microwave ceramics and modules filter 2 ? pole filter for wlan 5ghz / [5150 - 5850] mhz B69842N5507A700 preliminary datasheet issue date 18.09.03 issue p2 publisher saw mwc pd f page 1/4 features ! smd filter consisting of coupled resonators with stepped impedances ! mgtio 3 - catio 3 ( r = 21 / tc f =010 ppm/k) with a coating of copper (10 m) and tin (>5 m) ! excellent reflow solderability, no migration effect due to copper/tin metallization index page 2 ! component drawing ! recommended footprint page 3 ! characteristics ! maximum ratings ! typical passband characteristic page 4 ! processing information ! soldering requirements ! delivery mode
microwave ceramics and modules filter 2 ? pole filter for wlan 5ghz / [5150 - 5850] mhz B69842N5507A700 preliminary datasheet issue date 18.09.03 issue p2 publisher saw mwc pd f page 2/4 component drawing recommended footprint i/o i/o g g g footprint_010601.dwg " wmf
microwave ceramics and modules filter 2 ? pole filter for wlan 5ghz / [5150 - 5850] mhz B69842N5507A700 preliminary datasheet issue date 18.09.03 issue p2 publisher saw mwc pd f page 3/4 characteristics min. typ. max. center frequency f c 5.5 ghz insertion loss [5150 ? 5850] mhz il 1.0 1.4 db passband [5150 ? 5850] mhz b 700 mhz amplitude ripple (peak - peak) [5150 ? 5850] mhz ? db standing wave ratio [5150 ? 5850] mhz swr 1.8 2.0 impedance power z p 50 1.0 ? w a ttenuation at dc to 1990 mhz at 1990 to 2170 mhz at 2400 to 2500 mhz 45 42 40 50 45 43 db db db maximum ratings iec climatic category (iec 68-1) - 40/+ 90/56 operating temperature t op -40 / +85 c typical passband characteristic -60 -50 -40 -30 -20 -10 0 1,0 1,5 2,0 2,5 3,0 3,5 4,0 4,5 5,0 5,5 6,0 g [db] s11 [db] s21 [db]
microwave ceramics and modules filter 2 ? pole filter for wlan 5ghz / [5150 - 5850] mhz B69842N5507A700 preliminary datasheet issue date 18.09.03 issue p2 publisher saw mwc pd f page 4/4 processing information znr.: 577 (filt95_2) ! wettability to iec 68-2-58: 75% (after aging) soldering requirements profile for eutectic snpb solder paste profile for leadfree solder paste soldering type reflow reflow maximum solderin g tem p erature 235 ( max. 2 sec. ) 260 ( max. 2 sec. ) c (measuring point on top surface of the component) 225 (max. 10 sec.) 250 (max. 10 sec.) c recommended soldering conditions (infrared): 20-40 sec. 40-80 sec. within 10 sec. time [sec.] temp. [c] 215c10c 30 sec. 2-3 min. within 10 sec. time [sec.] temp. [c] 245c5c 2.5 c/s > - 5 c/s eutectic snpb solder paste profil e leadfree solder paste profile delivery mode ! blister tape acc. to iec 286-3, ps, grey ! pieces/tape: t.b.d. t.b.d. ? epcos ag 2001. all rights reserved. reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without epcos' prior express consent is prohibited. the information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. purchase orders are subject to the general conditions for the supply of products and services of the electrical and electronics industry recommended by the zvei (german electrical and electronic manufacturers' association), unless otherwise agreed.
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