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  mxt8 208 datasheet MXT8208 usb 2.0 flash disk controller data sheet MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
MXT8208 datasheet key featurs ? usb 2.0 interface compatible with mass storage device class - integrated usb 2.0 phy - supports usb high speed and full speed - suspend and resume operations most widely flash support - supports all type of nand flash devices st, hynix, samsung, toshiba, micron, infineon and renesas - supports and, ag-and, superand flash from renesas - reed-solomon encoder/decoder on-the-fly correction (5 bytes of a 528-byte block) - flash identification support - up to 16mb/s for read and 9mb/s for write operations with single channel ? supply management - single 5.0v operation - integrated 5.0v-3.3v voltage regulator - integrated 3.3v-1.8v voltage regulator ? embedded 8-bit single cycle mcu - 80c51 compatible 8-bit microprocessor ? ? usb 2.0 low-power device compliant - less than 80ma during write operation - less than 500a in suspend mode ? clock management - integrated pll for generating core and ? usb 2.0 clock sources using an external 12 mhz crystal ? development support ? complete reference design including schematics, bom and gerber files ? ? supports windows xp, windows 2k, windows me, linux and macos. drivers available for windows 98 se ? abundance gpio for application usage - up to 28 gpios - integrated i 2 c logic - integrated uart logic ?? ? flexible boot mode select - configurable boot from i 2 c logic, io logic 64bit chip id support - the 64bit chip id is unique and can be read out by user for any application purpose multi-partition support - each partition can be defined as one of cdrom, hdd, zip or secure-disk data protection ? write protect switch control ? public/private partitions support design for downgrade flash support - optimized hardware unit for fast and efficiency disk scanning - up to 5bits per 528bytes block ecc of random error - up to 5bytes per 528bytes block ecc of total error MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
mxt8 208 datasheet support wear - level arithmetic support bad block dynamic exclusion arithmetic dual - channel support for high speed application and up to 8 banks flash - up to 18mb/s write and 29mb/s read - up to 12 flash chips in series ? support serial - eeprom bootability support ? support hdd mode and zip mode d evice configurable parameters : ? usb vendor id/product id (vid/pid), serial number and usb strings with foreign language support ? scsi strings ? led outputs mode ? adjustable flash bus frequency to reach highest performance ? ? co de update in the flash or e 2 prom ?????? ??? ??? lqfp48 7 mm x7 mm l ead - free package ????? ??? ? ??? fabricated in 0.1 8 um cmos process MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
mxt8 208 datasheet table of contents 1 1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..5 2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 application schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . 1 1 4.1 parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1.1 minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1.2 typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1.3 typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1.4 loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1.5 pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.2 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 4.2.1 voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 4.2.2 current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 4.2.3 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 4.3 operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 4.3.1 general operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 4.4 supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 4.4.1 run and suspend modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 4.5 clock and timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 4.5.1 crystal oscillato r . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 4. 6 i/o port pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 4. 6 .1 general characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 4. 6 . 2 usb (universal bus interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 7 6 device ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
mxt8 208 datasheet 1 introduction the MXT8208 is a usb 2.0 h igh - speed flash drive controller. the usb 2.0 high - speed interface including phy and function supports usb 2.0 mass storage device class. the mass storage controller interface combined with the reed - solomon encoder/decoder on - the - fly correction ( 5 - byte on 5 28 - byte data blocks) provides a flexible, high transfer rate solution for interfacing a wide of range flash memory device types. the internal 60 mhz pll driven by the 12mhz oscillator is used to generate the 480mhz f requency for the usb 2.0 phy. the inte grated 80c51 mcu runs the application program from the internal rom and ram. usb data and patch code are stored in internal ram. i/o ports provide functions for eeprom, led and write protect switch control. the internal 5.0v to 3.3v and 3.3v to 1.8v voltag e regulator provides the 3.3 v and 1.8v supply voltage to the digital part of the circuit. MXT8208 has optimized internal structure and techniques designed special for mlc process. with dual - channel and up to 5 bytes ecc support, make mlc present excellence performance as slc nand flash. MXT8208 supports all the flash on the today ? s market. include normal slc/mlc nand flash, and/ ag - and and super - and flash produced by renesas, or - nand flash produce by micron. it supports 8bit/16bit bus spec, with big/small or large page type of all kinks of flash. with advanced i/o pad process, the controller can support wide i/o voltage range from 1.8v to 3.3v lvcmos logic. MXT8208 has a very flexible and configurable interface and internal resource for future flash compatibl e. MXT8208 supports boot from nand flash, i 2 c bus or gpio logic. which make support for future flash process be possible. the fir mw are can be download ed to nand flash or e 2 prom via on chip bus logic. the boot - loader reside d in the inner rom will load the outer codes if necessary. the code in the nand or e 2 prom can be used for multi - purpose. for example, implement user - defined functions such as usb finger - scanner , usb - key and usb - ad disk. in such application, mounting e 2 prom via on - chip i 2 c bus prefer to a nand flash device. MXT8208 has a uid generating unit implemented by especial process. which can generate a unique identify code for each die. the uid is 64bits long and can be read out by private command. the id can be used for the application that require s high security. for example, finance market, personal identify, high security data storage, protecting your intellectual property and so on. MXT8208 has consider this impenetrate its design cycle. now our controller has optimized hardware unit for fast a nd efficiency disk scanning. it provides scan patterns like memory bist algorithm . and there are several scan pattern can be configured by user. with our special hardware support, the disk scanning will achieved the fastest speed and highest efficiency. MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
MXT8208 datasheet the controller supports on-chip i 2 c and uart logic. together with the c51 compatible mcu core, make it very suitable for value-extended produce. the i 2 c bus and uart can be interface to many miscellaneous peripherals. the controller also provide up to 28 gpio . all the gpio can be programmed to input or output pins respectively, support to interface more i/o devices or user-defined control logic. figure 1. device block diagram MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
mxt8 208 datasheet 2 pin description figure 2. 48 - pin t qfp package pin - out led dgnd vdd18 frb fren gpio gpio gpio gpio fd17 fd16 vdd33r fd04 fd05 fd06 fd07 vdd33r fd10 fd11 dgnd fd12 fd13 fd14 fd15 fcle fd00 fd01 vdd33r fd02 fd03 xin xout resetn dgnd vdd18 fwpn fale fw en gpio frb2 test agnd dp dm vdda vreg18 vreg33 vcca5v 36 35 34 25 33 32 31 30 29 28 27 26 48 47 46 45 44 43 42 41 40 39 38 37 13 14 15 16 17 18 19 20 21 22 23 24 1 2 3 4 5 6 7 8 9 10 11 12 pin description (cont?d) ? MXT8208 compatible legend / abbreviations for tables: type: i = input, o = output, s = supply input level: a = dedicated analog input in/output level: c t = cmos 0.3v dd /0.7v dd with input trigger t t = ttl 0.8 v / 2v with schmitt trigger output level: d8 = 8ma drive d4 = 4ma drive d2 = 2ma drive MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
MXT8208 datasheet table 1. power supply lqfp48 pin pin name type description 6 agnd s analog gnd for usb plug 10 vreg18 s internal ldo 1.8v output 9 vdda s analog voltage input 3.3v 11 vreg33 s internal ldo 3.3v output 12 vcca5v s power supply input 5.0v (vbus) 14 dgnd s digital ground 15 vdd18 s core voltage input 1.8v 24 vdd33r s i/o voltage input 3.3v 29 dgnd s digital ground 32 vdd33r s i/o voltage input 3.3v 38 vdd18 s core voltage input 1.8v 39 dgnd s digital ground 45 vdd33r s i/o voltage input 3.3v table 2. control & system lqfp48 pin pin name type description 40 resetn i controller reset , low level active 5 test i test mode select 42 xin i 12mhz osc input 41 xout o 12mhz osc output table 3. usb 2.0 interface lqfp48 pin pin name type description 7 dp i/o usb2 data + 8 dm i/o usb2 data - table 4. general purpose io ports / mass storage ios lqfp48 pin pin name type main function alternate function 13 led o bus transmit led driver 47 fd00 i/o flash data bus 0 (chan.1) gpio 46 fd01 i/o flash data bus 1 (chan.1) gpio 44 fd02 i/o flash data bus 2 (chan.1) gpio 43 fd03 i/o flash data bus 3 (chan.1) gpio 36 fd04 i/o flash data bus 4 (chan.1) gpio 35 fd05 i/o flash data bus 5 (chan.1) gpio 34 fd06 i/o flash data bus 6 (chan.1) gpio 33 fd07 i/o flash data bus 7 (chan.1) gpio MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
mxt8 208 datasheet 37 fwpn o flash write protect enable active low gpio 2 fwen o flash write enable gpio 1 fale o flash address latch gpio 48 fcle o flash command latch gpio 17 fren o flash read enable gpio 16 frb i flash read/busy (chan.1) gpio 31 fd10 i/o flash data bus 0 (ch an.2) gpio 30 fd11 i/o flash data bus 1 (chan.2) gpio 28 fd12 i/o flash data bus 2 (chan.2) gpio 27 fd13 i/o flash data bus 3 (chan.2) gpio 26 fd14 i/o flash data bus 4 (chan.2) gpio 25 fd15 i/o flash data bus 5 (chan.2) gpio 23 fd16 i/o flash data b us 6 (chan.2) gpio 22 fd17 i/o flash data bus 7 (chan.2) gpio 4 frb2 i flash read/busy (chan.2) gpio 3 gpio i/o gpio 18 gpio i/o gpio 19 gpio i/o gpio 20 gpio i/o gpio 21 gpio i/o gpio MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
MXT8208 datasheet 3 application schematics figure 3. application schematic sheet MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
MXT8208 datasheet 4 electrical characteristics 4.1 parameter conditions 4.2.1 voltage characteristics without internal ldo (vcc = vdd33a = 3.3v supply) unless otherwise specified, all voltages are referred to vss (digital ground). 4.1.1 minimum and maximum values unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at t a =25c and t a =t a max (given by the selected temperature range). data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes and are not tested in production. based on characterization, the minimum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean3 ). 4.1.2 typical values unless otherwise specified, typical data are based on t a =25c, vcca5 = 5.0v or vdd33a=3.3v with internal ldo bypass. they are given only as design guidelines and are not tested. 4.1.3 typical curves unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 4.1.4 loading capacitor the loading conditions used for pin parameter measurement are shown in figure 4. figure 4. pin loading conditions 4.1.5 pin input voltage the input voltage measurement on a pin of the device is described in figure 5. figure 5. pin input voltage 4.2 absolute maximum ratings stresses above those listed as ?absolute maximum ratings?may cause permanent damage to the device. this is a stress rating only and functional operation of the device under these conditions is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
mxt8 208 datasheet table 5 4.2. 1 voltage characteristics with internal ldo (vcc = vcca5 = 5.0v supply) t able 6 symbol ratings max. value unit vcca5 supply voltage 5.5 v dp dm input voltage on pin 5.5 v v in input voltage on other pin 3.6 v v esd (hbm) esd for human body mode 2000 v v esd (mm) esd for machine mode 200 v 4.2.2 current characteristics (digit al parts) table 7 symbol ratings max. value unit i vdd33 total current into vdd33 lines (source) 6 5 ma i vss total current out of vss ground lines (sink) 6 5 ma 4.2.3 thermal characteristics table 8 symbol ratings min. value max. value unit t stg storag e temperature range - 40 125 to t operating temperature 0 70 4.3 operating conditions 4.3.1 general operating conditions without internal ldo table 9 symbol parameter conditions min max unit vdd33 power supply 3.0 3.6 v ta ambient temperature range 0 70 4.3.1 general o perating conditions with internal ldo table 10 symbol parameter conditions min max unit symbol ratings max. value unit vdd3 3a supply voltage 3.6 v dp dm input voltage on pin 5.5 v v in input voltage on other pin 3.6 v v esd (hbm) esd for human body mode 2000 v v esd (mm) esd for machine mode 200 v MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
MXT8208 datasheet vcca5 power supply 4.5 5.5 v ta ambient temperature range 0 70 4.4 supply current characteristics 4.4.1 run and suspend modes table 11 symbol parameter conditions min typ max unit i dd supply current in run mode fosc = 12m 55 ma i dd supply current in suspend mode vreg33=3.3v ta = +25 250 a 4.5 clock and timing characteristics subject to general operating conditions for v dd33 , f osc , and t a . 4.5.1 crystal oscillator the device internal clock is supplied from a crystal oscillator. all the information given in this paragraph are based on characterization results with specified typical external components. in the application the load capacitors have to be placed as close as possible to the oscillator pins in order to minimize output distortion and start-up stabilization time. refer to the crystal manufacturer for more details (frequency, package, accuracy...). table 12 symbol parameter conditions min typ max unit f osc oscillator frequency 12 mhz ck acc total crystal oscillator accuracy abs. value + temp + ag 60 ppm osc crystal oscillator duty cycle 45 50 55 % figure 6. typical application with a crystal MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
mxt8 208 datasheet note 1. the crystal osci llator duty cycle has to be adjusted through the two c l capacitors. refer to the crystal manufacturer for more details. typically, c l = 1 2pf 2. r l = 1m for matching internal pll (opt.) 3. depending on the crystal power dissipation, a serial resistor r so scout may be added. refer to the crystal manufacturer for more details. (opt.) 4. 6 i/o port pin characteristics 4.6.1 general characteristics subject to general operating conditions for vdd33, f osc , and t a unless otherwise specified. table 13 symbol param eter conditions min typ max unit v il input low level voltage 0.4 v v ih input high level voltage 1.5 v v hys schmitt trigger voltage hysteresis 1) ttl ports mv i l input leakage current v ss v in v dd33 , standard i/os 1 a r pu weak pull - up equivalent resistor 2) v in = v ss v dd33 =3.3v 4.7 60 k notes: 1. hysteresis voltage between schmitt trigger switching levels. based on characterization results, not tested in production. 2. the r pu pull - up equivalent resistor is based on a resistive transistor. this data is based on characterization results, tested in production at v dd33 max. figure 7 . two typical applications with unused i/o pin MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
MXT8208 datasheet 4.6.2 usb (universal bus interface) table 14. usb interface: dc characteristics usb dc electrical characteristics symbol parameter conditions min. typ. max. unit i ddsuspend suspend current vdd33=3.3v, regulator on and phy off 0.2 1) 0.25 1) ma r pu pull-up resistor 1) 4.7 60 k full speed mode (dp / dm) v oh high level output voltage 3 v v ol low level output voltage 0.2 v v crs crossover voltage 1.4 1.9 v high speed mode (dp / dm) v hsoh hs data signalling high 400 mv v hsol hs data signalling low 10 mv notes: 1. not tested in production, guaranteed by characterization. 2. in order to reach this value, the software must force the regulator into power down mode and the i/os compensation cell off. table 15. usb interface: timing usb dc electrical characteristics symbol parameter conditions min. max. unit full speed mode (dp / dm) t fr rise time c l =50pf 10 15 ns t ff fall time c l =50pf 10 15 ns high speed mode (dp / dm) t hsr rise time r l =45 500 1) ps t hsf fall time r l =45 500 1) ps t hsdrat hs data rate 480 mb/s notes: 1. not tested in production, guaranteed by characterization. MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/
MXT8208 datasheet 5 package mechanical data figure 8. 48-pin thin quad flat package 6 device ordering information table 16. feature comparison table (sample) part number package operation voltage temperature range MXT8208 lqfp\lqfp48 7mmx7mm 3.0v ~ 3.6v 0 ~ 70 part number product info. memo MXT8208 usb2.0 disk controller usb2.0 mass storage disk controller MXT8208 ?y?_?u5[p?m?w3? g ?pqls? e_?[xp?ow[ www.datasheet.co.kr datasheet pdf - http://www..net/


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