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  caution : observe precautions when handling because these devices are sensitive to electrostatic discharge bipolar analog integrated circuit ? pc82 3 6 t 6 n sige :c low noise amplifier for gps document no. pu10713ej01v0ds (1st edition) date published march 2008 ns description the ? pc8236t6n is a silicon germanium carbon (sige :c ) monolithic integrated circuit designed as low noise amplifier for gps . this device exhibits low noise figure and high power gain characteristics, so this ic can improve the sensitivity of g ps receiver . in addition , the ? pc8236t6n which is included output matching circuit contributes to reduce external components and system size . th e package is a 6 - pin plastic ts on ( t hin s mall o ut - line n on - leaded) (t6n) suitable for surface mount . this ic is manufactured using our uhs 4 ( u ltra h igh s peed process) sige :c bipolar process. features ? supply voltage : v cc = 1.6 to 3.3 v (2.7 v typ.) ? low noise : nf = 0.8 db typ. @ v cc = 2.7 v, f in = 1 575 mhz : nf = 0.8 db typ. @ v cc = 1.8 v, f in = 1 575 mhz ? high gain : g p = 19.5 db typ. @ v cc = 2.7 v, f in = 1 575 mhz : g p = 19.1 db typ. @ v cc = 1.8 v, f in = 1 575 mhz ? low current consumption : i cc = 6.5 ma typ . @ v cc = 2.7 v ? built - in power - saving function : v pson = 1.0 v to v cc , v psoff = 0 to 0.4 v ? high - density surface mounting : 6 - pin plastic ts on (t6n) package (1.5 ? 1. 5 ? 0. 37 mm ) ? included output matching circuit ? included very robust bandgap regulator (small v cc and t a dependence) ? included protection circuits for esd applica t ion ? low noise amplifier for gps ordering in formation part number order number package marking supplying form ? pc8236t6n - e2 ? pc8236t6n - e2 - a 6 - pin plastic tson (t6n) (pb - free) 6 s ? 8 mm wide embossed taping ? pin 1, 6 face the perforation side of the tape ? qty 3 kpcs/reel remark to order evalua tion samples, contact your nearby sales office. part number for sample order: ? pc8236t6n - a
data sheet pu10 713 ej 0 1 v0ds 2 ? pc82 3 6 t 6 n pin connections and internal block diagram pin no. pin name 1 v cc 2 gnd 3 input 4 power save 5 output 6 v cc remark exposed pad : gnd absolut e maximum ratings parameter symbol test conditions ratings unit supply v oltage v cc t a = +25 ? c 4 . 0 v power - saving voltage v ps t a = +25 ? c 4.0 v total power d issipation p tot 150 m w operating a mbient t emperature t a ? 40 to +85 ? c storage t emperature t stg ? 55 to +150 ? c input p ower p in +10 dbm recommended operating range parameter symbol min. typ. max. unit supply voltage v cc 1.6 2.7 3.3 v operating ambient temperature t a ? 40 +25 +85 ? c power save turn - on voltage v pson 1.0 ? v cc v power sav e turn - off voltage v pso ff 0 ? 0.4 v electrical characteristics ( t a = +25 ? cc = v ps = 2.7 v, f in = 1 575 mhz, unless otherwise specified ) parameter symbol test conditions min. typ. max. unit circuit current i cc no signal (v ps = 2.7 v) 5.0 6.5 8.0 m a at power - saving mode (v ps = 0 v) ? ? 1 ? a power gain g p p in = ? 35 dbm 17 19.5 22 db noise figure nf ? 0.8 1.1 db ? input return loss rl in 7.5 11 ? db output return loss rl out 11 14 ? db
data sheet pu10 713 ej 0 1 v0ds 3 ? pc82 3 6 t 6 n standard characteristics for reference 1 ( t a = +25 ? cc = v ps = 2.7 v, f in = 1 575 mhz, unless otherwise specified ) parameter symbol test conditions reference unit input 3 rd order intercept point iip 3 f in 1 = 1 575 mhz, f in 2 = 1 574 mhz ? 3 dbm isolation isl 3 9 db gain 1 db compression input power p in ( 1 db) ? 18 dbm standard characteristics for reference 2 ( t a = +25 ? cc = v ps = 1.8 v, f in = 1 575 mhz, unless otherwise specified ) parameter symbol test conditions reference unit circuit current i cc no signal (v ps = 1.8 v) 6.2 ma power gain g p p in = ? 35 dbm 19. 1 db noise figure nf 0. 8 db ? input 3 rd order intercept point iip 3 f in 1 = 1 575 mhz, f in 2 = 1 574 mhz ? 5 dbm input return loss rl in 11 db output return loss rl out 14 db isolation isl 3 9 db gain 1 db compression input power p in (1 db ) ? 19 dbm test circuit
data sheet pu10 713 ej 0 1 v0ds 4 ? pc82 3 6 t 6 n typical characteristics (t a = +25 ? remark the graphs indicate nominal characteristics.
data sheet pu10 713 ej 0 1 v0ds 5 ? pc82 3 6 t 6 n remark the graphs indicate nominal characteristics.
data sheet pu10 713 ej 0 1 v0ds 6 ? pc82 3 6 t 6 n remark the graphs indicate nominal character istics.
data sheet pu10 713 ej 0 1 v0ds 7 ? pc82 3 6 t 6 n remark the graphs indicate nominal characteristics.
data sheet pu10 713 ej 0 1 v0ds 8 ? pc82 3 6 t 6 n s - parameter s ( t a = +25 ? cc = v ps = 2.7 v , monitored at connector on board ) remark the graphs indicate nominal characteristics.
data sheet pu10 713 ej 0 1 v0ds 9 ? pc82 3 6 t 6 n s - parameter s ( t a = +25 ? cc = v ps = 1.8 v , monitored at connector on board ) remark the graphs indicate nominal characteristics.
data sheet pu10 713 ej 0 1 v0ds 10 ? pc82 3 6 t 6 n package dimensions 6 - pin plastic tson (t6n) (unit: mm)
data sheet pu10 713 ej 0 1 v0 ds 11 ? pc82 3 6 t 6 n notes on correct use (1) observe precautions for handling because of electro - static sensitive devices. (2) fo rm a ground pattern as wide ly as possible to minimize ground impedance (to prevent undesired oscillation). all the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) the bypass capacitor should be att ached t o v cc line . (4) do not supply dc voltage to input pin. recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended bel ow, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 ? c or below time at peak temperature : 10 seconds or less time at temperature of 220 ? c or hig her : 60 seconds or less preheating time at 120 to 180 ? c : 120 ? 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below ir260 wave soldering peak temperature (molten solder temperature) : 260 ? c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 ? c or below maximum number of flow processes : 1 time maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below ws260 partia l heating peak temperature ( terminal temperature) : 350 ? c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering methods together (except for partial heating).


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