is generated, which can be used as an in terrupt. the power function input (pfi) may be used to monitor other voltage levels. the circuit has a 1.25v (typ) threshold and provides a pfo output when low voltage is detected. an active-low manual reset input is also provided for direct control of the reset function. constructed with the intersil uhf2x-cmos process, these devices have been specifically designed to provide highly reliable performance in harsh radiation environments. this process has been tested for single event latch-up and has demonstrated an immunity to 90mev/mg/cm 2 . specifications for rad hard qml devices are controlled by the defe nse supply center in columbus (dscc). the smd numbers listed here must be used when ordering. detailed electrical specifications for these devices are contained in smd 5962-00538. a ?hot-link? is provided on our homepage for downloading. http://www.dscc.dla.mil/ downloads/milspec/s md/00538.pdf features ? electrically screened to smd #5962-00538 ? qml qualified per mil-prf-38535 requirements ?radiation hardness - total dose . . . . . . . . . . . . . 100 krad(si) (min) - single event latch-up . . . . . . >90mev/mg/cm 2 ? precision 4.65v voltage monitor ? supply voltage range . . . . . . . . . 4.75v to 5.5v ? reset valid at v cc = 1.2v ? low supply current . . . . . . . . . . . . .420a (typ) ? 200ms (typ) reset pulse width applications ? flight computers ? controllers ? critical microprocessor power monitoring ? reliable replacement of discrete solutions pin configuration is-705rh (8 ld flatpack) top view tm mr v cc gnd pfi 1 2 3 4 8 7 6 5 wdo reset wdi pfo ordering information ordering number internal mkt. number part marking temp. range ( c ) package (pb-free) 5962r0053801v9a is0-705rh-q -55 to +125 die is0-705rh/sample is0-705rh/sample -55 to +125 die sample 5962r0053801qxc (note) is9-705rh-8 q 5962r00 53801qxc -55 to +125 8 ld flatpack, solder sl 5962r0053801vxc (note) is9-705rh-q q 5962r00 53801vxc -55 to +125 8 ld flatpack, solder sl is9-705rh/proto (note) is9-705rh/proto is9- 705rh /proto -55 to +125 8 ld flatpack, solder sl note: these intersil pb-free hermetic packaged products employ 100% au plate - e4 termination finish, which is rohs compliant and compatible with both snpb and pb-free soldering operations. caution: these devices are sensitive to electrostatic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright intersil americas inc. 2007, 2010. all rights reserved star*power? is a trademark of intersil americas inc. march 23, 2010 fn4703.6
is-705rh 2 intersil products are manufactured, assembled and tested utilizing iso9000 qu ality systems as noted in the quality certifications found at www.intersil.com/design/quality intersil products are sold by description only. intersil corporation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, th e reader is cautioned to verify that data sheets are current before placing orders. information furnished by intersil is believed to be accura te and reliable. however, no re sponsibility is assumed by inte rsil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which ma y result from its use. no licen se is granted by implication o r otherwise under any patent or patent rights of intersil or its subsidiaries. for information regarding intersil corporation and its products, see www.intersil.com fn4703.6 march 23, 2010 for additional products, see www.intersil.com/product_tree die characteristics die dimensions: 1500 mx1830m (59milsx72mils) thickness: 483m 25.4 m (19mils 1mil) interface materials glassivation type: nitride (si 3 n 4 ) over silox (sio 2 ) nitride thickness: 4.0k? 1.0k? silox thickness: 12.0k? 4.0k? top metallization to p m e t a l 3 : t i a l c u thickness: 0.8m 0.02m metal 1 and 2: tialcu thickness: 0.4m 0.01m process: uhf2x-cmos, junction isolation backside finish: silicon assembly related information substrate potential: unbiased (may be left floating or connected to gnd.) additional information worst case current density: <2.0 x 10 5 a/cm 2 metallization mask layout is-705rh note: octagonal trim pads sh ould be left unconnected. vcc (2) gnd (3) pfi (4) pfo (5) wdi (6) reset (7) wdo (8) mr (1) is-705rh
|
