november 1998 fdc6329 l integrated load switch general description features absolute maximum ratings t a = 25c unless otherwise noted symbol parameter fdc6329 l units v in input voltage range (note 1) 2.5 - 8 v v on/off on/off voltage range 1.5 - 8 v i l load current - continuous (note 2) 2.5 a - pulsed 10 p d maximum power dissipation (note 2) 0.7 w t j ,t stg operating and storage temperature range -55 to 150 c esd electrostatic discharge rating mil-std-883d human body model (100pf/1500ohm) 6 kv thermal characteristics r q ja thermal resistance, junction-to-ambient (note 2) 180 c/w r q jc thermal resistance, junction-to-case (note 2) 60 c/w fdc6329 l rev.c this device is particularly suited for compact p ower m anagement in portable electronic equipment where 2.5 v to 8 v input and 2.5 a output current capability are needed. this load switch integrates a small n -c hannel p ower mosfet (q1) which drives a large p -c hannel p ower mosfet (q2) in one tiny supersot tm -6 package. v drop =0.2 v @ v in =5v, i l =2.8 a. r (on ) = 0.07 w v drop =0.2 v @ v in =2.5 v, i l = 1.9 a. r (on ) = 0.105 w. control mosfet (q1) includes zener protection for esd ruggedness (>6kv human body model). high performance trench technology for extremely low on-resistance. supersot tm -6 package design using copper lead frame for superior thermal and electrical capabilities. see application circuit 1 5 6 3 2 q2 q1 4 v , c out 1 r 2 v , r in 1 on/off v r , c 1 1 v , c out 1 in out on/off equivalent circuit v drop + - supersot -6 tm .329 pin 1 sot-23 supersot t m -8 soic-16 so-8 sot-223 supersot t m -6
electrical characteristics (t a = 25c unless otherwise noted) symbol parameter conditions min typ max units off characteristics i fl forward leakage current v in = 8 v, v on/off = 0 v 1 a on characteristics (note 3 ) v drop conduction voltage v in = 5 v, v on/off = 3.3 v , i l = 2.8 a 0.12 0.2 v v in = 2.5 v, v on/off = 3.3 v , i l = 1.9 a 0.14 0.2 r (on) q 2 - static on-resistance v gs = -5 v, i d = -2.5 a 0.047 0.07 w v gs = -2 .5 v, i d = -2.0 a 0.073 0.105 i l load current v drop = 0.2 v , v in = 5 v, v on/off = 3.3 v 2.8 a v drop = 0.2 v , v in = 2.5 v, v on/off = 3.3 v 1.9 notes: 1. range of v in can be up to 8 v, but r 1 and r 2 must be scaled such that v gs of q2 does not exceed -8 v. 2. r q ja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the so lder mounting surface of the drain pins. r q jc is guaranteed by design while r q ca is determined by the user's board design. 3 . pulse test: pulse width < 300s, duty cycle < 2.0%. fdc6329 l load switch application external component recommendation: for applications where co 1 m f. for slew rate control, select r2 in the range of 1k - 4.7k w . for additional in-rush current control, c1 1000pf can be added. select r1 so that the r1/r2 ratio ranges from 10 - 100. r1 is required to turn q2 off. fdc6329 l rev.c
fdc6329 l rev.c 0.00001 0.0001 0.001 0.01 0.1 1 10 100 300 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 t , time (sec) transient thermal resistance 1 single pulse d = 0.5 0.1 0.05 0.02 0.01 0.2 duty cycle, d = t / t 1 2 r (t) = r(t) * r r = see note 2 q ja q ja q ja t - t = p * r (t) q ja a j p(pk) t 1 t 2 r(t), normalized effective figure 4 . transient thermal response curve. thermal characterization performed using the conditions described in note 2. transient thermal response will change depending on the circuit board design . typical electrical characteristics (t a = 25 o c unless otherwise noted ) 0 0.6 1.2 1.8 2.4 3 0 0.05 0.1 0.15 0.2 i , (a) v ,(v) drop l v = 5v v = 1.5 - 8v pw =300us, d 2% on/off in t = 125c j t = 25c j 0 0.6 1.2 1.8 2.4 3 0 0.05 0.1 0.15 0.2 i , (a) v , (v) drop l v = 2.5v v = 1.5 - 8v pw =300us, d 2% on/off in t = 125c j t = 25c j 1 2 3 4 5 0 0.04 0.08 0.12 0.16 0.2 v , (v) r ,(ohm) in i = 1a v = 1.5 - 8v pw =300us, d 2% on/off l (on) t = 125c j 25c figure 1 . conduction voltage drop v ariation w ith load current . figure 2 . conduction voltage drop v ariation w ith load current . figure 3 . on-resistance variation with i nput voltage .
? 1998 fairchild semiconductor corporation ssot-6 unit orientation conductive embossed carrier tape f63tnr label customize label antistatic cover tape ssot-6 packaging configuration: figure 1.0 components leader tape 390mm minimum trailer tape 160mm minimum ssot-6 tape leader trailer configuration: figure 2.0 cover tape carrier pin 1 tape note/comments packaging option ssot-6 packaging information standard (no flow code) d87z packaging type reel size tnr 7?dia tnr 13 qty per reel/tube/bag 3,000 10,000 box dimension (mm) 184x187x47 343x343x64 max qty per box 9,000 20,000 weight per unit (gm) 0.0158 0.0158 weight per reel (kg) 0.1440 0.4700 184mm x 184mm x 47mm pizza box for standard option f63tnr label f63tnr label f63tnr label sample 343mm x 342mm x 64mm intermediate box for d87z option 631 631 631 631 lot: cbvk741b019 fsid: fdc633n d/c1: d9842 qty1: spec rev: qarv: spec: qty: 3000 d/c2: qty2: cpn: (f63tnr)2 f63tnr label supersot tm -6 tape and reel data and package dimensions december 1998, rev. b
p1 a0 d1 p0 f w e1 d0 e2 b0 tc wc k0 t dimensions are in inches and millimeters tape size reel option dim a dim b dim c dim d dim n dim w1 dim w2 dim w3 (lsl-usl) 8mm 7?dia 7.00 177.8 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 2.165 55 0.331 +0.059/-0.000 8.4 +1.5/0 0.567 14.4 0.311 ?0.429 7.9 ?10.9 8mm 13?dia 13.00 330 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 4.00 100 0.331 +0.059/-0.000 8.4 +1.5/0 0.567 14.4 0.311 ?0.429 7.9 ?10.9 see detail aa dim a max 13?diameter option 7 diameter option dim a max see detail aa w3 w2 max measured at hub w1 measured at hub dim n dim d min dim c b min detail aa notes: a0, b0, and k0 dimensions are determined with respect to the eia/jedec rs-481 rotational and lateral movement requirements (see sketches a, b, and c). 20 deg maximum component rotation 0.5mm maximum 0.5mm maximum sketch c (top view) component lateral movement typical component cavity center line 20 deg maximum typical component center line b0 a0 sketch b (top view) component rotation sketch a (side or front sectional view) component rotation user direction of feed ssot-6 embossed carrier tape configuration: figure 3.0 ssot-6 reel configuration: figure 4.0 dimensions are in millimeter pkg type a0 b0 w d0 d1 e1 e2 f p1 p0 k0 t wc tc ssot-6 (8mm) 3.23 +/-0.10 3.18 +/-0.10 8.0 +/-0.3 1.55 +/-0.05 1.00 +/-0.125 1.75 +/-0.10 6.25 min 3.50 +/-0.05 4.0 +/-0.1 4.0 +/-0.1 1.37 +/-0.10 0.255 +/-0.150 5.2 +/-0.3 0.06 +/-0.02 supersot tm -6 tape and reel data and package dimensions, continued december 1998, rev. b
? 1998 fairchild semiconductor corporation supersot ? -6 (fs pkg code 31, 33) 1 : 1 scale 1:1 on letter size paper dimensions shown below are in: inches [ m ill imeters ] part weight per unit (gram): 0.0158 supersot tm -6 tape and reel data and package dimensions, continued september 1998, rev. a
trademarks acex? coolfet? crossvolt? e 2 cmos tm fact? fact quiet series? fast ? fastr? gto? hisec? the following are registered and unregistered trademarks fairchild semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. life support policy fairchilds products are not authorized for use as critical components in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: isoplanar? microwire? pop? powertrench? qs? quiet series? supersot?-3 supersot?-6 supersot?-8 tinylogic? 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms datasheet identification product status definition advance information preliminary no identification needed obsolete this datasheet contains the design specifications for product development. specifications may change in any manner without notice. this datasheet contains preliminary data, and supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains final specifications. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains specifications on a product that has been discontinued by fairchild semiconductor. the datasheet is printed for reference information only. formative or in design first production full production not in production disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. fairchild does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. uhc? vcx?
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