lsefvg3393/t-pf doc. no : qw0905-lsefvg3393/t-pf rev. : a date : 17 - jun. - 2006 data sheet ligitek electronics co.,ltd. property of ligitek only lead-free parts pb low current durl color led lamps
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ligitek electronics co.,ltd. property of ligitek only package dimensions part no. lsefvg3393/t-pf page 1/6 + 1 - 2 + 3 1.anode green 2.common cathode 3.anode orange vg 1 2 3 sef 7.6 8.6 18.0min 10.5 0.5 2.54typ 2.0min 5.0 5.9 2.54typ 2.0min 0.5 typ 1.5 max 25% 100%75%50% -60 -30 60 100% 025%50%75% 0 30
ligitek electronics co.,ltd. property of ligitek only min. 350 luminous intensity @2ma(mcd) typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. emitted material part no peak wave length pnm --- lens 17 max. min. color spectral halfwidth nm forward voltage @ ma(v) 10 ir reverse current @5v storage temperature operating temperature tstg t opr -40 ~ +100 -40 ~ +85 absolute maximum ratings at ta=25 peak forward current duty 1/10@10khz power dissipation forward current parameter 50 90 120 pd i fp i f symbol ratings sef viewing angle 2 1/2 (deg) 40 700 40 typ. a ma mw ma unit page vg 30 120 100 565 30 21 38 dominant wave length dnm 605 --- electrostatic discharge( * ) esd 2000 v ---- static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * lsefvg3393/t-pf gap water clear green algainp orange 1.8 2.2 1.82.2 2 2/6 part no. lsefvg3393/t-pf
r e l a t i v e i n t e n s i t y @ 2 0 m a 550 0.0 0.5 wavelength (nm) 600650 500 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 10 1000 sef chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward voltage(v) 1.52.02.53.01.0 0.0 1.5 1.0 0.5 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only page3/6 part no. lsefvg3393/t-pf
r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500550 0.0 0.5 600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 fig.6 directive radiation 0 ambient temperature( ) 100 80 60 40 20-40-20 0.0 100 6080 2040 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 4/6 page fig.1 forward current vs. forward voltage forward voltage(v) typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 2.0 1.0 10 1000 vg chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 10 forward current(ma) 4.0 3.05.0 0.0 1.0 1.5 0.5 1.0 2.5 2.0 1000 100 fig.2 relative intensity vs. forward current 3.5 3.0 ligitek electronics co.,ltd. property of ligitek only part no. lsefvg3393/t-pf
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 120 0 0 25 preheat 2 /sec max 50 100 260 temp( c) 260 c3sec max 5 /sec max time(sec) 150 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile page 5/6 60 seconds max part no. lsefvg3393/t-pf
the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to see soldering well performed or not. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test high temperature high humidity test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. reference standard jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test low temperature storage test operating life test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. reliability test: test itemtest condition description page 6/6 part no. lsefvg3393/t-pf
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