(2,54mm) .100" alc series www.samtec.com alc?624?ngg alc?314?sgt plating option lead dia accepted = .016" to .020" (0,41mm to 0,51mm) insertion depth = .080" to .150" style n component part no. = sc-5p1 style zn component part no. = ez-5p1 requires style ?s, ?zs, or ?zp and .035"?003" board hole. 14 16 18 20 24 24 28 32 40 ?314 ?316 ?318 ?320 ?324 ?624 ?628 ?632 ?640 no. of contacts row space (7,62) .300 (15,24) .600 gg = 30" (0,76m) gold contact 10" (0,25m) gold shell gt = 30" (0,76m) gold contact, tin shell tt = tin contact and shell (styles ?s,?zs, ?l,?m,?n only) low insertion force (lif) contacts available. lead dia accepted = .015" to .022" (0,38mm to 0,56mm) insertion depth = .095" to .150" (2.41mm to 3,81mm) component part no. = sc-1l1 or ez-1l1 lead dia accepted = .015" to .020" (0,38mm to 0,51mm) insertion depth = .105" to .170" (2,76mm to 4,32mm) style l component part no. = sc-3p1 style zl component part no. = ez-3p1 alc row spacing & no. of contacts style option other option lead dia accepted = .016" to .021" (0,41mm to 0,53mm insertion depth = .080" to .115" (2,03mm to 2,92,mm) style m component part no. = sc-4p1 style zm component part no. = ez-4p1 (2,54) .100 typ -3xx =(7,62) .300 -6xx =(15,24) .600 (7,62) .300 (3,43) .135 (1,32) .052 dia (5,84) .230 ?010 (0,74) .029 dia (2,74) .108 ?.010 (0,76) .030 (0,74) .029 dia (2,41) .095 ?.010 (4,83) .190 ?.010 (1,32) .052 dia (0,51) .020 (1,32) .052 dia (0,51) .020 dia (5,20) .205 (0,89) .035 (0,76) .030 requires gt plating option for lif specify ?zl ?l = low pro? le, hollow leg mates with: apa note: some sizes, styles and options are non-standard, non-returnable. aluminum carriers for direct soldering to pc boards samtec aluminum carriers are available in the most popular dip lead counts for direct mounting of lead sockets to the printed circuit board. they are ideal for vapor phase, infrared and other high temperature soldering techniques. low insertion force, six- nger contacts or standard insertion force four- nger contacts are available. shell styles include ultra-low pro le designs. st = 10" (0,25m) gold contact tin shell (styles ?s & ?zs only) ?l = locking socket specify from chart below for complete speci cations see www.samtec.com?alc insulator material: none carrier material: aluminum contact: becu shell: brass plating: au over 50? (1,27?) ni or sn over 100? (2,54?) cu or 50? (1,27?) ni current rating: 1 a contact resistance: 10 m min insertion force: standard = 9 oz (2,50n) avg, 16 oz (4,45n) max low insertion force = 2.5 oz (0,70n) avg, 5.5 oz (1,53n) max withdrawal force: standard = 2.5 oz (0,70n) avg, 1.5 oz (0,42n) min low insertion force = 2.0 oz (0,56n) avg, 0.35 oz (0,10n) min except styles zm & zn = 2.0 oz (0,56n) avg, 0.5 oz (0,14n) min specifications for lif specify ?zs for lif specify ?zm for lif specify ?zn ?s = standard solder tail ?m = low pro? le, standard mount ?n = low pro? le, micro socket (1,32) .052 dia (0,51) .020 dia (0,76) .030 (3,18) .125 (7,62) .300 lead dia accepted = .015" to .022" (0,38mm to 0,56mm) insertion depth = .095" to .150" (2,41mm to 3,81mm) style s component part no. = sc-1p1 style zs component part no. = ez-1p1 locking lead (?l) available. see option. f-210-1 supplement aluminum dip socket carrier mold-to-position product minimums or set-up charges may apply. call samtec.
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