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document number: mc33812 rev. 4.0, 7/2009 freescale semiconductor advance information * this document contains certain information on a new product. specifications and information herein are subject to change without notice. ? freescale semiconductor, in c., 2009. all rights reserved. multifunctional ignition and injector driver the 33812 is an engine control analog power ic intended for motorcycle and other single/dual cylinder small engine control applications. the ic consists of th ree integrated low side drivers, one pre-driver, a +5.0 v, voltage pre-re gulator, an mcu watchdog circuit, an iso 9141 k-line interface, and a parallel interface for mcu communication. the three low side drivers are provided for driving a fuel injector, a lamp or led, and a relay or other load. the pre-driver is intended to drive either an insula ted gate bipolar transistor (igbt) or a bipolar darlington transistor to control an ignition coil. features: ? designed to operate over the range of ~4.7 v v pwr 36 v ? fuel injector driver - current limit - 4.0 a typical ? ignition pre-driver can drive igbt or darlington bipolar junction transistors ? ignition pre-driver has independent high and low side outputs ? relay driver - current limit - 4.0 a typical ? lamp driver- current limit - 1.5 a typical ? all external outputs protected agai nst short to battery, over-current ? ignition and other drivers prot ected against over-temperature ? interfaces directly to mcu using 5.0 v parallel interface ? vcc voltage pre-regulator provides +5.0 v power for the mcu ? mcu power on reset generator ? mcu watchdog timer circuit with parallel refresh/time setting line ? independent fault annunciation outputs for ignition, injector and relay drivers ? iso-9141 k-line transceiver for communicating diagnostic messages ? pb-free packaging designated by suffix code ek figure 1. 33812 simplified application diagram small engine control ic 33812 *note: aec qualified for automotive applications ordering information device temperature range (t a ) package mcz33812ek/r2 -40 to 125c 32 soicw-ep * pcz33812aek/r2 ek pb-free suffix 98asa10556d 32 pin soicw ep mrx 33812 v bat lampout mcu reset rout relay or mil v bat reset vcc mtx injin vccsens dgnd +5 v ignin ignouth iso9141 iso9141 ignfb vccref injout injector v bat v bat gpio rxd txd pgnd1,2 wd_inh tm_en, test2 gpio gpio wdrfsh injflt ignflt gpio gpio lampin rin gpio gpio v bat ignsup pnp ignoutl (igbt driver shown) other load v pwr note: surge voltage protection recommended on vpwr gpio relflt +5 v vpwr
analog integrated circuit device data 2 freescale semiconductor 33812 figure 2. 33812 simplified application diagram (darlington mode) mrx 33812 v bat lampout mcu reset rout relay or mil v bat reset vcc mtx injin vccsens dgnd +5 v ignin ignouth iso9141 iso9141 ignfb vccref injout injector v bat v bat gpio rxd txd pgnd1,2 wd_inh tm_en, test2 gpio gpio wdrfsh injflt ignflt gpio gpio lampin rin gpio gpio v bat ignsup pnp ignoutl (darlington other load +5 v gpio relflt +5 v vpwr driver shown)
analog integrated circuit device data freescale semiconductor 3 33812 figure 3. 33812 simplifi ed internal block diagram v pwr , v cc oscillator injin vpwr ignin ~50 a ~50 a logic control gate control current limit temperature limit short protection open det. on injector + r s llimit vclamp ? relay and ~75a injout vccref band gap parallel control under-voltage por, over-voltage v10.0 analog v2.5 logic bias rout vccsens + r s llimit vclamp ? gate control current limit temperature limit short protection iso9141 controller mrx mtx lampout v cc iso9141 ~50 a ~50 a lamp output ignition ignsup predriver ignfb gnd test3 test1 pgnd1 pgnd2 dgnd ignflt watchdog reset v cc injflt lampin wdrfsh rin ~50 a v cc ~50 a v cc ~50 a ~50 a ~50 a ignouth short protection ignoutl injector output test2 wd_inh v cc ~50 a ~50 a relflt v cc ~50 a (open drain) tm_en ~50 a *note: pull up and pull down current sources are ~50 a unless otherwise noted
analog integrated circuit device data 4 freescale semiconductor 33812 pin connections pin connections figure 4. 33812 pin connections gnd ignoutl ignouth ignsup ignfb iso9141 vccsens vccref vpwr reset injflt relflt ignflt injin rin lampin ignin test3 test2 test1 wd_inh n.c. injout pgnd1 dgnd lampout pgnd2 rout n.c. tm_en wdrfsh mrx mtx 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 table 1. 33812 pin definitions pin pin name pin function formal name description 1 ignoutl output ignition output low low side output to drive gate/base of igbt/bipolar darlington 2 ignouth output ignition output high high side output to drive gate/b ase of igbt/bipolar darlington 3 ignsup input ignition output supply tie to +5 v for darlington, tie to the v pwr supply for igbt output device 4 ignfb input feedback from source voltage feedback from source of i gnition driver transistor through 10:1 voltage divider 5 iso9141 input/output iso9141 k-line bidirectional serial data signal the iso9141 pin is v pwr level in/out signal connected to external ecu tester using iso9141 protocol.the output is open drain and the input is a ratiometric v pwr level threshold comparator 6 vccsens input voltage sense from vcc feedback to internal vcc regulator from external pass transistor 7 vccref output vcc reference base drive base drive voltage for external pnp pass transistor 8 vpwr supply input main voltage supply input vpwr is the main voltage supply input for the device. connected to +12 volt battery (it should have reverse battery protection and transient suppression.) 9 reset output reset output to mcu logic level reset signal used to reset the mcu when the watchdog circuit times out, during under voltage condition on vcc and for initial power up and power down 10 injflt output injector fault logic level output to mcu indicating any fault in the injector circuit. 11 relflt output relay fault logic level output to mcu indicating any fault in the relay circuit. 12 ignflt output ignition fault logic level output to mcu indicating any fault in the ignition circuit. 13 injin input injector parallel input logic level input from the mcu to c ontrol the injector driver output 14 rin input relay parallel input logic level parallel input to activate relay output, rout 15 lampin input lamp parallel input logic level parallel input to activate the malfunction indicator lamp output, lamp 16 ignin input ignition parallel input logic level input from m cu controlling the ignition coil current flow and spark. 17 mtx input iso9141 mcu data input input logic level iso9141 data from the mcu to the iso9141 in/out pin
analog integrated circuit device data freescale semiconductor 5 33812 pin connections 18 mrx output low side driver output output logic level iso9141 data to t he mcu from the iso9141 in/out pin 19 wdrfsh input watchdog refresh logic level input from mcu to refr esh the watchdog circuit to prevent reset 20 tm_en input test mode enable used by freescale test engineer ing, tie to gnd in operation 21 n.c. unused ------- unused pin, leave open 22 rout output relay driver output low side relay driver output driven by parallel input rin 23 pgnd2 ground power ground 2 ground for relay driver output 24 lampout output warning lamp output low side driver output for mil (war ning lamp) driven by parallel input lampin 25 dgnd ground supply ground tied to ground plane, used for ground for all low power signals 26 pgnd1 ground power ground 1 ground for injout injector driver output 27 injout output injector driver output low side driver output for injector driven by parallel input injin 28 n.c. unused ------- unused pin, leave open 29 wd_inh input watch dog inhibit normally tied to gnd, if tied high through a pull-up, it inhibits reset from a watchdog time-out 30 test1 input test 1 must be tied to gnd. 31 test2 input test 2 must be tied to gnd. 32 test3 input test 3 must leave open. ep gnd ground substrate ground should be tied to dgnd. table 1. 33812 pin definitions pin pin name pin function formal name description
analog integrated circuit device data 6 freescale semiconductor 33812 electrical characteristics maximum ratings electrical characteristics maximum ratings table 2. maximum ratings all voltages are with respect to grou nd, unless otherwise noted. exceeding these ratings may cause a malfunction or permanent damage to the device. rating symbol value unit vpwr supply voltage (1) v pwr -0.3 to 45 v dc logic input voltage (mtx , injin, ignin, wdrfsh, lampin, rin) v il -0.3 to v cc v dc injector and relay low side driver drain voltage (v injout ) v injout v relout -0.3 to v clamp_inj -0.3 to v clamp_rel v dc lamp low side driver drain voltage (lampout) lamp out -0.3 to v clamp_lamp v dc output clamp energy (inj out and rout) (single pulse) t junction = 150c, i out = 1.5 a e clamp_inj_sp e clamp_rel_sp 100 mj output clamp energy (injou t and rout) (continuous operation) t junction = 125c, i out = 1.0 a, (max. frequency is 70 hz , maximum duty cycle 90%) e clamp_inj_cp e clamp_rel_cp 100 mj output continuous current (injout and rout) t junction = 150c i occ_max 2.0 a output clamp energy (lampout) (single pulse) - t junction = 150c, i out = 0.5 a e clamp_lamp_sp 35 mj esd voltage (2) human body model machine model charge device model (corner pins) charge device model v esd1 v esd2 v esd3 v esd4 2000 200 750 500 v thermal ratings operating temperature ambient junction case t a t j t c -40 to 125 -40 to 150 -40 to 125 c storage temperature t stg -55 to 150 c power dissipation (t a = 25 c) (5) p d 1.7 w peak package reflow temperature during solder mounting (3) , (4) t solder note 4 c thermal resistance junction-to-ambient junction- to-lead junction-to-flag r ja r jl r jc 75 8.0 1.2 c/w notes 1. exceeding these limits may cause malf unction or permanent damage to the device. 2. esd testing is performed in accordanc e with the human body model (hbm) (c zap = 100 pf, r zap = 1500 ), the machine model (mm) (c zap = 200 pf, r zap = 0 ), and the charge device model (cdm), robotic (c zap = 4.0 pf). 3. pin soldering temperature limit is for 10 seconds maximum dur ation. not designed for immersion soldering. exceeding these lim its may cause malfunction or permanent damage to the device. 4. freescale?s package reflow capability meets pb-free requirem ents for jedec standard j-std-020c. for peak package reflow temperature and moisture sensitivity levels (msl), go to www.frees cale.com, search by part number [e.g. remove prefixes/suffixe s and enter the core id to view all orderable parts (i .e. mc33xxxd enter 33xxx), and review parametrics. 5. this parameter is guaranteed by design but is not production tested.
analog integrated circuit device data freescale semiconductor 7 33812 electrical characteristics static electrical characteristics static electrical characteristics static electrical characteristics characteristics noted under conditions of 7.0 v v pwr 18 v, -40 c t c 125 c, unless otherwise noted. where applicable, typical values reflect the par ameter?s approximate average value with v pwr = 14 v, t a = 25 c. characteristic symbol min typ max unit power input (vpwr) supply voltage (measured at vpwr pin) (7) fully operational full parameter specification v pwr( fo ) v pwr( fp ) 4.7 7.0 ? 36 18 v supply current - all outputs disabled (normal mode) i vpwr( on ) ? 10.0 14.0 ma v pwr over-voltage shutdown threshold voltage (8) v pwr( ov) 36.5 39 42 v v pwr over-voltage shutdown hysteresis voltage v pwr(ov-hys) 0.5 1.5 3.0 v v pwr under-voltage shutdown threshold voltage (8) v pwr( uv) 3.0 3.7 4.4 v v pwr under-voltage shutdown hysteresis voltage v pwr( uv-hys) 100 200 300 mv voltage regulator outputs (vccref, vccsens) vccsens (vcc) output voltage (measured with external output pnp (fzt753 typical) transistor and 500 load on vccsens) v sens 4.9 5.0 5.1 v vccref output current (9) i vccref ?-5.0?ma vccref current limit i vcccl 5.0 15 20 ma output capacitance external (ceramic, low esr recommended) v oce 2.2 ? ? f vccsens input current i vccsens ? 50 1000 a line regulation (external output pnp transistor and 500 load on vccsens) reg line _ vcc ?225mv load regulation (external output pnp transistor and 500 load on vccsens) reg load_vcc ?225mv dropout voltage (minimal input/output voltage at full load) v dropout ? 46 200 mv v cc under-voltage reset threshold voltage reset uv_vcc 4.5 4.7 4.9 v low side driver (injout and rout) output fault detection voltage threshold (10) outputs programmed off (open load, injector/relay) outputs programmed on (short to battery) v out(flt-th) 2.0 2.5 3.0 v output off open load detection current (injector/relay) v drain = 18 v, outputs programmed off i (off)oco 40 75 150 a notes 6. device is functional provided t j is less than 150 c. some table parameters may be out of specification. 7. over-voltage thresholds minimu m and maximum include hysteresis. 8. under-voltage thresholds minimu m and maximum include hysteresis, for disabling outputs only, reset based on vcc under-voltage 9. this parameter is guaranteed by design, however is not production tested. 10. output fault detect thresholds are the same for output open and shorts.
analog integrated circuit device data 8 freescale semiconductor 33812 electrical characteristics static electrical characteristics low side driver (injout and rout) (continued) drain-to-source on resistance i out =1.0 a, t j = 125c, v pwr =14 v i out =1.0 a, t j = 25c, v pwr =14 v i out =1.0 a, t j = -40c, v pwr =14 v r ds (on)-inj/rel r ds (on)-inj/rel r ds (on)-inj/rel ? ? ? ? 0.25 0.2 0.4 ? ? output self limiting current i out(lim)-inj/rel 3.0 ? 6.0 a output clamp voltage - i d = 20 ma v clamp_inj/rel 48 53 58 v output leakage current (injout) v drain = 24 v, (note: open load detection current can?t be disabled) i out(lkg)-inj ??1.0 ma output leakage current (rout) v drain = 24 v, (note: open load detection current can?t be disabled) i out(lkg)-rel ??1.0 ma over-temperature shutdown (11) t lim-inj/rel 155 ? 190 c over-temperature shutdown hysteresis (11) t lim(hys)-inj/rel 5.0 10 15 c low side driver (lampout) drain-to-source on resistance i out = 300 ma, t j = 150 c, v pwr = 14 v r ds (on)lamp ??1.0 output self limiting current i out(lim)-lamp 1.0 ? 2.5 a output clamp voltage - i d = 20 ma v clamp-lamp 48 53 58 v output leakage current (11) v drain = 24 v, (note: no open load detection current) i out(lkg)-lamp ??20 a output fault detection voltage threshold (11) outputs programmed on (short to battery) v out(flt-th)-lamp 2.0 2.5 3.0 v over-temperature shutdown (11) t lim-lamp 155 ? 190 c over-temperature shutdown hysteresis (11) t lim(hys)-lamp 5.0 10 15 c notes 11. this parameter is guaranteed by design, however is not production tested. static electrical charact eristics (continued) characteristics noted under conditions of 7.0 v v pwr 18 v, -40 c t c 125 c, unless otherwise noted. where applicable, typical values reflect the par ameter?s approximate average value with v pwr = 14 v, t a = 25 c. characteristic symbol min typ max unit
analog integrated circuit device data freescale semiconductor 9 33812 electrical characteristics static electrical characteristics ignition (igbt/darlington) driver paramet ers (ignoutl, ignouth, ignfb, ignsup) drain-to-source on resistance (ignoutl output, gate/base drive turn off resistance) r ds_l(on) 150 300 400 drain-to-source on resistance (ignsup to ignouth output, gate/base drive turn on resistance) r ds_h(on) ?7090 ignition output high source current (ignouth) i gatedrive_h 40 50 ? ma ignition output high (ignouth) device power dissipation (12) pd_ignouth ? ? 300 mw output fault detection voltage threshold (12) (at ignfb pin, not at input of 10:1 voltage divider) output programmed off (open load) output programmed on (short to battery) v ignfb_ out(flt-th) 100 250 400 mv feedback sense current (fbx input current) fbx = 2.0 v, output programmed off i fbx(flt-sns) ??1.0 a ignsup voltage for: igbt (12) darlington (12) v ignsup_igbt v ignsup_darl ? ? v pwr 5.0 v pwr_max v cc_max v over-temperature shutdown on ignouth and ignoutl (12) t lim-ignouth,l 155 ? 190 c over-temperature shutdown hysteresis on ignouth and ignoutl (13) t lim(hys)- ignouth,l 5.0 10 15 c iso9141 transceiver parameters (iso9141) input low voltage at iso i/o pin v il_iso ? ? 0.3xvpwr v input high voltage at iso i/o pin v ih_iso 0.7*vpwr ? ? v input hysteresis at iso i/o pin v hyst_iso 0.15xvpwr ? ? output low voltage at iso i/o pin v ol_iso ? ? 0.2xvpwr v output high voltage at iso i/o pin v oh_iso 0.8xvpwr ? ? v output current limit at iso i/o pin (mtx = 0) i lim_iso 50 100 150 ma load capacitance at iso i/o pin (13) c l_iso 0.01 3.0 10 nf digital outputs (mrx, ignflt, relflt, injflt) output logic high-voltage levelled i oh =1.0 ma load) v oh 0.8 x v cc ?v cc + 0.2 v output logic low-voltage level (at i ol =1.0 ma load) v ol gnd ? 0.1 x v cc v digital output (reset ) resistance of internal pull-down resistor on open drain reset pin r reset 100 ? 500 k notes 12. these parameters are guaranteed by design. 13. this parameter is guaranteed by desi gn, however it is not production tested. static electrical charact eristics (continued) characteristics noted under conditions of 7.0 v v pwr 18 v, -40 c t c 125 c, unless otherwise noted. where applicable, typical values reflect the par ameter?s approximate average value with v pwr = 14 v, t a = 25 c. characteristic symbol min typ max unit
analog integrated circuit device data 10 freescale semiconductor 33812 electrical characteristics static electrical characteristics digital inputs (mtx, injin, ignin, lampin, wdrfsh, rin, wd_inh) input logic high-voltage thresholds v ih 0.7 x v cc ?v cc + 0.3 v input logic low-voltage thresholds v il gnd - 0.3 ? 0.2 x v cc v input logic voltage hysteresis v ihys 0.5 ? 1.5 v input logic capacitance (14) c in ? ? 20 pf input logic pull-down current (all except mtx) - 0.8 v to 5.0 v i logic_pd 30 50 100 a input logic pull-up current (mtx only) - 0.8 v to 5.0 v i logic_pu -30 -50 -100 a notes 14. these parameters are guaranteed by design. static electrical charact eristics (continued) characteristics noted under conditions of 7.0 v v pwr 18 v, -40 c t c 125 c, unless otherwise noted. where applicable, typical values reflect the par ameter?s approximate average value with v pwr = 14 v, t a = 25 c. characteristic symbol min typ max unit
analog integrated circuit device data freescale semiconductor 11 33812 electrical characteristics dynamic electrical characteristics dynamic electrical characteristics dynamic electrical characteristics characteristics noted under conditions of 7.0 v v pwr 18 v, -40 c t c 125 c, unless otherwise noted. where applicable, typical values reflect the parameter?s approximate average value with v pwr = 14 v, t a = 25 c. characteristic symbol min typ max unit power input required low state duration on vpwr for under-voltage detect v pwr v pwr_uv (15) t uv 1.0 ? ? s watchdog timer maximum time value watchdog can be loaded with wd max ? ? 10 s maximum wdrfsh pulse width to load full watchdog time value wd load ? ? 1.0 ms minimum pulse width on wdrfsh to refresh watchdog timer wdrfsh min 1.0 ? ? s reset pulse width when watchdog times out wd reset 100 ? ? s iso9141 transceiver typical iso9141 data rate (15) iso br ? 10 ? kbps turn off delay mtx input to iso output t txdf ? ? 2.0 s turn on/off delay iso input to mrx output t rxdf , t rxdr ? ? 1.0 s rise and fall time mrx output (measured from 10% to 90%) t rxr , t rxf ? ? 1.0 s maximum rise and fall time mtx input (measured from 10% to 90%) (15) t txr , t txf ? ? 1.0 s lamp driver inrush current blanking time (lampout only) t oc(blank) 5.0 7.0 9.0 ms lampout, automatic retry timer duri ng short to battery fault condition t retry_lamp 7.0 10 13 ms digital logic outputs injflt, ignflt output signal rise time (15) t r(dlo) ? 100 200 ns injflt, ignflt output signal fall time (15) t f (dlo) ? 100 200 ns injector and relay driver output on current limit fault filter timer t sc 30 60 90 s output off open circuit fault fi lter timer (injector and relay driver) t (off)oc 100?400s output slew rate - rise - z load = 14 , v load = 14 v t sr(rise) 1.0 5.0 10 v/ s output slew rate - fall - z load = 14 , v load = 14 v t sr(fall) 1.0 5.0 10 v/ s ignition pre-driver output off open circuit fault filter timer t (off)oc 100?400s output on short-circuit to battery fault detection timer t (on) (sc) 30 60 90 s notes 15. this parameter is guaranteed by design, however is not production tested.
analog integrated circuit device data 12 freescale semiconductor 33812 functional description functional pin description functional description functional pin description supply input (vpwr) the v pwr pin is battery input to the 33812 ic. a por/lvi sub-circuit monitors this input's voltage level. the v pwr pin requires external reverse ba ttery and transient protection. output (vccref) the vccref output pin is used to drive an external 5.0 v regulator pnp bipolar pass transistor. input (vccsens) the vccsens pin is used to monitor the +5.0 volts from the external pass transistor?s output. a por will be performed when the voltage on the vccsens pin goes from 0 to vcc. digital ground (dgnd) the dgnd pin provides ground reference for the digital inputs and outputs. the v cc supply is referenced to the dgnd pin. pgnd1 and pgnd2 the pgndx pins provide power additional ground reference for the power outputs, rout, lampout, and injout. the v pwr supply is referenced to the pgnd pins. injector input (injin ) the injin pin is the parallel input that controls the injector output, injout. the injin pin is a logic level input with built- in pull-down to ground to prev ent accidental actuation of the injector if the connection to the pin is lost. injector and relay driver output (injout/ rout) the injout and rout output pi n are the injector driver and relay driver outputs for the fuel injector and relay that this ic supports. the relay driver and injector drivers are identical in operation and featur es the injector driver output is controlled by the parallel input (injin) and the relay driver output is controlled by the parallel input (rin). the injector and relay outputs are turned off during vpwr over-voltage and under-voltage events. open circuit (during off state), short to battery (during on state), and over-temperature faults are detected and annunciated as a logic high on the injflt and relflt lines. over-current is limited by the current limiting circuitry but is not annunciated unless the over- current is due to a short to bat tery. for either driver, when a fault condition is detected, the driver will turn off, and when the fault condition clears, it will tr y to turn on again, if the input line goes low and then high. lamp driver output (lampout) the lampout output pin is the lamp driver, a low side driver capable of driving an incandescent lamp. the current limit blanking time is set to allow the driver to handle the inrush current of a cold lamp filament. the lampout output is controlled by the parallel input pin (lampin). the lampout low side driver is protected against over- temperature, and short to battery. unlike the injector driver, when a fault condition is detected, the lampout driver will turn off, but when the fault condi tion clears, it will to turn on again, while the input line, lampin is high. pre-driver output, with feedback and supply voltage input (ignsup, ignoutl, ignouth, ignfb) the ignoutl and ignouth outp ut pins are the low side and high side output pins of th e ignition pre-driver. they are used to drive either an igbt or a darlington bjt to control the ignition coil current to produce a spark. the choice of output device, igbt or darlington bipolar junction transistor, is indicated by the choice of s upply voltage on the ignsup pin. when driving a darlington bipolar transistor, the ignsup line must be tied to the +5.0 v supply. when driving an igbt, the ignsup may be tied to a protected voltage source (e.g. v pwr ) greater than +5.0 v to achieve the necessary gate drive voltage required by the igbt. the high side output device will current limit if the circuit is forced to supply currents greater than t he maximum indicated. the ignoutl and ignouth li nes are controlled by the parallel input (ignin).the ignout(l,h) outputs and the associated feedback pin, ignfb, provide short to battery protection for the external driv er transistor. a 10:1 voltage divider must be used on the feedback pin to prevent >400 volt ignition coil flyback voltage from damaging the ic. open circuit (off state), short to battery (on state), and temperature limit threshold e xceeded on the pre-driver stage are detected on the output, and all annunciated as a logic high on the ignflt line. there is no individual annunciation of these three fault conditions. the ignflt line goes high when any of the three fault conditions are present. if an over-current /short to battery fault condition, as defined by a v ds greater than the v ignfb_out(flt-th) is detected, the ignouth or ignoutl will turn off and not turn on again until the fault condition has cleared and the ignin input line goes low and then high. outputs (injflt, relflt, ignflt) the injflt, relflt and ignflt pins are the logic level outputs that indicate when a fault condition has been detected on the injout, rout or ignout pins. these pins
analog integrated circuit device data freescale semiconductor 13 33812 functional description functional pin description are normally low and will go high when a fault is detected. toggling the respective input pin will clear the respective fault pin if the fault has been cleared. k-line communication (mtx, mrx, iso9141) these three pins are used to provide an iso914, k-line communication link for the mcu to provide diagnostic support for the system. mrx is the +5.0 v logic level serial output line to the mcu. mtx is the +5.0 v lo gic level serial input to the ic from the mcu. the iso9141 pin is a bidirectional line, consistent with the iso9141 spec ification for signalling to and from the mcu. reset ( reset ) the reset pin is an open drain output.without power on the circuit, reset is held low by an internal pull-down resistor. when power is applied to the circuit and the voltage on the vcc sense pin reaches the lower voltage threshold, (5.0 volts - 2% = 4.9 v) the reset pin will remain at a low level (open drain fet turned on) for a period of time equal to the value wd reset . after this time period, the reset pin will then go high and stay high until a watchdog reset is generated, or an under-voltage event on vcc occurs. the watchdog time and refresh feat ures are controlled via the wdrfsh line. reload and refresh time (wdrfsh) the wdrfsh pin is an input that is supplied by an mcu output to set up the initial reload time, wd reload , and to refresh the watchdog timer. see the description of the watchdog timer for information on how to use this pin. watchdog inhibit(wd_inh) the wd_inh, watchdog inhibit pin, is normally tied to ground. if desired, during software development, it can be lifted from the ground pad and pulled high through an external pull-up resistor. when high, wd_inh will prevent the watchdog timer from causing a reset because of a watchdog timeout. the wd_inh should not be connected to an mcu i/o pin or left floating in normal operation. test pins (test1, test2, and test3) these three pins are used only by freescale test engineering during the production testing of the 33812. they are not to be used for any application purpose and must be handled as specified in the pinout section of this document.
analog integrated circuit device data 14 freescale semiconductor 33812 functional device operation operational modes functional device operation operational modes the 33812 has two states of o peration, normal state and reset state. reset state applying v pwr to the device will generate a power on reset (por) placing the device in the reset state. the power on reset circuit incorporates a timer to prevent high frequency transients from ca using an erroneous por. an under-voltage condition on vcc will also place the device in the reset state causing a reset pulse to be generated on the reset line. all reset s will pre-load the watchdog timer with the maximum time value, wd max . the watchdog will begin counting on the rising edge of the pulse. normal state the normal state is entered after the reset line goes high. control register settings from reset are as follows: ? all outputs off. ? watchdog timer loaded with the wd max time value. power supply the 33812 is designed to operate from 4.5 v to 36 v on the v pwr pin. the v pwr pin supplies power to all internal regulators, analog and logic circuit blocks. the vccref output pin controls an external pnp bipolar transistor, such that the collector is driven to +5.0 v +/- 2%. the vccsens input pin, connected to the colle ctor of the pnp, is used to monitor the output voltage and provides the feedback to regulate the pnp collector to +5.0 v. injector driver operation the open drain low side driver (lsd) injout is designed to control a fuel inje ctor. the injector driver is controlled through the logic leve l parallel input pin, injin. when injin is high, the injout pin is pulled to ground, turning on the fuel injector. when injin is low, the injector pulls the injout output to vbat and the injector is turned off. the injout driver includes off state open load detection and it?s output device is prot ected against over-current, short to battery, over-temperature, inductive flyback over-voltage and vpwr over-voltage. injout output protection features over-current (i out-lim ) the injector driver protection scheme uses three separate protection schemes to prevent damage to the output device. the first protection scheme is deployed when an over- current event occurs. in this case the current limiting circuitry will attempt to limit the maximum current flow to the specified i lim-inj value. short to battery the second protection scheme is invoked when the over- current fault is due to a hard short to battery. in this case, the protection circuitry will, after th e short detection filter time, turn off the output driver. the ou tput will not try to turn on again until the injin input goes low and then high again. a short to battery is reported as a high logic level on the injflt line. temperature limit (t lim ) the third protection scheme deals with the junction temperature of the output dev ice. any time the maximum temperature limit on the out put device is exceeded ( t lim ), the device will shutdown until the junction temperature falls below this maximum temperature minus the hysteresis temperature value. the t lim hysteresis value is t lim(hyst) . the maximum temperature ( t lim ) protection scheme controls the output device rega rdless of the state of the injin input. the device is unable to be activated until the junction temperature falls below this maximum temperature minus the hysteresis temperature value. an over-temperature fault is also reported as a high logic level on the injflt line. over-voltage (v clamp-inj and v pwr(ov) ) the injector driver is also protected against two types of over-voltage conditions: when the v pwr supply exceeds the v pwr(ov) threshold, the injout output turns off and stays off until the over- voltage condition abates and th e injin input pin toggles low and then high again. the output device controls inductive flyback voltages by an active clamping network that limits the voltage across the output device to v clamp-inj volts.
analog integrated circuit device data freescale semiconductor 15 33812 functional device operation ignition pre-driver operation injout fault detection features off state, open load detection an open load on the injector driver is detected by the voltage level on the drain of the output device in the off state. internal to the device is a pull-down current source. in the event of an open injector the drain voltage is pulled low. when the voltage crosses the o pen load detection threshold, an open load is detected. the open load fault detect threshold is set internally and is not programmable. the open load fault is reported as a high logic level on the injflt line. on state, shorted load detection the injout driver is capable of detecting a shorted injector load (short to battery) in the on state. a shorted load fault is reported when the drain pin voltage is greater than the preset short threshold voltage. the shorted load fault detect threshold is set internally and is not programmable. the shorted load fault is reported as a high logic level on the injflt line. clearing the injflt line when the injflt line goes high for any of the following reasons, while the injin line is high (on state): ? short to battery ? over-temperature ? over-voltage ? open load the injflt line will remain high until the injin line goes to a low logic level and the returns high (rising edge). ignition pre-dr iver operation the ignition pre-driver output is controlled by the logic level input ignin. w hen ignin is high the ignouth pin is pulled high to ignsup. when the ignin pin is low, the ignoutl line is pulled to ground turning off the driver darlington or igbt.the ignout pre-driver protects the output device against over-current, short to battery, and vpwr over-voltage. ignout output protection features over-current and short to battery (i lim ) the ignition pre-driver protection scheme senses over- current in the driver device by monitoring the voltage at the ignfb pin. since this pin is protected by a 10:1 voltage divider, the over-current threshold voltage is set internally to 1/10 of the voltage expected on the drain or collector of the output device in an over-current situation. since the ignition output device is external to the 3 3812, a short to battery is the same as an over-current fault. an over-current fault or short to battery is reported as a high logic level on the ignflt line. temperature limit (t lim ) since the ignition output devic e is external to the 33812, there is no over-temperature protection provided. ignout fault detection features off state, open load detection an open load on the ignition driver external device is detected by the voltage level on the drain or collector of the output device in the off state (through a 10:1 voltage divider). in the event of an open ignition coil the drain/collector voltage is pulled low. when the voltage crosses the open load detection threshold, an open load is detected. the open load fault detect threshold is set internally and is not programmable. an open load fault is reported as a high logic level on the ignflt line. over-voltage (v pwr(ov) ) the ignition pre-driver is al so protected against an over- voltage condition: when the vpwr supply exceeds the v pwr(ov) threshold, the ignoutl and igno uth outputs turn off and stays off until the over-voltage condition clears and the next rising edge of the ignin input pin. clearing the ignflt line when the ignflt line goes high for any of the following reasons, while the ignin line is high (on state): ? short to battery ? over-voltage ? over-temperature of the ignoutl and ignouth transistors ? open load the ignflt line will remain high until the ignin line goes to the low logic level and then returns high.
analog integrated circuit device data 16 freescale semiconductor 33812 functional device operation relay driver operation relay driver operation the relay driver (rout) is a low side driver that is controlled by the logic level rin input pin. when rin is high, the rout pin is pulled to ground, turning on an external relay or other device. when rin is lo w, the relay coil pulls the rout output to v bat , and the relay is turned off. the rout driver includes of f state open load detection and it?s output device is prot ected against over-current, short to battery, over-temperature, inductive flyback over-voltage and vpwr over-voltage. the relay driver is functionally and electrically identical to the injector driver and can be used as a second injector driver, for two cylinder applications, as long as maximum power dissipation consid erations are observed. rout protection features over-current (i out-lim rout ) the rout driver protection scheme uses three separate protection schemes to prevent damage to the output device. the first protection scheme is deployed when an over- current event occurs. in this case, the current limiting circuitry will attempt to limit the maximum current flow to the specified i out lim-rel value. short to battery the second protection scheme is invoked when the over- current fault is due to a hard short to battery. in this case, the protection circuitry will, after th e short detection filter time, turn off the output driver. the ou tput will not try to turn on again until the rin input goes low and then high again. a short to battery is reported as a high logic level on the relflt line. temperature limit (t lim ) the third protection scheme deals with the junction temperature of the output device. any time the maximum temperature limit on the output device is exceeded ( t lim ), the device will shutdown until the junction temperature falls below this maximum temperature minus the hysteresis temperature value. the t lim hysteresis value is t lim(hyst) . the maximum temperature ( t lim ) protection scheme controls the output device regardl ess of the state of the rin input. the device is unable to be activated until the junction temperature falls below this maximum temperature minus the hysteresis temperature value. an over-temperature fault is also reported as a high logic level on the relflt line. over-voltage (v clamp-rel and v pwr(ov) ) the relay driver is also protected against two types of over-voltage conditions: when the vpwr supply exceeds the v pwr(ov) threshold, the rout output turns off and st ays off until the over-voltage condition abates and the rn in put pin toggles low and then high again. the output device is protected against inductive flyback voltages greater than v clamp-rel by an active clamping network that limits the voltage across the output device to v clamp-rel volts. rout fault detection features off state, open load detection an open load on the relay driver is detected by the voltage level on the drain of the output dev ice in the off st ate. internal to the device is a pull-down current source. in the event of an open injector the drain voltage is pulled low. when the voltage crosses the open load detection threshold, an open load is detected. the open load fault detect threshold is set internally and is not programmable. the open load fault is reported as a high logic level on the relflt line. on state, shorted load detection the rout driver is capable of detecting a shorted load (short to battery) in the on state. a shorted load fault is reported when the drain pin volt age is greater than the preset short threshold voltage. the shorted load fault detect threshold is set internally and is not programmable. the shorted load fault is reported as a high logic level on the relflt line. clearing the relflt line when the relflt line goes high for any of the following reasons, while the rin line is high (on state): ? short to battery ? over-temperature ? over-voltage ? open load the relflt line will remain high until the rin line goes to a low logic level and the returns high (rising edge).
analog integrated circuit device data freescale semiconductor 17 33812 functional device operation lamp driver operation lamp driver operation the lamp driver is a low side driver that is controlled by the logic level lampin input pin. when lampin is high, the lamp pin is pulled to ground, turning on an external bulb or led. when lampin is low, the bulb or led pulls the lamp output to v bat , and the lamp is turned off. lampout protection features over-current (i out-lim-lamp ) the lampout driver protection scheme uses three separate protection schemes to prevent damage to the output device. the first protection scheme is deployed when an over- current event occurs. in this case the current limiting circuitry will attempt to limit the maximum current flow to the specified i out lim-lamp value. short to battery the second protection scheme is invoked when the over- current fault is due to a hard short to battery. in this case, the protection circuitry will, after the short detection filter time, turn off the output driver. there will be an internal retry timer to try to turn on again if the fault clears. there is no annunciation of any lampout faults. temperature limit (t lim ) the third protection scheme deals with the junction temperature of the output dev ice. any time the maximum temperature limit on the out put device is exceeded ( t lim ), the device will shutdown until the junction temperature falls below this maximum temperature minus the hysteresis temperature value. the t lim hysteresis value is t lim(hyst) . the maximum temperature ( t lim ) protection scheme controls the output device re gardless of the state of the lampin input. the device is u nable to be activated until the junction temperature falls below this maximum temperature minus the hysteresis temperature value. lampout fault detection features off state, open load detection since there is no way to annunciate an open load fault for the lamp output driver, no open load fault detection is performed by the 33812. on state, shorted load detection even though there is no way to annunciate a shorted load fault for the lamp output driv er, shorted fault detection is performed by the 33812 as part of the protection for the output fet. the lampout driver also has an over-current blanking time of t oc(blank) to allow for incandescent lamp inrush current over/under-voltage shutdown strategy how the outputs behave after an over-voltage or under- voltage event on vpwr is listed in table 3 below: table 3. over-voltage/under-voltage truth table output state before ov or uv state when returning from over-voltage state when returning from under-voltage injout x off off ignout x off off rout off off off rout on on off lampout off off off lampout on on off
analog integrated circuit device data 18 freescale semiconductor 33812 functional device operation watchdog timer operation watchdog timer operation the purpose of the watchdog timer is to provide a reset to the mcu whenever the mcu is locked up in a loop or otherwise hung up, perhaps by executing erroneous code, such as a halt instruction. the watchdog timer is initialized by a power on reset or a reset that occurs after a fault such as an under-voltage event on vcc. whenever the watchdog timer is refreshed, it is always reloaded with the value wd reload which initially has a value of wd max seconds. whenever a reset occurs, the wd reload value is set to wd max seconds and the watchdog timer is re-loaded with th is value. when the reset pulse returns high, and, if the wdrfsh line is low, the watchdog timer starts counting. if th e watchdog timer reaches the wd max value before the next rising edge on the wdrfsh line, the watchdog circuit will generate a reset pulse to the mcu and reload itself with the maximum time value of wd reload , which will have been set back to wd max seconds. in normal operation, the mcu will issue a wdrfsh pulse, periodically, which re-loads the watchdog timer with the wd reload value and starts the count ing again, thus avoiding a watchdog timer generated reset pulse. when the watchdog timer is refreshed by a wdrfsh pulse, before the watchdog timer reaches the programmed value, the refresh will prevent a reset pulse from being issued to the mcu. loading the watchdog timer and wd reload aside from the reset case, which always loads the wd reload value and the watchdog timer with the maximum time value, wd max , there is an additional way that the watchdog timer and the value wd reload can be re-loaded. during initialization, if the wdrfsh pulse width is greater than wd load , both the watchdog timer and the value wd reload will be loaded with a timer count value, corresponding to the width of the pulse present on the wdrfsh input. once this value is set, no further setting of the wd load value is possible until a reset is performed. once the wdrfsh input goes low, the watchdog timer will begin incrementing again, counting up to the new value that has been loaded into the reload register. the watchdog must be refreshed by another pulse on the wdrfsh line, before the watchdog timer counts up to the reload value, or else a reset pulse will be generated and sent to the mcu. if the wdrfsh line is ever kept high for longer than wd reload seconds, the watchdog will issue an immediate reset to the mcu. upon receiving a reset input from the 33812, the mcu should always be programmed to bring the wdrfsh line low to avoid being locked in a ?deadly embrace? condition where the mcu and 33812 alternate back and forth between the reset and normal states. disabling the watchdog timer if the wd_inh line is pulled high through a pull-up resistor of 10 k or less, (i.e. not tied to ground), the watchdog timer will be inhibited from issuing a reset to the mcu, while the line is held in this state. th is ?watchdog inhibited? state should only be used during software testing and development to avoid being concerned about an inadvertent watchdog reset. watchdog timing diagrams watchdog loaded with wd max time 5 3 wdrfsh 2 0 5 4 3 2 1 0 v oltage time 5 4 3 2 1 0 voltage time reset watchdog timer wdrfsh pw a < wd load reset loads the watchdog timer and wd reload with wd max refresh pulses, pw a , on wdrfsh load the watchdog timer with the wd reload 5 4 3 2 1 0 voltage time wdrfsh pw b > wd load during initialization, for the first wdrfsh pulse only, pw b , that is greater than wd load but less than wd max , the watchdog timer and wd reload value will be loaded with a time value corresponding to the width of that pulse, pw b . all pulses on the wdrfsh line width less than wd reload, will result in the watchdog timer being reloaded with the time value correspond- ing to pw b . this programmability is only allowed once per reset . 1 4 holding wdrfsh high will trigger reset every wd max time & wd reload = wd max
analog integrated circuit device data freescale semiconductor 19 33812 functional device operation iso-9141 transceiver operation iso-9141 transceiver operation bus i/o pin (iso9141) this i/o pin represents the single-wire bus transmitter and receiver. transmitter characteristics the iso-9141 bus transmitter is a low side mosfet with internal over-current thermal shutdown. an internal pull-up resistor with a serial diode structure is integrated so no external pull-up components are required for the application in a slave node. voltage can go from -18 v to 40 v without current supplied from any other source than the pull-up resistance. the iso9141 pin exhibits no reverse current from the iso9141 bus line to vpwr, even in the event of gnd shift or vpwr disconnection. the transmitter has one slew rate (normal slew rate) receiver characteristics the receiver thresholds are ratiometric with the vpwr supply pin.
analog integrated circuit device data 20 freescale semiconductor 33812 typical applications iso-9141 transceiver operation typical applications low voltage operation during a low voltage condition (4.5 v < vpwr < 9.0 v) the device will operate as described in the functional description, however, certain parameters listed in the tables may be out of specification. fault condition annunciation is not guaranteed below the minimum parametric operating voltage. low side injector driver voltage clamp the injector output of the 33812 incorporates an internal voltage clamp to provide fast turn off and transient protection. each clamp independe ntly limits the drain-to- source voltage to v clamp_inj . the total energy clamped (e j ) can be calculated by multiplying the peak current (i peak ) times the clamp voltage (v cl ) times the time ( ) all divided by 2 (see figure 5 ). characterization of the output clamp, using a repetitive pulse method at 1.0 a, indicates the maximum energy to be 100 mj at 125 c junction temperature per output . figure 5. output voltage clamping reverse battery and transient protection the 33812 device requires external reverse battery protection on the vpwr pin. all outputs consist of a power mosfet with an integral substrate diode. during a reve rse battery condition, current will flow through the load via the substrate diode. under this condition load devices will turn on. if reverse battery protection for the loads is required, a diode must be placed in series with the load. good automotive engineering practices recommend the use of transient voltage suppression on the vpwr line. a tvs device and adequate capacitive decoupling are necessary for a robust design. drain-to-source clamp voltage (v cl = 50 v) drain-to-source on voltage (v ds(on) ) drain voltage clamp energy e j =( x i peak x v cl )/2 gnd time drain current (i peak = 0.3 a)
analog integrated circuit device data freescale semiconductor 21 33812 packaging package dimensions packaging package dimensions for the most current package revision, visit www.freescale.com and perform a keyword search using the ?98a? listed below. ek suffix 32-pin 98asa10556d revision d
analog integrated circuit device data 22 freescale semiconductor 33812 packaging package dimensions ek suffix 32-pin 98asa10556d revision d
analog integrated circuit device data freescale semiconductor 23 33812 packaging package dimensions ek suffix 32-pin 98asa10556d revision d
analog integrated circuit device data 24 freescale semiconductor 33812 revision history revision history revision date description of changes 4.0 7/2009 ? initial release
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