12 ntc smd thermistors with nickel barrier termination nb 12 - nb 20 types nb 12 nb 20 iec size : 0805 iec size : 1206 terminations nickel barrier marking on packaging only climatic category 40/125/56 operating temperature -55? to +150? tolerance on rn (25?) 5%, ?0%, ?0% maximum dissipation at 25? 0.12 w 0.24 w thermal dissipation factor 2 mw/? 4 mw/? thermal time constant 5 s 7s chip thermistors are high quality and low cost devices especially developed for surface mounting applications. they are widely used for temperature compensation but can also achieve temperature control of printed circuits. a nickel barrier metallization provides outstanding qualities of solderability and enables this chip to meet the requirements of the most severe soldering processes. applications ?lcd compensation ?battery packs ?mobile phones ?cd players ?heating systems ?air-conditioning systems ?temperature control of switch mode power supplies ?compensation of pressure sensors ?protection of power transistors in various electronic circuits 2 (.079) 0.3 (.012) 1.25 (.049) 0.2 (.008) 0.5 (.020) ... 1.3 (.051) 0.2 (.008) min 0.2 (.008) min 3.2 (.126) 0.4 (.016) 0.2 (.008) min 0.2 (.008) min 1.6 (.063) 0.25 (.010) 0.5 (.020) ... 1.5 (.059) resistance - temperature characteristics: pages 36 to 40. how to order nb 20 type k 0 material code k (see tables page 13) 0103 resistance 10,000 ? m tolerance m (?0%) j (?%) k (?0%) ba suffix: packaging ?? bulk ba: plastic tape (180mm diam. reel) be: plastic tape (1/2 reel) bc: plastic tape (330mm diam. reel) bb: cardboard tape (180mm diam. reel) bf: cardboard tape (1/2 reel) bd: cardboard tape (330mm diam. reel) dimensions: millimeters (inches)
nb 20 iec size : 1206 types rn at 25? material b (k) at 25? ( ? ) code ( b/b ) (%/?) nb 20 mc 0 221 220 mc 3910 3% 4.4 nb 20 mc 0 102 1,000 mc 3910 3% 4.4 nb 20 j 0 0472 4,700 nb 20 j 0 0562 5,600 j 3480 3% 3.9 nb 20 j 0 0682 6,800 nb 20 j 5 0822 8,200 j5 3480 3% 3.9 nb 20 k 0 0103 10,000 k 3630 3% 4.0 nb 20 k 0 0123 12,000 nb 20 l 0 0153 15,000 nb 20 l 0 0183 18,000 l 3790 3% 4.2 nb 20 l 0 0223 22,000 nb 20 m 0 0273 27,000 nb 20 m 0 0333 33,000 m 3950 3% 4.4 nb 20 m 0 0393 39,000 nb 20 m 0 0473 47,000 nb 20 n 0 0563 56,000 nb 20 n 0 0683 68,000 n 4080 3% 4.6 nb 20 n 0 0823 82,000 nb 20 n 5 0104 100,000 n5 4160 3% 4.7 nb 20 p 0 0124 120,000 nb 20 p 0 0154 150,000 nb 20 p 0 0184 180,000 p 4220 3% 4.7 nb 20 p 0 0224 220,000 nb 20 q 0 0274 270,000 nb 20 q 0 0334 330,000 nb 20 q 0 0394 390,000 q 4300 3% 4.7 nb 20 q 0 0474 470,000 nb 20 q 0 0564 560,000 nb 20 r 0 0684 680,000 nb 20 r 0 0824 820,000 r 4400 3% 4.8 nb 20 r 0 0105 1,000,000 (1) 5% (2) 3% 13 ntc smd thermistors with nickel barrier termination nb 12 ?nb 20 nb 12 iec size : 0805 types rn at 25? material b (k) at 25? ( ? ) code ( b/b ) (%/?) nb 12 kc 0 180 18 nb 12 kc 0 220 22 nb 12 kc 0 270 27 nb 12 kc 0 330 33 nb 12 kc 0 390 39 kc 3470 5% 3.9 nb 12 kc 0 470 47 nb 12 kc 0 560 56 nb 12 kc 0 680 68 nb 12 kc 0 820 82 nb 12 kc 0 101 100 nb 12 mc 0 121 120 nb 12 mc 0 151 150 nb 12 mc 0 181 180 nb 12 mc 0 221 220 nb 12 mc 0 271 270 nb 12 mc 0 331 330 nb 12 mc 0 391 390 nb 12 mc 0 471 470 nb 12 mc 0 561 560 mc 3910 3% 4.4 nb 12 mc 0 681 680 nb 12 mc 0 821 820 nb 12 mc 0 102 1,000 nb 12 mc 0 122 1,200 nb 12 mc 0 152 1,500 nb 12 mc 0 182 1,800 nb 12 mc 0 222 2,200 nb 12 mc 0 272 2,700 nb 12 mc 0 332 3,300 nb 12 j 0 0332 3,300 nb 12 j 0 0392 3,900 j 3480 3% 3.9 nb 12 j 0 0472 4,700 nb 12 j 0 0562 5,600 nb 12 k 0 0682 6,800 nb 12 k 0 0822 8,200 k 3630 3% 4.0 nb 12 k 0 0103 10,000 nb 12 l 0 0123 12,000 l 3790 3% 4.2 nb 12 l 0 0153 15,000 nb 12 m 0 0183 18,000 nb 12 m 0 0223 22,000 m 3950 3% 4.4 nb 12 m 0 0273 27,000 nb 12 m 0 0333 33,000 nb 12 n 0 0393 39,000 nb 12 n 0 0473 47,000 n 4080 3% 4.6 nb 12 n 0 0563 56,000 nb 12 l 2 0683 68,000 l2 3805 3% 4.1 nb 12 n 5 0683 68,000 n5 4160 3% 4.7 nb 12 n 5 0823 82,000 nb 12 p 0 0104 100,000 p 4220 3% 4.7 nb 12 sc 0104 100,000 sc 4500 3% 4.8 nb 12 p 0 0124 120,000 nb 12 p 0 0154 150,000 p 4220 3% ?4.7 nb 12 p 0 0184 180,000 nb 12 q 0 0224 220,000 q 4300 3% 4.7 nb 12 q 0 0274 270,000 nb 12 r 0 0105 1,000,000 r 4400 3% 4.8 (1) 5% (2) 3% table of values
16 packaging for automatic insertion ntc chip thermistors / nc/nb series automatic insertion super 8 plastic tape packaging: the mechanical and dimensional reel characteristics are in accordance with the iec publication 286-3. r = 0.3 (.012) max. max 3 max 3 max 3 max 3 cover tape 30 5 t k a1 b1 b0 d0 p2 p0 w hole f e a0 5.5 (.217) 0.2 (.008) direction of unreeling +0.2 (.008) -0 1 (.039) designation symbol value tolerance tape width w 8 ?.2 tape thickness t 0.4 max. pitch of the sprocket holes p0 4 0.1 diameter of the sprocket holes d0 1.5 ?.1 -0 distance e 1.75 ?.1 distance (center to center) f 3.5 ?.05 distance (center to center) p2 2 0.1 sizes of the nc 12 (0805) a0 1.5 ?.1 cavities b0 2.4 ?.1 k 1.4 max. k ?.1 (size is adjustable) (k = t1 +0.2) nc 20 (1206) a0 1.95 ?.1 b0 3.55 ?.1 k 1.5 max. k ?.1 (size is adjustable) (k = t1 +0.2) bottom side reel upper side direction of unreeling reel according to iso/dis 3639-2 ?12.75 (.502) + 0.15 (.006) - 0 ?80 (7.09) + 0 - 2 (.079) ?20.5 (.087) + 0.5 (.020) - 0 8.4 (.331) +0.15 (.006) 14.4 (.567) max. ?62 (2.44) 1.5 (.059) quantity per reel type suffix qty per reel nc - nb 12 ba 4000 be 2000 nc 20 - nb 20 ba 3000 be 1500
17 packaging for automatic insertion ntc chip thermistors / nc/nb series automatic insertion 8mm paper tape packaging: the mechanical and dimensional reel characteristics are in accordance with the iec publication 286-3. p 0 b 0 p 1 p 2 d 0 t top cover tape bottom cover tape center lines of cavity cavity size see note 1 10 pitches cumulative tolerance on tape 0.20mm (0.008) e 1 f g user direction of feed e 2 w t 1 t 1 a 0 designation symbol value tolerance tape width w 8 -.0.1/+0.3 tape thickness t 1.1 max. pitch of the sprocket holes p 0 4 0.1 diameter of the sprocket holes d 0 1.5 ?.1 -0/+0.1 distance e 1 1.75 ?.1 distance (center to center) f 3.5 ?.05 distance (center to center) p 2 2 ?.05 cover tape thickness t 1 0.10 max. distance e 2 6.25 min. distance g 0.75 min. component pitch 0805/0603 p 1 4 0.1 0402 2 0.1 bottom side reel upper side direction of unreeling reel according to iso/dis 3639-2 ?12.75 (.502) + 0.15 (.006) - 0 ?80 (7.09) + 0 - 2 (.079) ?20.5 (.087) + 0.5 (.020) - 0 8.4 (.331) +0.15 (.006) 14.4 (.567) max. ?62 (2.44) 1.5 (.059) quantity per reel type suffix qty per reel nb - nc 12 bb 4000 nb 21 bf 2000 nb 23 bb 10000 bf 5000
storage good solderability is maintained for at least twelve months, provided the components are stored in their ?s received packaging at less than 40? and 70% rh. solderability / leaching terminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235 5? for 2 1 seconds. terminations will resist leaching for at least the immersion times and conditions recommendations shown below. nb products are compatible with a wide range of soldering conditions consistent with good manufacturing practice for surface mount components. this includes pb free reflow processes with peak temperatures up to 270?. recommended profiles for reflow and wave soldering are shown below for reference. nc products are recommended for lead soldering application or gluing techniques. surface mounting guide chip thermistor ?application notes reflow soldering wave soldering 18 p/n termination solder solder immersion type tin/lead temp ? time seconds nc agpdpt 60/40 260 5 15 max nb nickel barrier 60/40 260 5 30 1 case p/n d1 d2 d3 d4 d5 size 0402 nb23 1.70 0.60 0.50 0.60 0.50 (.067) (.024) (.020) (.024) (.020) 0603 nb21 2.30 0.80 0.70 0.80 0.75 (.091) (.031) (.028) (0.31) (.030) 0805 NB12 3.00 1.00 1.00 1.00 1.25 (.118) (.039) (.039) (.039) (.049) 1206 nb20 4.00 1.00 2.00 1.00 2.50 (.157) (.039) (.079) (.039) (.098) case p/n d1 d2 d3 d4 d5 size 0603 nb21 3.10 1.20 0.70 1.20 0.75 (.122) (.047) (.028) (.047) (.030) 0805 NB12 4.00 1.50 1.00 1.50 1.25 (.157) (.059) (.039) (.059) (.049) 1206 nb20 5.00 1.50 2.00 1.50 1.60 (.197) (.059) (.079) (.059) (.063) reflow 300 250 200 150 100 50 0 solder temp. 10 sec. max 1min 1min (minimize soldering time) natural cooling 220oc to 250oc preheat a) the visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. b) resin color may darken slightly due to the increase in temperature required for the new pastes. c) lead-free solder pastes do not allow the same self align- ment as lead containing systems. standard mounting pads are acceptable, but machine set up may need to be modified. 300 250 200 150 100 50 0 0 50 100 150 200 250 300 pre-heating: 150c 15c / 60-90s max. peak gradient: 2.5c/s peak temperature: 245c 5c time at >230c: 40s max. temperature c time (s) wave 300 250 200 150 100 50 0 solder temp. 3 sec. max 1 to 2 min (preheat chips before soldering) t/maximum 150c preheat natural cooling 230oc to 250oc t d1 d2 d3 d4 d5 recommended soldering pad layout dimensions in mm (inches)
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