1/5 STTH310/s january 2003 - ed: 1 high voltage ultrafast rectifier ? the STTH310, which is using st ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagneti- zation in power supplies and other power switching applications. description n low forward voltage drop n high reliability n high surge current capability n soft switching for reduced emi disturbances n planar technology features and benefits symbol parameter value unit v rrm repetitive peak reverse voltage 1000 v v (rms) rms voltage 700 v i f(av) average forward current tl = 75c d =0.5 do-201ad 3 a tl = 75c d =0.5 smc 3 i fsm forward surge current t = 8.3 ms do-201ad 55 a smc 45 t stg storage temperature range - 50 + 175 c tj maximum operating junction temperature + 175 c absolute ratings (limiting values) i f(av) 3a v rrm 1000 v tj (max) 175 c v f (max) 1.42 v main product characteristics do-201ad STTH310 smc STTH310s
STTH310/s 2/5 symbol parameter tests conditions min. typ. max. unit i r reverse leakage current v r = 1000v tj = 25c 10 a tj = 125c 50 v f forward voltage drop i f = 3 a tj = 25c 1.7 v tj = 150c 0.98 1.42 to evaluate the maximum conduction losses use the following equation : p=1.20xi f(av) + 0.075 x i f 2 (rms) static electrical characteristics symbol parameter value unit r th (j-l) junction to lead l = 10 mm do-201ad 20 c/w smc 20 r th (j-a) junction to ambient l = 10 mm do-201ad 75 thermal parameters symbol parameter tests conditions min. typ. max. unit t rr reverse recovery time i f = 0.5 a irr = 0.25 a i r =1a tj = 25c 75 ns t fr forward recovery time i f =3a di f /dt = 50 a/s v fr =1.1xv f max tj = 25c 300 ns v fp forward recovery voltage 12 v dynamic electrical characteristics
STTH310/s 3/5 p(w) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 i (a) f(av) t d =tp/t tp d = 1 d = 0.05 d = 0.5 d = 0.2 d = 0.1 fig. 1: conduction losses versus average current. i (a) fm 0.1 1.0 10.0 100.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 t =25c (maximum values) j v (v) fm t =150c (maximum values) j t =150c (typical values) j fig. 2: forward voltage drop versus forward current . z/r th(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 d = 0.5 d = 0.2 d = 0.1 single pulse t d =tp/t tp t (s) p fig. 3-1: relative variation of thermal impedance junction ambient versus pulse duration (epoxy fr4, l leads = 10mm) (do-201ad). z/r th(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 t d =tp/t tp t (s) p d = 0.5 d = 0.2 d = 0.1 single pulse fig. 3-2: relative variation of thermal impedance junction ambient versus pulse duration (epoxy fr4, s=1cm 2 ) (smc). r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 110 012345 smb do-201ad l =10mm leads s(cm2) fig. 4: thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board fr4, copper thickness: 35m) .
STTH310/s 4/5 package mechanical data smc e c l e2 e1 d a1 a2 b ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 d 5.55 6.25 0.218 0.246 l 0.75 1.60 0.030 0.063 2.0 4.2 2.0 3.3 footprint (in millimeters)
STTH310/s 5/5 package mechanical data do-201ad ba e e ?d ?d ?c b note 2 note 1 note 1 ref. dimensions notes millimeters inches min. max. min. max. a 9.50 0.374 1 - the lead diameter ? d is not controlled over zone e 2 - the minimum length which must stay straight between the right angles after bending is 0.59"(15 mm) b 25.40 1.000 c 5.30 0.209 d 1.30 0.051 e 1.25 0.049 ordering code marking package weight base qty delivery mode STTH310 STTH310 do-201ad 1.12 g 600 ammopack STTH310s s10 smc 0.245 g 2500 tape & reel STTH310rl STTH310 do-201ad 1.12 g 1900 tape & reel n epoxy meets ul 94,v0 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 2003 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany hong kong - india - israel - italy - japan - malaysia - malta - morocco - singapore spain - sweden - switzerland - united kingdom - united states. http://www.st.com
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