1/4 rev. a structure silicon monolithic integrated circuit product name overvoltage protection controller with internal fet model name BD6042GUL features overvoltage protection up to 28v internal low ron (125m ) fet over voltage lockout (ovlo) under voltage lockout(uvlo) internal 2msec startup delay over current protect thermal shut down small package: vcsp50l1(1.6mm x 1.6mm, height=0.55mm) absolute maximum ratings (ta=25 ) contents symbol rating unit conditions input supply voltage 1 vmax1 -0.3 30 v in input supply voltage 2 vmax2 -0.3 7 v other power dissipation pd 725 mw operating temperature range topr -35 +85 storage temperature range tstr -55 +150 1 when using more than at ta=25 , it is reduced 5.8 mw per 1 . rohm specification board 50mm 58mm mounting. operating range (ta=-35 +85 ) parameter symbol range unit usage input voltage range v in 2.2 28 v this product is not especially designed to be protected from radioactivity. status of this document. the japanese version of this document is the formal specificati on. a customer may use this translation version only for reference to help reading the formal version. if there are any differences in translation version of this doc ument, formal version takes priority.
2/4 rev. a electrical characteristics (unless otherwise noted, ta = 25 c, in=5v) parameter symbol rating unit conditions min. typ. max. electrical input voltage range vin - - 28 v supply quiescent current icc 45 90 timings start up delay ton - 2 4 msec ok going up delay tok - 10 15 msec output turn off time toff - 2 10
3/4 rev. a block diagram pin number/pin name pin descriptions pin name function a2, a3 b2, b3 in1, 2, 3, 4 input voltage pin. a 1 package dimensions (vcsp50l1) pin number pin name a2 in1 a3 in2 b2 in3 b3 in4 a1 out1 b1 out2 c3 gnd c1 ok c2 en 6042 lot no.
4/4 rev. a use-related cautions (1) absolute maximum ratings if applied voltage (vdd, vin), operating temperature range (topr), or other absolute maxi mum ratings are exceeded, there is a risk of damage.since it is not possible to identify s hort, open, or other damage modes, if sp ecial modes in which absolute maximum rati ngs are exceeded are assumed, consider applying fuses or other physical safety measures. (2) recommended operating range this is the range within which it is possible to obtain roughly the expected characteristics. for electrical characteristics, it is those that are guaranteed under the conditions for each parame ter. even when these ar e within the recommended operating range, voltage and te mperature characteristics are indicated. (3) reverse connection of power supply connector there is a risk of damaging the lsi by reverse connection of the power supply connector. for protection from reverse connectio n, take measures such as externally placing a diode between the pow er supply and the power supply pin of the lsi. (4) power supply lines in the design of the board pattern, make pow er supply and gnd line wiring low impedance. when doing so, although the digital power suppl y and analog power supply are the same po tential, separate the digital power sup ply pattern and analog power supply pattern to deter digita l noise from entering the analog power suppl y due to the common impedance of the wir ing patterns. similarly take pattern design into account for gnd lines as well. furthermore, for all power supply pins of the lsi, in conjunction with inserting capacitors between power supply and gnd pins, when using electrolytic capacitors, determine constant s upon adequately confirming that capacitanc e loss occurring at low temperatures is not a problem for various characteristics of the capacitors used. (5) gnd voltage make the potential of a gnd pin such that it will be the lowest potential even if operating below that. in addition, confirm t hat there are no pins for which the potential becomes less than a gnd by actually including transition phenomena. (6) shorts between pins and misinstallation when installing in the set board, pay adequate attention to orientation a nd placement discrepancies of the lsi. if it is insta lled erroneously, there is a risk of lsi damage. there also is a risk of damage if it is shorted by a foreign substa nce getting between pins or betwee n a pin and a power supply or gnd. (7) operation in strong magnetic fields be careful when using the lsi in a strong magnetic field, since it may malfunction. (8) inspection in set board when inspecting the lsi in the set board, since there is a risk of stress to the lsi when capacitors are connected to low imped ance lsi pins, be sure to discharge for each proce ss. moreover, when getting it on and off of a jig in the inspection process, always connect it after turning off the power supply, perform the inspection, and re move it after turning off the power supply. furthermore, as countermeasures agains t static electricity, use grounding in the assembly process and take appropriate care in transport and storage. (9) input pins parasitic elements inevitably are formed on an lsi structure due to potential relationships. because parasitic elements operat e, they give rise to interference with circuit operation and may be the cause of malfunc tions as well as damage. accordingly, take care not to appl y a lower voltage than gnd to an input pin or use the lsi in other ways such that parasi tic elements operate. moreove r, do not apply a voltage t o an input pin when the power supply voltage is not being applied to the lsi. furthermore, when the power supply voltage is being applied, ma ke each input pin a voltage less than the power supply voltage as well as within the guaranteed values of electrical ch aracteristics. (10) ground wiring pattern when there is a small signal gnd and a large current gnd, it is recommended that you separate the large current gnd pattern and small signal gnd pattern and provide single point grounding at the reference point of the set so that voltage variation due to resistance co mponents of the pattern wiring and large currents do not cause the small signal gnd voltage to change. take care that the gnd wiring pattern o f externally attached components also does not change. (11) externa lly attached capacitors when using ceramic capacitors for externa lly attached capacitors, determine constant s upon taking into account a lowering of th e rated capacitance due to dc bias and capacitance change due to factors such as temperature. (12) thermal shutdown circuit (tsd) when the junction temperature reaches the defined value, the ther mal shutdown circuit operates and turns a switch off. the the rmal shutdown circuit, which is aimed at isolating the lsi from thermal runawa y as much as possible, is not aimed at the protection or guaran tee of the lsi. therefore, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there are adequate margins by taking into account the permissibl e dissipation (pd) in actual st ates of use.
appendix-rev4.0 thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact your nearest sales office. rohm customer support system the americas / europe / asia / japan contact us : webmaster@ rohm.co. jp www.rohm.com copyright ? 2009 rohm co.,ltd. 21 saiin mizosaki- cho, ukyo-ku, kyoto 615-8585, japan tel : +81-75-311-2121 fax : +81-75-315-0172 appendix notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when de signing circuits for mass production. great care was taken in ensuring the accuracy of the information specified in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no re- sponsibility for such damage. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exer cise intellectual property or other rights held by rohm and other parties. rohm shall bear no re- sponsibility whatsoever for any dispute arising from the use of such technical information. the products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, elec- tronic ap pliances and amusement devices). the products are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possi bility of physical injury, fire or any other damage caused in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which re quires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intend- ed to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specified herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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