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z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc- qp- 7- 07- 25 (rev.00) 1 features applications description SZM04A0A * the appearance and specifications of the product can be changed for improvement without notice. the z-power series is designed for high current ope ration and high flux output applications. it incorporates state of the art smd design and low thermal resistant material. the z power led is ideal light sources for general illumination applications, custom designed solutions and a high luminous efficacy. ? super high flux output and high luminance ? designed for high current operation ? smt solderable ? lead free product ? rohs compliant ? general luminaries ? bulb ? fixture specification
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 2 [ contents ] 1. description ------- 1 2. full code of z4 series ------- 3 3. outline demensions ------- 4 4. characteristics of z4 led ------- 5 5. characteristic diagrams ------- 6 4. labeling ---- -- 13 5. reel packing ------ 1 6 6. recommended solder pad ------ 17 7. soldering profile ------ 18 8. precaution for use ------ 19 9. revision history ------ 21
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com part number of z4 mint ( SZM04A0A) x 1 company s ssc x 2 package series z z-power x 3 color m mint white x 4 0 x 5 z-power series number 4 z4 series x 6 lens type a dome type x 7 pcb type 0 emitter x 8 revision no. a rev0 x 9 x 10 brightness bin - - x 11 x 12 color bin - - x 13 vf bin - - 1. part number form : x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 C x 9 x 10 x 11 x 12 x 13 2. sticker diagram on reel & aluminum vinyl bag 3 lot number : xxxxxxxxxx-xxx-xxx-xxxxxxx quantity : 500 rank : x 9 x 10 x 11 x 12 x 13 x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 ssc part number : x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 4 outline dimensions notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.20mm side view top view bottom view circuit
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 5 characteristics of z4 (SZM04A0A) mint white 1. electro-optical characteristics at 350ma 2. absolute maximum ratings parameter symbol value unit min typ max luminous flux [1] v [2] 120 140 lm correlated color temperature [3] cct - 4400 - k cri r a - 57 - - forward voltage [4] v f - 3.3 3.5 v thermal resistance (j to s) r j-s 9.9 k /w view angle 2 ? 130 deg. parameter symbol value unit forward current i f 500 ma power dissipation p d 2.0 w junction temperature t j 125(@ i f 500ma) oc operating temperature t opr -40 ~ +100 oc storage temperature t stg -40 ~ +100 oc esd sensitivity [5] - 6,000v hbm - *notes : [1] ssc maintains a tolerance of 10% on flux and power measurements. [2] v is the total luminous flux output as measured with an integrating sphere. [3] correlated color temperature is derived from th e cie 1931 chromaticity diagram. cct 5% tolerance. [4] tolerance is 0.06v on forward voltage measurements [5] a zener diode is included to protect the product from esd.
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 6 color spectrum t a =25 * the height of the blue leak depends on cie x and y. it would be higher than the graph above if the cie x and y is lower. 300 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 1.2 relative radiant power [a.u.] wavelength [nm] SZM04A0A standard eye response curve
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 7 normalized relative luminous flux vs. forward curren t, ta=25 forward voltage vs. forward current, ta=25 forward current characteristics 100 150 200 250 300 350 400 450 500 0.0 0.4 0.8 1.2 1.6 2.0 relative luminous flux forward current(ma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 average forward current [a] forward voltage [v]
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 8 cct vs. forward current, ta=25 forward current characteristics 100 150 200 250 300 350 400 450 500 4000 4100 4200 4300 4400 4500 cct[k] forward current[ma]
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 9 relative light output vs. junction temperature at if=350ma junction temperature characteristics 25 50 75 100 125 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 foward voltage variaton [v] junction temperature [ o c] forward voltage shift vs. junction temperature at i f =350ma 25 50 75 100 125 0 20 40 60 80 100 120 relative luminous flux [%] junction temperature [? ]
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 10 color coordinate shift vs junction temperature at if= 350ma junction temperature characteristics 0.37 0.38 0.39 0.40 0.46 0.47 0.48 0.49 0.50 125c 100c 80c 60c 40c 25c cie y cie x cct vs. junction temperature at if=350ma 25 50 75 100 125 4100 4200 4300 4400 4500 4600 cct[k] junction temperature [ [[ [ o c ] ]] ]
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 11 radiation pattern 0 30 60 90 -80 -60 -40 -20 0 0.0 0.2 0.4 0.6 0.8 1.0 relative intensity angle [deg.]
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 12 maximum forward current vs. ambient temperature 0 25 50 75 100 125 0 100 200 300 400 500 rja t = 25 o c/w rja t = 35 o c/w rja t = 45 o c/w current [ma] ambient temperature [ o c] 0 25 50 75 100 125 0 100 200 300 400 500 600 rja t = 25 o c/w rja t = 35 o c/w rja t = 45 o c/w current [ma] ambient temperature [ o c]
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 13 label lot number : xxxxxxxxxx-xxx-xxx-xxxxxxx quantity : 500 rank : x 9 x 10 x 11 x 12 x 13 x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 ssc part number : x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 x 1 company s ssc x 2 package series z z-power x 3 color m mint white x 4 0 x 5 z-power series number 4 z4 series x 6 lens type a dome type x 7 pcb type 0 emitter x 8 revision no. a rev0 x 9 x 10 brightness bin - - x 11 x 12 color bin - - x 13 vf bin - - 1. part number form : x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 C x 9 x 10 x 11 x 12 x 13 full code form (szww4a0a)
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 14 if=350ma, ta=25 tolerance cct : 5% of value cie x cie x cie x cie x cie y cie y cie y cie y 0.3422 0.4849 0.3500 0.5020 0.4006 0.4740 0.3924 0.4604 0.3422 0.4849 0.3500 0.5020 0.3578 0.5191 0.4088 0.4875 0.4006 0.4740 0.3500 0.5020 0.3578 0.5191 0.3734 0.5532 0.4248 0.5141 0.4088 0.4875 0.3578 0.5191 m1 m1m1 m1 m3 m3m3 m3 m2 m2m2 m2 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.44 0.46 0.48 0.50 0.52 0.54 0.56 mint white y x m1 m1m1 m1 m2 m2m2 m2 m3 m3m3 m3 binning structure
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 154.0 ~ 177.0 w1 130.0 ~ 140.0 v2 140.0 ~ 154.0 v3 118.5 ~ 130.0 v1 luminous flux [lm] bin code luminous flux bins the list explains the photometric luminous flux bin s for z-power led. z-power led are tested and binned by photometric luminous flux. not all bins are available in all colors. tolerance : 10% of luminous flux value forward voltage bins tolerance : 0.06v 3.25 ~ 3.50 i 3.00 ~ 3.25 h forward voltage [v] bin code
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 16 emitter carrier & reel packaging 13 22 cathode mark cathode mark cathode mark cathode mark
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 17 recommended solder pad notes : [1] all dimensions are in millimeters. [2] scale : none [3] this drawing without tolerances are for referen ce only temperature check point
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 18 reflow soldering conditions / profile * caution 1. reflow soldering should not be done more than one ti me. 2. repairs should not be done after the leds have been s oldered. when repair is unavoidable, suitable tools must be used. 3. die slug is to be soldered. 4. when soldering, do not put stress on the leds during h eating. 5. after soldering, do not warp the circuit board. 6. recommend to use a convection type reflow machine with 7 ~ 8 zones. pre-heating 200 180 150 ~ 0 [c] 220 240 260 rising 5 c/sec tm : reflow machine setting temp (max 30 sec.) ts : surface temp of pcb (min) ts : surface temp of pcb (max) ts : surface temp of pcb (recommend) cooling -5 c/sec time [ hr]
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 19 ? storage to avoid the moisture penetration, we recommend sto ring z power leds in a dry box with a desiccant . the recommended storage temperat ure range is 5c to 30c and a maximum humidity of 50%. ? use precaution after opening the packaging use proper smd techniques when the led is to be sol dered dipped as separation of the lens may affect the light output efficiency. pay attention to the following: a. soldering should be done immediately after openi ng the package (within 24hrs). b. required conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than 30% c. if the package has been opened more than 1 week or the color of the desiccant changes, components should be dried for 10-12hr at 60 5 ? do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. ? do not rapidly cool device after soldering. ? components should not be mounted on warped (non cop lanar) portion of pcb. ? radioactive exposure is not considered for the pro ducts listed here in. ? gallium arsenide is used in some of the products l isted in this publication. these products are dangerous if they are burned or shredded in the pro cess of disposal. it is also dangerous to drink the liquid or inhale the gas generated by suc h products when chemically disposed of. ? this device should not be used in any type of flui d such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) s hould be used. ? when the leds are in operation the maximum current should be decided after measuring the package temperature. ? leds must be stored properly to maintain the device . if the leds are stored for 3 months or more after being shipped from ssc, a sealed contain er with a nitrogen atmosphere should be used for storage. ? the appearance and specifications of the product m ay be modified for improvement without notice. ? long time exposure of sunlight or occasional uv ex posure will cause lens discoloration. ? the slug is isolated. ? attaching leds, do not use adhesives that outgas o rganic vapor. precaution for use
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com 20 the z-power led is encapsulated with a silicone res in for the highest flux efficiency. notes for handling: ? avoid touching silicone resin parts especially with sharp tools such as pincette (tweezers) ? avoid leaving fingerprints on silicone resin parts . ? silicone resin will attract dust so use covered co ntainers for storage. ? when populating boards in smt production, there ar e basically no restrictions regarding the form of the pick and place nozzle, ex cept that excessive mechanical pressure on the surface of the resin must be preven ted. ? it is not recommend to cover the silicone resin of the leds with other resin (epoxy, urethane, etc) handling of silicone resin leds
z-power led x10490 z-power led x10490 technical data sheet rev. 00 rev. 00 january. january. 2012 2012 www.seoulsemicon.com www.seoulsemicon.com revision profile rev.00 version initial specification change issue 2012.01.26 change date 1 no

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