sdlva s - chip 5 5 - 1 for price, delivery and to place orders: hittite microwave corporation, 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com general description hmc913 features functional diagram typical applications electrical specifcations, t a = +25 c , vcc1 = vcc2 = 3.3v [1] successive detection log video amplifier (sdlva), 0.6 - 20 ghz v01.0810 the hmc913 is a successive detection log video amplifer (sdlva) which operates from 0.6 to 20 ghz. the hmc913 provides a logging range of 59 db. this device offers typical fast rise/fall times of 5/10 ns and a superior delay time of only 14 ns. the hmc913 log video output slope is typically 14 mv/db. maximum recovery times are less than 30 ns. ideal for high speed channelized receiver applications, the hmc913 operates from a single +3.3 v supply, and consumes only 80 ma. all data shown herein is measured with the chip in a 50 ohm environment and contacted with rf probes. high logging range: 59 db (-54 to +5 dbm) @ 18 ghz output frequency flatness: 1.5 db log linearity: 1 db fast rise/fall times: 5/10 ns single positive supply: +3.3v esd sensitivity (hbm): class 1a the hmc913 is ideal for: ? ew, elint & ifm receivers ? df radar systems ? ecm systems ? broadband test & measurement ? power measurement & control circuits ? military & space applications parameter conditions typ. units input frequency range [1] 0.6 - 20 ghz frequency flatness pin = -25 dbm 1.5 db log linearity pin = -50 to +3 dbm 1 db log linearity over temperature (-55 c to +85 c) pin = -25 dbm 1.5 db minimum logging range to 3 db error @ 18 ghz -54 @ 18 ghz dbm maximum logging range to 3 db error @ 18 ghz +5 @ 18 ghz dbm input return loss 5.5 db log video minimum output voltage 1 v log video maximum output voltage 1.8 v log video output rise time 10% to 90% 5 ns log video output fall time 90% to 10% 10 ns log video recovery time 25 ns log video output slope 14 mv/db log video output slope variation over temperature @ 10 ghz 5 v/dbc log video propagation delay 14 ns supply current (icc1 + icc2) @ pin = -30 dbm 80 ma [1] electrical specs and performance plots are given for single-ended operation
sdlva s - chip 5 5 - 2 for price, delivery and to place orders: hittite microwave corporation, 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com hmc913 v01.0810 successive detection log video amplifier (sdlva), 0.6 - 20 ghz error flatness vs. input power over frequency [1][2] video out & error vs. input power, fin = 1 ghz [1] video out & error vs. input power, fin = 500 mhz [1] video out & error vs. input power, fin = 2 ghz [1] -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 -70 -60 -50 -40 -30 -20 -10 0 10 20 2 ghz 6 ghz 10 ghz 14 ghz 18 ghz 20 ghz error (db) input power (dbm) 0.5 1 1.5 2 -3 -2 -1 0 1 2 3 -70 -60 -50 -40 -30 -20 -10 0 10 20 err +25c err +85c err -55c ideal video out +25c video out +85c video out -55c video out (v) error (db) input power (dbm) 0.5 1 1.5 2 -3 -2 -1 0 1 2 3 -70 -60 -50 -40 -30 -20 -10 0 10 20 err +25c err +85c err -55c ideal video out +25c video out +85c video out -55c video out (v) error (db) input power (dbm) 0.5 1 1.5 2 -3 -2 -1 0 1 2 3 -70 -60 -50 -40 -30 -20 -10 0 10 20 err +25c err +85c err -55c ideal video out +25c video out +85c video out -55c video out (v) error (db) input power (dbm) [1] electrical specs and performance plots are given for single-ended operation [2] an average ideal line is used to calculate error curves. video out & error vs. input power, fin = 10 ghz [1] 0.5 1 1.5 2 -3 -2 -1 0 1 2 3 -70 -60 -50 -40 -30 -20 -10 0 10 20 err +25c err +85c err -55c ideal video out +25c video out +85c video out -55c video out (v) error (db) input power (dbm) video out & error vs. input power, fin = 6 ghz [1] 0.5 1 1.5 2 -3 -2 -1 0 1 2 3 -70 -60 -50 -40 -30 -20 -10 0 10 20 err +25c err +85c err -55c ideal video out +25c video out +85c video out -55c video out (v) error (db) input power (dbm)
sdlva s - chip 5 5 - 3 for price, delivery and to place orders: hittite microwave corporation, 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com hmc913 v01.0810 successive detection log video amplifier (sdlva), 0.6 - 20 ghz video out & error vs. input power, fin = 14 ghz [1] video out vs. error vs. input power, fin = 18 ghz [1] 0.5 1 1.5 2 -3 -2 -1 0 1 2 3 -70 -60 -50 -40 -30 -20 -10 0 10 20 err +25c err +85c err -55c ideal video out +25c video out +85c video out -55c video out (v) error (db) input power (dbm) 0.5 1 1.5 2 -3 -2 -1 0 1 2 3 -70 -60 -50 -40 -30 -20 -10 0 10 20 err +25c err +85c err -55c ideal video out +25c video out +85c video out -55c video out (v) error (db) input power (dbm) video out & error vs. input power, fin = 20 ghz [1] 0.5 1 1.5 2 -3 -2 -1 0 1 2 3 -70 -60 -50 -40 -30 -20 -10 0 10 20 err +25c err +85c err -55c ideal video out +25c video out +85c video out -55c video out (v) error (db) input power (dbm) video out vs. frequency over input power & temperature [1] video out vs. frequency over input power & bias voltage [1] 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 0 2 4 6 8 10 12 14 16 18 20 22 +25c +85c -55c frequency (ghz) video out (v) -10 dbm -25 dbm -40 dbm 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 0 2 4 6 8 10 12 14 16 18 20 22 3.15v 3.30v 3.45v frequency (ghz) video out (v) -10 dbm -25 dbm -40 dbm [1] electrical specs and performance plots are given for single-ended operation
sdlva s - chip 5 5 - 4 for price, delivery and to place orders: hittite microwave corporation, 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com hmc913 v01.0810 successive detection log video amplifier (sdlva), 0.6 - 20 ghz rise time for various frequencies @ 0 dbm [1] fall time for various frequencies @ 0 dbm [1] input return loss vs. frequency [1] 0.8 1 1.2 1.4 1.6 1.8 0 20 40 60 80 100 2 ghz 10 ghz 18 ghz time (ns) video out (v) 0.8 1 1.2 1.4 1.6 1.8 0 20 40 60 80 100 2 ghz 10 ghz 18 ghz time (ns) video out (v) -20 -15 -10 -5 0 0 5 10 15 20 25 30 frequency (ghz) return loss (db) [1] electrical specs and performance plots are given for single-ended operation
sdlva s - chip 5 5 - 5 for price, delivery and to place orders: hittite microwave corporation, 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com hmc913 v01.0810 successive detection log video amplifier (sdlva), 0.6 - 20 ghz outline drawing notes: 1. all dimensions in inches [millimeters] 2. die thickness is 0.011 (0.279) 3. typical bond pad is 0.0024 square 4. bond pad metallization: aluminum 5. no backside metal 6. no connection required for unlabeled bond pads 7. overall die size is .002 die packaging information [1] standard alternate wp-3 (waffle pack) [2] [1] refer to the packaging information section for die packaging dimensions. [2] for alternate packaging information contact hittite microwave corporation. absolute maximum ratings electrostatic sensitive device observe handling precautions vcc +3.6v enbl +3.6v rf input power +15 dbm channel temperature 125 c continuous pdiss (t=85c) derate 12.63 mw/c above 85c 0.51 w thermal resistance r th (junction to die bottom) 79.2 c/w storage temperature -65 to +150 c operating temperature -55 to +85 c esd sensitivity (hbm) class 1a
sdlva s - chip 5 5 - 6 for price, delivery and to place orders: hittite microwave corporation, 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com hmc913 v01.0810 successive detection log video amplifier (sdlva), 0.6 - 20 ghz pad descriptions pad number function description interface schematic 1 - 5 vcc1 bias supply. connect supply voltage to these pins with appropriate fltering. 6 vcc2 bias supply. connect supply voltage to these pins with appropriate fltering. 7 en enable pin connected to vcc1 or vcc2 for normal operation. total supply current reduced to less than 3ma when en is set to 0v. 8, 11 - 18, 21, 22 die bottom gnd these pins and the die bottom must be connected to a high quality rf/dc ground. 9, 10 video out, video fb video out and feedback.
sdlva s - chip 5 5 - 7 for price, delivery and to place orders: hittite microwave corporation, 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com hmc913 v01.0810 successive detection log video amplifier (sdlva), 0.6 - 20 ghz pad number function description interface schematic 19, 20 rfinn, rfinp rf input pins connect rf to rfinp and ac couple rfinn to ground via 50 ohm for single ended operation. pad descriptions (continued) application circuit
sdlva s - chip 5 5 - 8 for price, delivery and to place orders: hittite microwave corporation, 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com hmc913 v01.0810 successive detection log video amplifier (sdlva), 0.6 - 20 ghz assembly diagram list of materials for assembly diagram item description c1, c2 33 pf capacitor, 0402 pkg. c3 - c6 100 pf slc capacitor, sa1212bx101m16vhxf c7 - c8 10 nf slc capacitor, mvb3030x103zgh5n r1 50 ohm resistor, 0402 pkg. u1 hmc913 die electrostatic sensitive device observe handling precautions
sdlva s - chip 5 5 - 9 for price, delivery and to place orders: hittite microwave corporation, 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com mounting & bonding techniques for mmics the die should be attached directly to the ground plane with epoxy (see hmc gen - eral handling, mounting , bonding note). 50 ohm microstrip transmission lines on 0.254mm (10 mil) thick alumina thin flm substrates are recommended for bringing rf to and from the chip (figure 1). microstrip substrates should be placed as close to the die as possible in order to minimize bond wire length. typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). handling precautions follow these precautions to avoid permanent damage. storage: all bare die are placed in either waffle or gel based esd protective con - tainers, and then sealed in an esd protective bag for shipment. once the sealed esd protective bag has been opened, all die should be stored in a dry nitrogen environment. cleanliness: handle the chips in a clean environment. do not attempt to clean the chip using liquid cleaning systems. static sensitivity: follow esd precautions to protect against esd strikes. transients: suppress instrument and bias supply transients while bias is applied. use shielded signal and bias cables to minimize inductive pick-up. general handling: the chip may be handled by a vacuum collet or with a sharp pair of tweezers. mounting epoxy die attach: apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fllet is observed around the perimeter of the chip once it is placed into position. cure epoxy per the manufacturers schedule. 0.279mm (0.0 1 1) thic k mmic wi re bond rf gr ound plane 0.254mm (0.0 1 0) thic k alumina thin f ilm substrat e 0.07 6mm (0.003) f igur e 1. hmc913 v01.0810 successive detection log video amplifier (sdlva), 0.6 - 20 ghz
sdlva s - chip 5 5 - 10 for price, delivery and to place orders: hittite microwave corporation, 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com hmc913 v01.0810 successive detection log video amplifier (sdlva), 0.6 - 20 ghz notes:
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