skm600ga12t4 ? by semikron rev. 2 ? 16.06.2009 1 semitrans ? 4 ga fast igbt4 modules skm600ga12t4 features ?v ce(sat) with positive temperature coefficient ? high short circuit capability, self limiting to 6 x icnom ? fast & soft inverse cal diodes ? large clearance (10 mm) and creepage distances (20 mm) ? isolated copper baseplate using dbc technology (direct copper bonding) typical applications ? ac inverter drives ?ups ? electronic welders at fsw up to 20 khz remarks ? case temperature limited to t c = 125c max, recomm. t op = -40 ... +150c, product rel. results valid for t j = 150 absolute maximum ratings symbol conditions values unit igbt v ces 1200 v i c t j = 175 c t c =25c 916 a t c =80c 704 a i cnom 600 a i crm i crm = 3xi cnom 1800 a v ges -20 ... 20 v t psc v cc = 800 v v ge 15 v v ces 1200 v t j = 150 c 10 s t j -40 ... 175 c inverse diode i f t j = 175 c t c =25c 707 a t c =80c 529 a i fnom 600 a i frm i frm = 3xi fnom 1800 a i fsm t p = 10 ms, sin 180, t j =25c 3240 a t j -40 ... 175 c module i t(rms) 500 a t stg -40 ... 125 c v isol ac sinus 50hz, t = 1 min 4000 v characteristics symbol conditions min. typ. max. unit igbt v ce(sat) i c =600a v ge =15v chiplevel t j =25c 1.8 2.05 v t j = 150 c 2.2 2.4 v v ce0 t j =25c 0.8 0.9 v t j = 150 c 0.7 0.8 v r ce v ge =15v t j =25c 1.7 1.9 m ? t j = 150 c 2.5 2.7 m ? v ge(th) v ge =v ce , i c =24ma 5 5.8 6.5 v i ces v ge =0v v ce = 1200 v t j =25c 0.1 0.3 ma t j = 150 c ma c ies v ce =25v v ge =0v f=1mhz 37.2 n f c oes f=1mhz 2.32 nf c res f=1mhz 2.04 nf q g v ge =- 8 v...+ 15 v 3400 nc r gint t j =25c 1.3 ? t d(on) v cc = 600 v i c =600a v ge =15v r g on =2 ? r g off =2 ? di/dt on = 6000 a/s di/dt off = 5200 a/s t j = 150 c 177 n s t r t j = 150 c 90 ns e on t j = 150 c 74 mj t d(off) t j = 150 c 600 n s t f t j = 150 c 100 n s e off t j = 150 c 63 mj r th(j-c) per igbt 0.049 k/w
skm600ga12t4 2 rev. 2 ? 16.06.2009 ? by semikron characteristics symbol conditions min. typ. max. unit inverse diode v f = v ec i f =600a v ge =0v chip t j =25c 2.14 2.46 v t j = 150 c 2.07 2.38 v v f0 t j =25c 1.3 1.5 v t j = 150 c 0.9 1.1 v r f t j =25c 1.4 1.6 m ? t j = 150 c 1.9 2.1 m ? i rrm i f =600a di/dt off = 5500 a/s v ge =15v v cc = 600 v t j = 150 c 420 a q rr t j = 150 c 92 c e rr t j = 150 c 38 mj r th(j-c) per diode 0.086 k/w module l ce 15 20 nh r cc'+ee' terminal-chip t c =25c 0.18 m ? t c = 125 c 0.22 m ? r th(c-s) per module 0.02 0.038 k/w m s to heat sink m6 3 5 nm m t to terminals m6, m4 2.5 5 nm nm w 330 g semitrans ? 4 ga fast igbt4 modules skm600ga12t4 features ?v ce(sat) with positive temperature coefficient ? high short circuit capability, self limiting to 6 x icnom ? fast & soft inverse cal diodes ? large clearance (10 mm) and creepage distances (20 mm) ? isolated copper baseplate using dbc technology (direct copper bonding) typical applications ? ac inverter drives ?ups ? electronic welders at fsw up to 20 khz remarks ? case temperature limited to t c = 125c max, recomm. t op = -40 ... +150c, product rel. results valid for t j = 150
skm600ga12t4 ? by semikron rev. 2 ? 16.06.2009 3 fig. 1: typ. output ch aracteristic, inclusive r cc'+ ee' fig. 2: rated current vs. temperature i c = f (t c ) fig. 3: typ. turn-on /-off energy = f (i c ) fig. 4: typ. turn-on /-off energy = f (r g ) fig. 5: typ. transfer characteristic fig. 6: typ. gate charge characteristic
skm600ga12t4 4 rev. 2 ? 16.06.2009 ? by semikron fig. 7: typ. switching times vs. i c fig. 8: typ. switching times vs. gate resistor r g fig. 9: transient thermal impedance fig. 10: cal diode forward characteristic fig. 11: cal diode peak reverse recovery current fig. 12: typ. cal diode peak reverse recovery charge
skm600ga12t4 ? by semikron rev. 2 ? 16.06.2009 5 this is an electrostatic discharge sensitive device (esds), international standard iec 60747-1, chapter ix. this technical information specifies semiconductor devices but promises no characteristics. no warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. semitrans 4 ga
|