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? 1 ? e00x48-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. ILX553A 22 pin dip (plastic) description the ILX553A is a reduction type ccd linear sensor developped for dppc, multifunction printers. this sensor reads a4-size documents at a density of 600 dpi at high speed of 16mh z . features ? number of effective pixels: 5150 pixels pixel size: 7m 7m (7m pitch) clamp circuit is on-chip ultra high sensitivity/ultra low lag maximum data rate: 16mhz single 12v power supply input clock pulse: cmos 5v drive package: 22 pin plastic dip (400mil) absolute maximum ratings supply voltage v dd 15 v operating temperature ?10 to +60 c storage temperature ?30 to +80 c pin configuration (top view) 5150-pixel ccd linear sensor (b/w) block diagram gnd gnd gnd gnd v out v dd gnd 1 gnd gnd gnd gnd gnd lh rs gnd clp rog 2 gnd gnd gnd 1 5150 1 2 3 4 5 6 7 8 9 10 11 22 21 20 19 18 17 16 15 14 13 12 ccd register read out gate driver v dd d14 d15 d63 s1 d64 s5150 d 6 lh 20 2 15 rog 16 1 8 rs 19 clp 17 v out 5
? 2 ? ILX553A item min. 1, 2, lh, rs, clp, rog pulse voltage 4.75 0 ty p. 5.0 ? max. 5.25 0.1 unit v v input clock pulse voltage condition high level low level item min. 1, 2, lh, rs, clp ? ty p. 1 max. 16 unit mhz clock frequency symbol f 1 , f 2 , f lh , f rs , f clp item min. input capacity of 1, 2 input capacity of lh ? 1 input capacity of rs ? 1 input capacity of clp ? 1 input capacity of rog ? ? ? ? ? ty p . 400 10 10 10 10 max. ? ? ? ? ? unit pf pf pf pf pf clock characteristics symbol c 1 , c 2 c lh c rs c clp c rog item min. v dd 11.4 ty p. 12.0 max. 12.6 unit v recommended supply voltage pin description pin no. symbol description 1 2 3 4 5 6 7 8 9 10 11 gnd gnd gnd gnd v out v dd gnd 1 gnd gnd gnd gnd gnd gnd gnd signal out 12v power supply gnd clock pulse input gnd gnd gnd pin no. symbol description 12 13 14 15 16 17 18 19 20 21 22 gnd gnd gnd 2 rog clp gnd rs lh gnd gnd gnd gnd gnd clock pulse input clock pulse input clock pulse input gnd clock pulse input clock pulse input gnd gnd
? 3 ? ILX553A electrooptical characteristics (note 1) ta = 25 c, v dd = 12v, f r = 2mhz, input clock = 5vp-p, light source = 3200k, ir cut filter cm-500s (t = 1.0mm) item min. sensitivity sensitivity nonuniformity saturation output voltage saturation exposure dark voltage average dark signal nonuniformity image lag supply current total transfer efficiency output impedance offset level 11.8 ? 1 ? ? ? ? ? 92 ? ? ty p. 14.8 4 2 0.14 0.3 0.6 0.02 15 98 230 6.2 max. 17.8 10 ? ? 2 3 ? 30 ? ? ? unit v/(lx s) % v lx s mv mv % ma % ? v symbol r prnu v sat se r v drk dsnu il i vdd tte z o v os remarks note 2 note 3 note 4 note 5 note 6 note 7 ? ? ? note 8 notes 1) in accordance with the given electrooptical characteristics, the even black level is defined as the average value of d14, d15, to d62. 2) for the sensitivity test light is applied with a uniform intensity of illumination. 3) prnu is defined as indicated below. ray incidence conditions are the same as for note 2. v out = 500mv (typ.) prnu = 100 [%] the maximum output of 5150 pixels is set to v max , the minimum output to v min and the average output to v ave . 4) use below the minimum value of the saturation output voltage. 5) saturation exposure is defined as follows. se = 6) optical signal accumulated time int stands at 10ms. 7) v out = 500mv (typ.) 8) v os is defined as indicated bellow. (v max ? v min )/2 v ave v sat r v os v out gnd
? 4 ? ILX553A clock timing chart 1 5 0 5 1 d3 d1 d62 d61 d15 d14 d13 d2 d63 s2 s1 s5150 s5149 s5148 d65 d64 1 2 3 rog 5 0 0 5 0 lh 2 rs v out 4 0 5 clp optical black (49 pixles) dummy signal (63 pixles) 1-line output period (5220 pixles) note) the transfer pulses ( 1, 2, lh) must have more than 5220 cycles.
? 5 ? ILX553A clock timing chart 2 clock timing chart 3 1 lh rog 1 lh 2 rs v out 2 clp t9 t10 t6 t5 t4 t6 t7 t7 t11 t8 t1 t3 t2 t14 t13 t15 t12 t17 t16
? 6 ? ILX553A clock timing chart 4 2 lh 0v 5v 1 2 0v 5v cross point 1 and 2 cross point lh and 2 1.5v (min.) 2.0v (min.) 1.5v (min.) 0.5v (min.)
? 7 ? ILX553A item rog, 1 pulse timing rog pulse high level period rog, 1 pulse timing rog pulse rise time rog pulse fall time 1 pulse rise time/ 2 pulse fall time 1 pulse fall time/ 2 pulse rise time rs pulse high level period rs, clp pulse timing rs pulse rise time rs pulse fall time clp pulse high level period clp, lh pulse timing clp pulse rise time clp pulse fall time signal output delay time unit ns ? ? ns ns ns ns ns ns ns ns ns ns ns ns ns ns ? 1 these timing is the recommended condition under f rs = 1mhz. clock pulse recommended timing symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 min. 50 3 1 0 0 0 0 10 10 0 0 20 5 0 0 ? ? ty p . 100 5 2 5 5 20 20 200 ? 1 200 ? 1 10 10 200 ? 1 50 ? 1 10 10 15 8 max. ? ? ? 10 10 60 60 ? ? 30 30 ? ? 30 30 ? ?
? 8 ? ILX553A application circuit ? ? data rate f rs = 1mhz lh v out tr 1 100 ? 2 ? ic1 1 5.1k ? 47?/16v 0.1? 12v 100 ? ic2 rs 100 ? clp 100 ? ic2 ic1 rog 100 ? 2 2 ? gnd gnd lh rs gnd clp 17 18 19 20 21 22 rog 2 gnd gnd gnd 12 13 14 15 16 gnd gnd gnd gnd v out v dd 1 2 3 4 5 6 gnd 1 gnd gnd gnd 7 8 9 10 11 application circuits shown are typical examples illustrating the operation of the devices. sony cannot assume responsibility fo r any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same . ic1: 74ac04 ic2: 74hc04 tr1: 2sc2785
? 9 ? ILX553A example of representative characteristics (v dd = 12v, ta = 25 c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 wavelength [nm] relative sensitivity spectral sensitivity characteristics (standard characteristics) 800 900 1000 10 5 1 0.5 0.1 01020 ta ? ambient temperature [?c] dark signal output temperature characteristics (standard characteristics) output voltage rate 30 40 50 60 1 0.5 0.1 1 int ?integration time [ms] integration time output voltage characteristics (standard characteristics) output voltage rate 510 10 ta = 25?c 8 6 4 2 0 11.4 ? v os ? v dd offset level vs. v dd characteristics (standard characteristics) v os ?offset level [v] 12.0 12.6 10 8 6 4 2 0 0 ta ?ambient temperature [?c] v dd [v] 0.6 offset level vs. temperature characteristics (standard characteristics) v os ?offset level [v] 30 20 10 40 50 60 ? v os ? ta ?mv/?c
?10 ILX553A notes of handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensor. e) for the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) notes on handling ccd packages the following points should be observed when handling and installing packages. a) remain within the following limits when applying static load to the package: (1) compressive strength: 39n/surface (do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) shearing strength: 29n/surface (3) tensile strength: 29n/surface (4) torsional strength: 0.9nm plastic portion cover glass 39n ceramic portion adhesive (1) 29n (3) 0.9nm (4) 29n (2) b) in addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) be aware that any of the following can cause the package to crack or dust to be generated. (1) applying repetitive bending stress to the external leads. (2) applying heat to the external leads for an extended period of time with soldering iron. (3) rapid cooling or heating. (4) prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) applying the metal a crash or a rub against the plastic portion. note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. d) the notch of the plastic portion is used for directional index, and that can not be used for reference of fixing. in addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap with the notch of the plastic portion.
11 ILX553A 3) soldering a) make sure the package temperature does not exceed 80 c. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a grounded 30w soldering iron and solder each pin in less then 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an imaging device, do not use a solder suction equipment. when using an electric desoldering tool, ground the controller. for the control system, use a zero cross type. 4) dust and dirt protection a) operate in clean environments. b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) exposure to high temperatures or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. 6) ccd image sensors are precise optical equipment that should not be subject to mechanical shocks.
12 ILX553A sony corporation package structure package material lead treatment lead material package mass drawing number plastic, ceramic gold plating 42 alloy ls-b23-01(e) 1. the height from the bottom to the sensor surface is 2.38 ?0.3mm. 2. the thickness of the cover glass is 0.7mm, and the refractive index is 1.5. ? the dimension of cover glass is 54.2 9.0mm or 53.0 7.3mm. 5.43g m 1 22 11 12 10.6 0.3 10.16 55.7 0.3 2.54 0.51 0.25 ? 7.3 or 9.0 ? 53.00 or 54.2 3.58 h v 22 pin dip (400mil) 36.05 (7? x 5150pixels) no.1 pixel 10.0 0.3 0? to 9? 4.28 0.5 0.3 4.0 0.5 5.0 0.3 package outline unit: mm

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