? semiconductor components industries, llc, 2000 november, 2000 rev. 3 1 publication order number: mtw32n25e/d mtw32n25e preferred device power mosfet 32 amps, 250 volts nchannel to247 this advanced power mosfet is designed to withstand high energy in the avalanche and commutation modes. the new energy efficient design also offers a draintosource diode with a fast recovery time. designed for low voltage, high speed switching applications in power supplies, converters and pwm motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients. ? avalanche energy specified ? sourcetodrain diode recovery time comparable to a discrete fast recovery diode ? diode is characterized for use in bridge circuits ? i dss and v ds(on) specified at elevated temperature ? isolated mounting hole reduces mounting hardware maximum ratings (t c = 25 c unless otherwise noted) rating symbol value unit drainsource voltage v dss 250 vdc draingate voltage (r gs = 1.0 m w ) v dgr 250 vdc gatesource voltage continuous nonrepetitive (t p 10 ms) v gs v gsm 20 40 vdc vpk drain current continuous drain current continuous @ 100 c drain current single pulse (t p 10 m s) i d i d i dm 32 25 96 adc apk total power dissipation derate above 25 c p d 250 2.0 watts w/ c operating and storage temperature range t j , t stg 55 to 150 c single pulse draintosource avalanche energy starting t j = 25 c (v dd = 100 vdc, v gs = 10 vdc, i l = 20 apk, l = 3.0 mh, r g = 25 w ) e as 600 mj thermal resistance junction to case thermal resistance junction to ambient r q jc r q ja 0.50 40 c/w maximum lead temperature for soldering purposes, 1/8 from case for 10 seconds t l 260 c device package shipping ordering information mtw32n25e to247 30 units/rail preferred devices are recommended choices for future use and best overall value. ll = location code y = year ww = work week mtw32n25e llyww http://onsemi.com marking diagram & pin assignment d g to247ae case 340k style 1 nchannel s 32 amperes 250 volts r ds(on) = 80 m w 1 2 3 4 1 gate 3 source 4 drain 2 drain
mtw32n25e http://onsemi.com 2 electrical characteristics (t j = 25 c unless otherwise noted) characteristic symbol min typ max unit off characteristics drainsource breakdown voltage (v gs = 0 vdc, i d = 250 m adc) temperature coefficient (positive) v (br)dss 250 300 380 vdc mv/ c zero gate voltage drain current (v ds = 250 vdc, v gs = 0 vdc) (v ds = 250 vdc, v gs = 0 vdc, t j = 125 c) i dss 10 100 m adc gatebody leakage current (v gs = 20 vdc, v ds = 0) i gss 100 nadc on characteristics (note 1.) gate threshold voltage (v ds = v gs , i d = 250 m adc) temperature coefficient (negative) v gs(th) 2.0 7.0 4.0 vdc mv/ c static drainsource onresistance (v gs = 10 vdc, i d = 16 adc) r ds(on) 0.07 0.08 ohm drainsource onvoltage (v gs = 10 vdc) (i d = 32 adc) (i d = 16 adc, t j = 125 c) v ds(on) 2.2 2.6 2.5 vdc forward transconductance (v ds = 15 vdc, i d = 16 adc) g fs 11 20 mhos dynamic characteristics input capacitance (v 25 vd v 0 vd c iss 3800 5350 pf output capacitance (v ds = 25 vdc, v gs = 0 vdc, f = 1.0 mhz ) c oss 726 1020 reverse transfer capacitance f = 1 . 0 mhz) c rss 183 370 switching characteristics (note 2.) turnon delay time t d(on) 31 60 ns rise time (v dd = 125 vdc, i d = 32 adc, v gs =10vdc t r 133 266 turnoff delay time v gs = 10 vdc, r g = 9.1 w ) t d(off) 93 186 fall time r g 9.1 w ) t f 108 216 gate charge (s fi 8) q t 97 136 nc (see figure 8) (v ds = 200 vdc, i d = 32 adc, q 1 22 (v ds 200 vdc , i d 32 adc , v gs = 10 vdc) q 2 43 q 3 41 sourcedrain diode characteristics forward onvoltage (note 1.) (i s = 32 adc, v gs = 0 vdc) (i s = 32 adc, v gs = 0 vdc, t j = 125 c) v sd 1.0 0.92 1.5 vdc reverse recovery time (s fi 14) t rr 312 ns (see figure 14) (i s =32adc v gs = 0 vdc t a 220 (i s = 32 adc, v gs = 0 vdc, di s /dt = 100 a/ m s) t b 93 reverse recovery stored charge di s /dt = 100 a/ m s) q rr 3.6 m c internal package inductance internal drain inductance (measured from the drain lead 0.25 from package to center of die) l d 4.5 nh internal source inductance (measured from the source lead 0.25 from package to source bond pad) l s 13 nh 1. pulse test: pulse width 300 m s, duty cycle 2%. 2. switching characteristics are independent of operating junction temperature.
mtw32n25e http://onsemi.com 3 typical electrical characteristics r ds(on) , drain-to-source resistance (normalized) r ds(on) , drain-to-source resistance (ohms) r ds(on) , drain-to-source resistance (ohms) 0246810 0 16 48 64 v ds , drain-to-source voltage (volts) figure 1. onregion characteristics i d , drain current (amps) 23456 8 0 16 32 48 64 i d , drain current (amps) v gs , gate-to-source voltage (volts) figure 2. transfer characteristics 0 8 24 40 56 64 0.02 0.04 0.08 0.12 0.16 016324864 0.064 0.072 0.084 i d , drain current (amps) figure 3. onresistance versus drain current and temperature i d , drain current (amps) figure 4. onresistance versus drain current and gate voltage -50 0.4 1.2 2.0 0 100 200 250 1 100 10000 t j , junction temperature ( c) figure 5. onresistance variation with temperature v ds , drain-to-source voltage (volts) figure 6. draintosource leakage current versus voltage i dss , leakage (na) -25 0 25 50 75 100 125 150 t j = 25 c v ds 10 v 25 c t j = -55 c t j = 100 c 25 c -55 c t j = 25 c v gs = 0 v v gs = 10 v v gs = 10 v v gs = 10 v i d = 2.0 a 7 v 6 v 5 v 56 8 24 32 40 0.06 0.1 0.14 0.8 1.6 8 24 40 56 0.068 0.076 0.08 10 1000 13579 7 100 c 16 32 48 8 24 40 56 50 150 t j = 125 c 100 c 25 c 15 v v gs = 10 v 8 v 9 v
mtw32n25e http://onsemi.com 4 power mosfet switching switching behavior is most easily modeled and predicted by recognizing that the power mosfet is charge controlled. the lengths of various switching intervals ( d t) are determined by how fast the fet input capacitance can be charged by current from the generator. the published capacitance data is difficult to use for calculating rise and fall because draingate capacitance varies greatly with applied voltage. accordingly, gate charge data is used. in most cases, a satisfactory estimate of average input current (i g(av) ) can be made from a rudimentary analysis of the drive circuit so that t = q/i g(av) during the rise and fall time interval when switching a resistive load, v gs remains virtually constant at a level known as the plateau voltage, v sgp . therefore, rise and fall times may be approximated by the following: t r = q 2 x r g /(v gg v gsp ) t f = q 2 x r g /v gsp where v gg = the gate drive voltage, which varies from zero to v gg r g = the gate drive resistance and q 2 and v gsp are read from the gate charge curve. during the turnon and turnoff delay times, gate current is not constant. the simplest calculation uses appropriate values from the capacitance curves in a standard equation for voltage change in an rc network. the equations are: t d(on) = r g c iss in [v gg /(v gg v gsp )] t d(off) = r g c iss in (v gg /v gsp ) the capacitance (c iss ) is read from the capacitance curve at a voltage corresponding to the offstate condition when calculating t d(on) and is read at a voltage corresponding to the onstate when calculating t d(off) . at high switching speeds, parasitic circuit elements complicate the analysis. the inductance of the mosfet source lead, inside the package and in the circuit wiring which is common to both the drain and gate current paths, produces a voltage at the source which reduces the gate drive current. the voltage is determined by ldi/dt, but since di/dt is a function of drain current, the mathematical solution is complex. the mosfet output capacitance also complicates the mathematics. and finally, mosfets have finite internal gate resistance which effectively adds to the resistance of the driving source, but the internal resistance is difficult to measure and, consequently, is not specified. the resistive switching time variation versus gate resistance (figure 9) shows how typical switching performance is affected by the parasitic circuit elements. if the parasitics were not present, the slope of the curves would maintain a value of unity regardless of the switching speed. the circuit used to obtain the data is constructed to minimize common inductance in the drain and gate circuit loops and is believed readily achievable with board mounted components. most power electronic loads are inductive; the data in the figure is taken with a resistive load, which approximates an optimally snubbed inductive load. power mosfets may be safely operated into an inductive load; however, snubbing reduces switching losses. 10 5 0 5 15 25 gate-to-source or drain-to-source voltage (volts) c, capacitance (pf) figure 7. capacitance variation 8000 7000 6000 5000 4000 3000 1000 0 v gs v ds c iss c oss c rss t j = 25 c v ds = 0 v v gs = 0 v 2000 10 20 c rss c iss
mtw32n25e http://onsemi.com 5 draintosource diode characteristics 0.5 0.6 0.7 0.8 0.9 1.0 0 8 16 24 32 v sd , source-to-drain voltage (volts) figure 8. gatetosource and draintosource voltage versus total charge i s , source current (amps) figure 9. resistive switching time variation versus gate resistance r g , gate resistance (ohms) 1 10 100 1000 100 10 t, time (ns) v dd = 125 v i d = 32 a v gs = 10 v t j = 25 c t r t f t d(off) t d(on) v gs = 0 v t j = 25 c figure 10. diode forward voltage versus current 300 v gs , gate-to-source voltage (volts) 250 200 150 100 50 0 10 6 2 0 q t , total charge (nc) v ds , drain-to-source voltage (volts) 12 8 4 20 40 60 80 100 i d = 32 a t j = 25 c v ds v gs qt q1 q2 q3 0 10 30 50 70 90 0.55 0.65 0.75 0.85 0.95 safe operating area the forward biased safe operating area curves define the maximum simultaneous draintosource voltage and drain current that a transistor can handle safely when it is forward biased. curves are based upon maximum peak junction temperature and a case temperature (t c ) of 25 c. peak repetitive pulsed power limits are determined by using the thermal response data in conjunction with the procedures discussed in an569, atransient thermal resistancegeneral data and its use.o switching between the offstate and the onstate may traverse any load line provided neither rated peak current (i dm ) nor rated voltage (v dss ) is exceeded and the transition time (t r ,t f ) do not exceed 10 m s. in addition the total power averaged over a complete switching cycle must not exceed (t j(max) t c )/(r q jc ). a power mosfet designated efet can be safely used in switching circuits with unclamped inductive loads. for reliable operation, the stored energy from circuit inductance dissipated in the transistor while in avalanche must be less than the rated limit and adjusted for operating conditions differing from those specified. although industry practice is to rate in terms of energy, avalanche energy capability is not a constant. the energy rating decreases nonlinearly with an increase of peak current in avalanche and peak junction temperature. although many efets can withstand the stress of draintosource avalanche at currents up to rated pulsed current (i dm ), the energy rating is specified at rated continuous current (i d ), in accordance with industry custom. the energy rating must be derated for temperature as shown in the accompanying graph (figure 12). maximum energy at currents below rated continuous i d can safely be assumed to equal the values indicated.
mtw32n25e http://onsemi.com 6 safe operating area 1.0e-05 1.0e-04 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0 0.001 0.01 figure 11. maximum rated forward biased safe operating area 0.1 10 1000 v ds , drain-to-source voltage (volts) 1.0 100 i d , drain current (amps) r ds(on) limit thermal limit package limit 0.1 v gs = 20 v single pulse t c = 25 c 10 1.0 100 t, time (s) figure 12. thermal response r(t), normalized effective transient thermal resistance figure 13. diode reverse recovery waveform di/dt t rr t a t p i s 0.25 i s time i s t b 100 m s 1 ms dc 0.2 0.02 0.1 d = 0.5 0.05 single pulse 0.01 0.1 r q jc (t) = r(t) r q jc d curves apply for power pulse train shown read time at t 1 t j(pk) - t c = p (pk) r q jc (t) p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 10 ms t j , starting junction temperature ( c) e as , single pulse drain-to-source figure 14. maximum avalanche energy versus starting junction temperature avalanche energy (mj) 0 25 50 75 100 125 600 400 300 100 i d = 32 a 500 150 200
mtw32n25e http://onsemi.com 7 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. style 1: pin 1. gate 2. drain 3. source 4. drain r p a k v f d g u l e 0.25 (0.010) m tb m 0.25 (0.010) m yq s j h c 4 123 t b y q dim min max min max inches millimeters a 19.7 20.3 0.776 0.799 b 15.3 15.9 0.602 0.626 c 4.7 5.3 0.185 0.209 d 1.0 1.4 0.039 0.055 e 1.27 ref 0.050 ref f 2.0 2.4 0.079 0.094 g 5.5 bsc 0.216 bsc h 2.2 2.6 0.087 0.102 j 0.4 0.8 0.016 0.031 k 14.2 14.8 0.559 0.583 l 5.5 nom 0.217 nom p 3.7 4.3 0.146 0.169 q 3.55 3.65 0.140 0.144 r 5.0 nom 0.197 nom u 5.5 bsc 0.217 bsc v 3.0 3.4 0.118 0.134 to247 case 340k01 issue c
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