2009-02-19 1 ESD0P8RFL rf esd protection diodes ? esd protection of rf antenna / interfaces or ultra high speed data lines acc. to: iec61000-4-2 (esd): 20 kv (air / contact) iec61000-4-4 (eft): 40 a (5/50 ns) iec61000-4-5 (surge): 10 a (8/20 s) ? very low line capacitance: 0.8 pf @ 1 ghz ( 0.4 pf per diode) ? ultra low series inductance: 0.4 nh per diode ? very low clamping voltage ? ultra small leadless package 1.2 x 0.8 x 0.39 mm ? pb-free (rohs compliant) package ? qualified according aec q101 applications in anti-parallel configuration ? for low rf signal levels without superimposed dc voltage: e.g. gps, xm-radio, sirius, dvb, dmb, dab, remote keyless entry applications in rail-to-rail configuration ? for high rf signal levels or low rf signal levels with superimposed dc voltage: e.g. hdmi, s-ata, gbit ethernet ? for more technical details on esd and antenna protection please refer to application note no.103 on www.infineon.com/tvsdiodes ESD0P8RFL 2 1 4 d2 d1 3 type package configuration marking ESD0P8RFL tslp-4-7 anti-parallel e8
2009-02-19 2 ESD0P8RFL maximum ratings at t a = 25c, unless otherwise specified parameter symbol value unit esd contact discharge 1) v esd 20 kv peak pulse current ( t p = 8 / 20 s) 2) i pp 10 a operating temperature range t o p -55...150 c storage temperature t st g -65...150 electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. characteristics - reverse working voltage 3) v rwm - - 50 v reverse current 3) v r = 50 v i r - - 100 na forward clamping voltage 2) i pp = 10 a v fc - 12 15 v line capacitance 4) v r = 0 v, f = 1 ghz c t - 0.8 - pf series inductance (per diode) l s - 0.4 - nh 1 v esd according to iec61000-4-2, only valid in anti-parallel or rail-to-rail connection. please refer to the application examples. 2 i pp according to iec61000-4-5, only valid in anti-parallel or rail-to-rail connection. please refer to the application examples. 3 only valid in rail-to-rail configuration with v cc v rwm 4 total capacitance line to ground (2 diodes in parallel)
2009-02-19 3 ESD0P8RFL forward clamping voltage v fc = ? ( i pp ) t p = 8 / 20 s 1 2 3 4 5 6 7 8 a 10 i pp 0 1 2 3 4 5 6 7 8 9 10 v 12 v fc reverse current i r = ? ( v r ) t a = parameter leakage in rail-to-rail configuration 0 10 20 30 40 50 v 70 v r -12 10 -11 10 -10 10 -9 10 -8 10 -7 10 -6 10 -5 10 a i r -40c 25c 85c 125c forward current i f = ? ( v f ) t a = parameter leakage in anti-parallel configuration -600 -400 -200 0 200 mv 600 v f -100 -80 -60 -40 -20 0 20 40 60 a 100 i f -40c -40c 25c 25c 85c 85c 125c 125c line capacitance c t = ? (f) v r = 0 v 0 500 1000 1500 2000 mhz 3000 f 0 0.5 pf 1.5 c t
2009-02-19 4 ESD0P8RFL insertion loss i l = -|s 21 | 2 = ? ( f ) v r = 0 v, z = 50 ? 0 500 1000 1500 2000 mhz 3000 f -1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 db 0 | s 21 |2
2009-02-19 5 ESD0P8RFL 1. application example 1 rf signal channel, anti-parallel configuration, please refer also to application note no.103 the protection diode should be placed very close to the location where the esd or other transients can occur to keep loops and inductances as small as possible. grounded pins should be connected in parallel directly to a ground plane on the board. esd sensitive circuit i/o 1 protected signal line, superimposed dc voltage up to v f (diode forward volatge) line to ground capacitance 0.8 pf @1 ghz 2. application example 1 rf signal channel, rail-to-rail configuration cathode of one diode should be connected to the positive supply voltage +vcc and anode of the opposite diode should be connected directly to a ground plane on the board. clamped input voltage at i/o port is limited to vcc + vf at positive transients and 0v - vf at negative transients (vf ... diode forward voltage drop). +vcc esd sensitive circuit i/o 1 protected signal line, superimposed dc voltage up to +vcc (voltage supply) line to ground capacitance 0.8 pf @1 ghz
2009-02-19 6 ESD0P8RFL package tslp-4-7 1 2 4 3 3 4 0.05 max. +0.01 0.39 -0.03 1) dimension applies to plated terminal 1 2 0.05 0.8 0.45 0.05 4x 0.25 1) 0.035 0.035 1) 4x0.35 0.75 0.05 1.2 0.05 bottom view top view pin 1 marking 1.05 4 1.45 0.5 pin 1 marking 8 reel ?180 mm = 15.000 pieces/reel for board assembly information please refer to infineon website "packages" package outline foot print marking layout (example) standard packing stencil apertures copper solder mask 1.18 0.28 0.22 0.28 0.38 0.38 0.42 0.78 1.2 0.3 0.2 0.3 0.4 0.4 0.4 0.8 bar90-07lrh type code pin 1 marking laser marking
2009-02-19 7 ESD0P8RFL edition 2006-02-01 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2007. all rights reserved. attention please! the information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
|
