this preliminary data is provided to assist you in the evaluation of product(s) currently under development. until agilent tec hnologies releases this product for general sales, agilent technologies reserves the right to alter prices, specifications, features, cap abilities, functions, release dates, and remove availability of the product(s) at anytime. revision date: 25 june 2004 revision number: 6 preliminary information agilent AMMP-6530 5 ? 30 ghz image rejection mixer data sheet features ? wide frequency range: 5 - 30 ghz ? good conversion gain: -8 db ? image rejection: 15 db ? high input ip3: +18dbm ? surface mount applications ? microwave radio systems ? satellite vsat and dbs systems ? commercial grade military ? 802.16 & 802.20 wimax bwa systems ? wll and mmds loops ? test instruments ? military radios, radar, & ecm description the AMMP-6530 mmic is a broadband i/q mixer, which can be used as an image rejection mixer (irm), ssb up-converter or down converter. the AMMP-6530 utilizes two distributed passive fet mixers and a lange coupler realized in 0.15um gate length phemt technology. AMMP-6530 is a monolithic phemt image- rejection mixer designed for use in commercial digital radios and wireless lans. the mixer can be used as a drain pumped mixer for a low conversion loss application, or can be gate pumped, as a resistive mixer, for a higher linearity application. under the gate pumping operation, the AMMP-6530 is also applicable as a ssb up-converter. the mixer requires an off-chip 90-degree hybrid to achieve signal image rejection and ?1v (typ.) dc biasing. 8 4 3 2 1 7 6 5 if1 if2 nc nc nc vg lo rf top view package base: gnd pin function 1 if 1 2 3 if 2 4 rf/lo 5 6 vg 7 8 rf/lo
this preliminary data is provided to assist you in the evaluation of product(s) currently under development. until agilent tec hnologies releases this product for general sales, agilent technologies reserves the right to alter prices, specifications, features, cap abilities, functions, release dates, and remove availability of the product(s) at anytime. revision date: 25 june 2004 revision number: 6
this preliminary data is provided to assist you in the evaluation of product(s) currently under development. until agilent tec hnologies releases this product for general sales, agilent technologies reserves the right to alter prices, specifications, features, cap abilities, functions, release dates, and remove availability of the product(s) at anytime. revision date: 25 june 2004 revision number: 6 AMMP-6530 dc specifications/physical properties symbol parameters and test conditions units min typ. max v gg gate supply operating voltage v -1 AMMP-6530 typical performances t a = 25 c, v gg =-1 v, z o =50 ? symbol parameters and test conditions units gate pumped drain pumped up conversion f rf rf frequency range ghz 5 - 30 5 - 30 5 - 30 f lo lo frequency range ghz 5 - 30 5 - 30 5 - 30 f if if frequency range ghz dc - 5 dc - 5 dc ? 5 p lo lo port pumping power dbm >10 >10 >0 cg rf to if conversion gain db -10 -8 -15 rl_rf rf port return loss db 5 10 5 rl_lo lo port return loss db 10 5 10 rl_if if port return loss db 10 10 10 ir image rejection ratio db 15 15 15 lo-rf iso. lo to rf port isolation db 22 22 25 lo-if iso. lo to if port isolation db 25 25 25 rf-if iso. rf to if port isolation db 15 15 15 iip3 input ip3, fdelta=100mhz, prf=-10dbm, plo=15dbm dbm 18 10 - p-1 input port power at 1db gin compression point, plo=+10dbm dbm +8 0 - nf noise figure db 10 12 - biasing and operation the recommended dc bias condition for optimum performance, and reliability is vgg=-1 volts. there is no current consumption for the gate biasing because the fet mixer was designed as the passive operation. for down conversion, the AMMP-6530 may be configured in a low loss or high linearity application. in a low loss configuration, the lo is applied through the drain (pin8, power divider side) as shown in figure 3(a). in this configuration, the ammc-6530 is a ?drain pumped mixer?. for higher linearity application, the lo is applied through the gate (pin4, lange coupler side) as shown in figure 3(b). in this configuration, the ammc-6530 is a ?gate pumped mixer? (or resistive mixer). the mixer is also suitable for up- conversion applications under the gate pumped mixer operation shown in figure 3(b). figure 1 is a simple block diagram, as reference for figure 2, which shows the bond pad locations. figure 3 is a schematic of the image-rejection (ssb) mixer mmic connected to a quadrature hybrid. figures 2 through figure 19 show typical measurement results under the image rejection operation. data presented for the AMMP-6530 was obtained using the circuit described here. please note that the image rejection and isolation performance is dependent on the selection of the low frequency quadrature hybrid. the performance specification of the low frequency quadrature hybrid as well as the phase balance and vswr of the interface to the AMMP-6530 will affect the overall mixer performance.
this preliminary data is provided to assist you in the evaluation of product(s) currently under development. until agilent tec hnologies releases this product for general sales, agilent technologies reserves the right to alter prices, specifications, features, capabilities , functions, release dates, and remove availability of the product(s) at anytime. revision date: 25 june 2004 revision number: 6 AMMP-6530 typical performance under the gate pumped mixer operation (t a = 25 c, v g =-1 v) lo ? 50 rf usb lsb 1 if 2 if chip off h yb ? 90 90 0 () gate () drain figure 1. AMMP-6530 application diagram for ssb mixer applications. 50 ? termination is required for the unwanted side-band termination. this is used for highly linear down conversion or up conversion mixer application -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 1015202530 frequency [ghz] conversion gain[db] lsb[db] usb[db] figure 2. AMMP-6530 typical conversion gain, plo=+10dbm, fif=1ghz -5 0 5 10 15 5 1015202530 frequency [ghz] p-1 [dbm] figure 4. AMMP-6530 typical rf port input power (@p-1), plo=+10 dbm, fif=1ghz -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 1015202530 frequency [ghz] conversion gain[db] lsb[db] usb[db] figure 3. AMMP-6530 typical conversion loss, plo=+10dbm, fif=1ghz 5 10 15 20 25 5 1015202530 flo [dbm] iip3 [dbm] plo=10[dbm] plo=15[dbm] figure 5. AMMP-6530 typical ip3, fif=1ghz
this preliminary data is provided to assist you in the evaluation of product(s) currently under development. until agilent tec hnologies releases this product for general sales, agilent technologies reserves the right to alter prices, specifications, features, capabilities , functions, release dates, and remove availability of the product(s) at anytime. revision date: 25 june 2004 revision number: 6 AMMP-6530 typical performances under the up-conversion mixer operation (gate pumped operation) (t a = 25 c, v g =-1 v) 0 5 10 15 20 5 1015202530 frequency [ghz] noise figure [db] figure 6. AMMP-6530 typical noise figure, plo=+7dbm, fif=1ghz -25 -20 -15 -10 -5 0 -10-5 0 5 101520 lo power [dbm] conversion gain [db] figure 8. AMMP-6530 typical conversion gain vs. lo power, prf=-20dbm, frf=21ghz, and flo=20ghz -20 -15 -10 -5 0 0123456 frequency [ghz] conversion gain[db], return loss[db] conv. gain [db] return loss[db] figure 10. AMMP-6530 typical conversion gain and return loss vs. if frequency, frf=20ghz, and plo=+10dbm -20 -15 -10 -5 0 0 5 10 15 20 25 30 frequency[ghz] return loss[db] rf port lo port figure 7. AMMP-6530 typical return loss vs. frequency, plo=+10dbm -20 -15 -10 -5 0 -2 -1.5 -1 -0.5 vg [v] conversion gain [db] figure 9. AMMP-6530 typical conversion gain vs. gate voltage, frf=20ghz, and plo=+10dbm 0 10 20 30 40 50 60 5 1015202530 frequency[ghz] isolation[db] rf-if lo-if lo-rf figure 11. AMMP-6530 typical isolation vs. frequency, plo=+10dbm, fif=1ghz
this preliminary data is provided to assist you in the evaluation of product(s) currently under development. until agilent tec hnologies releases this product for general sales, agilent technologies reserves the right to alter prices, specifications, features, capabilities , functions, release dates, and remove availability of the product(s) at anytime. revision date: 25 june 2004 revision number: 6 AMMP-6530 typical performances under the up-conversion mixer operation (gate pumped operation) (t a = 25 c, v g =-1 v) -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 1015202530 frequency [ghz] conversion gain[db] lsb[db] usb[db] figure 14. AMMP-6530 typical conversion gain, plo=+5dbm, pif=+5dbm, and fif=1ghz -40 -35 -30 -25 -20 -15 -10 -5 0 5 1015202530 frequency [ghz] isolation [db] figure 16. AMMP-6530 typical lo-rf isolation, plo=+5dbm, pif=+5dbm, and fif=1ghz -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 1015202530 frequency [ghz] conversion gain[db] lsb[db] usb[db] figure 15. AMMP-6530 typical conversion gain, plo=+5dbm, pif=+5dbm, and fif=1ghz -15 -13 -11 -9 -7 -5 0 2 4 6 8 10 12 14 16 18 20 plo=pif [dbm] conversion loss [db] figure 17. AMMP-6530 typical conversion gain vs. lo power, plo=pif, fif=1ghz, and frf=25ghz AMMP-6530 typical performances under the drain pumped mixer operation (t a =25 c, v g =-1 v) rf ? 50 lo usb lsb 1 if 2 if chip off hyb ? 90 90 0 () gate () drain figure 18. AMMP-6530 application diagram for ssb mixer applications. 50 ? termination is required for the unwanted side- band termination. low conversion loss mixer configuration
this preliminary data is provided to assist you in the evaluation of product(s) currently under development. until agilent tec hnologies releases this product for general sales, agilent technologies reserves the right to alter prices, specifications, features, capabilities , functions, release dates, and remove availability of the product(s) at anytime. revision date: 25 june 2004 revision number: 6 AMMP-6530 typical performances under the drain pumped mixer operation (t a = 25 c, v g =-1 v) -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 1015202530 frequency [ghz] conversion gain[db] lsb[db] usb[db] figure 19. AMMP-6530 typical conversion gain, plo=+10dbm, fif=1ghz -5 0 5 10 15 5 1015202530 frequency [ghz] p-1 [dbm] figure 21. AMMP-6530 typical rf port input power (@p-1), plo=+10dbm, fif=1ghz 0 5 10 15 20 25 5 1015202530 flo [dbm] iip3 [dbm] plo=10[dbm] plo=15[dbm] figure 23. AMMP-6530 typical ip3, plo=+10dbm, fif=1ghz -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 5 1015202530 frequency [ghz] conversion gain[db] lsb[db] usb[db] figure 20. AMMP-6530 typical conversion loss, plo=+10dbm, fif=1ghz 0 5 10 15 20 5 1015202530 frequency [ghz] noise figure [db] figure 22. AMMP-6530 typical noise figure, plo=+7dbm, fif=1ghz -25 -20 -15 -10 -5 0 -10-5 0 5 101520 lo power [dbm] conversion gain [db] figure 24. AMMP-6530 typical conversion gain vs. lo power, prf=-20dbm, frf=21ghz, and flo=20ghz
this preliminary data is provided to assist you in the evaluation of product(s) currently under development. until agilent tec hnologies releases this product for general sales, agilent technologies reserves the right to alter prices, specifications, features, cap abilities, functions, release dates, and remove availability of the product(s) at anytime. revision date: 25 june 2004 revision number: 6 package outline drawing top view bottom view pcb land pattern material is rogers ro4350, 0.010? thick. recommended smt attachment the ammc packaged devices are compatible with high volume surface mount pcb assembly processes. the pcb material and mounting pattern, as defined in the data sheet, optimizes rf performance and is strongly recommended. for power devices, ground vias should be silver filled. an electronic drawing of the land pattern is available via the provided link or upon request from agilent sales & application engineering. manual assembly 1. follow esd precautions while handling packages. 2. handling should be along the edges with tweezers or from topside if using a vacuum collet. 3. recommended attachment is conductive solder paste. please see recommended solder reflow profile. conductive epoxy is not recommended. hand soldering is not recommended. 4. apply solder paste using a stencil printer or dot placement. the volume of solder paste will be dependent on pcb and component layout and should be controlled to ensure consistent mechanical and electrical performance. excessive solder will degrade rf performance. 5. follow solder paste and vendor?s recommendations when developing a solder reflow profile. a standard profile will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. 6. packages have been qualified to withstand a peak temperature of 260 c for 20 seconds. verify that the profile will not expose device beyond these limits. 7. clean the module with acetone. rinse with alcohol. allow the module to fully dry before testing. 0 50 100 150 200 250 300 1 22 45 66 87 108 129 150 171 192 213 235 256 278 299 320 341 363 384 260'c 255'c 217'c 40'c 125'c 120 sec max 60 - 150 sec 10 - 20 sec recommended solder reflow profile notes: 1. ? inidicates pin 1 2. dimensions are in inches [milimeters] 3. all grounds must be soldered to pcb rf gnd
this preliminary data is provided to assist you in the evaluation of product(s) currently under development. until agilent tec hnologies releases this product for general sales, agilent technologies reserves the right to alter prices, specifications, features, cap abilities, functions, release dates, and remove availability of the product(s) at anytime. revision date: 25 june 2004 revision number: 6 evaluation pcb list of material item description manufacturer manufacturer p/n rf/lo connectors edge mount dc-40ghz southwest microwave 1492-04a if connectors pc mount dc-12 ghz johnson components 142-0701-841 dc connector edge mount pin conn. tyco electronics 4-103747-0 image reject mixer 6-30ghz irm agilent AMMP-6530 90 hybrid coupler smt coupler avx various (db0805a0915awtr) 0.1uf capacitor (optional) smt 0402 bypass cap. various various for product information and a complete list of agilent contacts and distributors, please go to our website: www.agilent.com/semiconductors e-mail: semiconductorsupport@agilent.com data subject to change. copyright ? 2004 agilent technologies, inc. lo/rf (drain) rf/lo (gate) if1 if2 gnd vg
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