hlmp-cx08 series, hlmp-cx25 series hlmp-cx27 series, hlmp-c610 t-1 3 / 4 (5 mm) alingap lamps data sheet features ? high intensity ? general purpose leads ? popular 5 mm diameter ? available in bulk, tape and reel, or ammopack ? 8 or 25 viewing angles ? choice of colors: amber or red applications ? indoor/outdoor applications ? small store-front signs ? message panels ? road construction barrier lights ? center high mount stop lights ? spoiler, car decorative lighting ? motorcycle/bicycle warning lights description the hlmp-cx08, hlmp-cx25, hlmp-cx27, and hlmp-c610 series are 5 mm lamps specially designed for applications requir-ing very high on-axis intensity that is not achiev - able with a standard lamp. these devices are capable of producing light output over a wide range of drive currents. built using alingap technology, they are well suited for typical 5 mm ts-algaas lamp applica-tions, and have signifcantly superior reliability than most ts-algaas lamps in wet/hot environments. these lamps come with clear non-difused lens and are optically designed to yield superior light output. device selection part number standof typical viewing angle [1] (degrees), 2 q 1/2 luminous intensity, iv (mcd) @ 20 ma color dominant wavelength [2] min. typ. hlmp-c008-u00xx no 8 2900 6000 red 626 hlmp-c208-s00xx 8 2600 3000 amber 590 hlmp-c608-r00xx 8 1000 2000 red 635 hlmp-c610-r00xx yes 8 1000 2000 red 635 hlmp-c025-p00xx no 25 500 1000 red 626 hlmp-c225-o00xx 25 450 800 amber 590 hlmp-c625-p00xx 25 500 700 red 635 hlmp-c027-p00xx yes 25 500 1000 red 626 hlmp-c627-p00xx 25 500 700 red 635 hlmp-c325-p00xx no 25 500 orange 605 notes: 1. q 1 / 2 is the of-axis angle at which the luminous intensity is half of the axial luminous intensity. 2. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the single wavelength which defnes the color of the device.
2 package dimensions hlmp-cx27 6.10 (0.240) 5.46 (0.215) 1.27 (0.050) nom. 2.54 (0.100) 0.45 (0.018) sq. nom. cathode lead 25.40 (1.00) min. nom. 5.08 (0.200) 4.57 (0.100) 13.55 (0.533) 13.35 (0.525) 0.89 (0.035) 0.64 (0.023) 9.19 (0.362) 8.43 (0.332) 1.32 (0.052) 1.02 (0.040) 6.10 (0.240) 5.46 (0.215) 1.27 (0.050) nom. 2.54 (0.100) 0.45 (0.018) sq. nom. cathode lead 25.40 (1.00) min. nom. 5.08 (0.200) 4.57 (0.100) 0.89 (0.035) 0.64 (0.023) 9.19 (0.362) 8.43 (0.332) 1.02 (0.004) max. typ. 1.00 (0.040) max. epoxy meniscus 1.00 (0.040) max. epoxy meniscus hlmp-cx25 hlmp-c610 hlmp-cx08 6.10 (0.240) 5.46 (0.215) 1.27 (0.050) nom. 2.54 (0.100) 0.45 (0.018) sq. nom. cathode lead 25.40 (1.000) min. nom. 5.21 (0.205) 4.70 (0.105) 13.50 (0.53) 13.30 (0.52) 1.07 (0.042) 0.56 (0.022) 9.14 (0.360) 8.36 (0.330) 1.32 (0.052) 1.02 (0.040) 6.10 (0.240) 5.46 (0.215) 1.27 (0.050) nom. 2.54 (0.100) 0.45 (0.018) sq. nom. cathode lead 25.40 (1.000) min. nom. 5.21 (0.205) 4.70 (0.105) 1.07 (0.042) 0.56 (0.022) 9.14 (0.360) 8.36 (0.330) 1.02 (0.004) max. typ. 1.00 (0.040) max. epoxy meniscus 1.00 (0.040) max. epoxy meniscus
3 part numbering system hlmp - c x xx - x x x xx mechanical option 00:bulk 02: tape & reel, straight leads dd: ammo pack color bin options 0: full color bin distribution maximum iv bin options 0: open (no max. limit) minimum iv bin options please refer to the iv bin table viewing angle & standof option 08: 8 degrees, without standof 10: 8 degrees, with standof 25: 25 degrees, without standof 27: 25 degrees, with standof color options 0: alingap red 626 nm 2: alingap amber 590 nm 3: alingap orange 605 nm 6: alingap red 635 nm absolute maximum ratings at t a = 25c parameter absolute maximum units peak forward current 70 ma average forward current [1] 30 ma dc current [2] 50 ma reverse voltage (i r = 100 a) 5 v led junction temperature 110 c operating temperature range -40 to +100 c storage temperature range -40 to +100 c notes: 1. see figure 2 to establish pulsed operating conditions. 2. derate linearly from 50c at 0.5 ma/c. 3. the transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the led die and wirebond. it is not recommended that this device be operated at peak currents above the absolute maximum peak forward current.
4 optical/electrical characteristics at t a =25c test symbol parameter device min. typ. [3] max. units conditions 2 q 1 / 2 included angle between half hlmp-c008 8 deg. i f = 20 ma luminous intensity points [1] hlmp-c208 8 see note 1 hlmp-c608 8 hlmp-c025 25 hlmp-c225 25 hlmp-c325 25 hlmp-c625 25 hlmp-c610 8 hlmp-c027 25 hlmp-c627 25 l d dominant wavelength [2] hlmp-c008 626 nm see note 2 hlmp-c208 590 hlmp-c608 635 hlmp-c025 626 hlmp-c225 590 hlmp-c325 605 hlmp-c625 635 hlmp-c610 635 hlmp-c027 626 hlmp-c627 635 l peak peak wavelength hlmp-c008 635 nm measurement at peak hlmp-c208 594 hlmp-c608 650 hlmp-c025 635 hlmp-c225 594 hlmp-c325 611 hlmp-c625 650 hlmp-c610 650 hlmp-c027 635 hlmp-c627 650 dl 1 / 2 spectral line halfwidth 17 nm t s speed of response 20 ns c capacitance 40 pf v f = 0; f = 1 mhz r q j-pin thermal resistance 260 c/w junction to cathode lead v f forward voltage hlmp-c008 1.9 2.4 v i f = 20 ma hlmp-c208 1.9 2.6 hlmp-c608 1.9 2.2 hlmp-c025 1.9 2.4 hlmp-c225 1.9 2.6 hlmp-c625 1.9 2.2 hlmp-c610 1.9 2.2 hlmp-c027 1.9 2.4 hlmp-c627 1.9 2.2 v r reverse breakdown voltage 5.0 v i r = 100 a notes: 1. q 1 / 2 is the of-axis angle at which the luminous intensity is half of the axial luminous intensity. 2. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the single wavelength which defnes the color of the device. 3. typical specifcation for reference only. do not exceed absolute maximum ratings.
5 figure 1. relative intensity vs. wavelength. figure 2. maximum tolerable peak current vs. pulse duration. figure 3. forward current vs. forward voltage. figure 4. relative luminous intensity vs. forward current. ratio of maximum tolerable peak current to maximum tolerable dc current 1.0 10,000 6 1 t p ? pulse duration ? s 1000 5 3 100 10 4 2 i peak ? max. i dc ? max. 100 khz 30 khz 10 khz 3 khz 1 khz 300 hz 100 hz hlmp-cx08 fig 2 hlmp-cx08 fig 3 current ? ma 1.0 0 v f ? forward voltage ? v 50 40 30 10 2.0 3.0 60 1.5 2.5 20 red amber hlmp-cx08 fig 4 relative luminous intensity (normalized at 20 ma ) 0 0 i f ? dc forward current ? ma 2.5 2.0 1.5 0.5 60 3.0 20 40 1.0 wa velength ? nm rela tive intensity 550 600 650 700 1.0 0.5 0 c208 c225 c325 c008 c025 c027 c608 c625 c627 c610 figure 5. maximum forward dc current vs. ambient temperature. hlmp-cx08 fig 5 forward current (ma) 0 0 ambient temperature (c) 40 120 60 20 40 20 60 80 100 rq j-a = 780c/w
6 soldering/cleaning cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning led parts. all of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic led parts. for information on soldering leds, please refer to applica- tion note 1027. figure 7. relative luminous intensity vs. angular displacement for hlmp-cx25 and hlmp-cx27. hlmp-cx08 fig 6 relative intensity 1.0 0 angular displacement ? degrees 0.8 0.6 0.5 0.7 0.2 -70 -60 0.1 0.3 0.4 -40 02 03 05 07 09 0 0.9 -90 -20 -80 -50 -30 -10 10 40 60 80 figure 6. relative luminous intensity vs. angular displacement for hlmp-cx08 and hlmp-cx10. hlmp-cx08 fig 5 relative intensity 1.0 0 angular displacement ? degrees 0.8 0.6 0.5 0.7 0.2 -20 -15 0.1 0.3 0.4 -10 05 10 15 20 25 0.9 -25 -5
7 color categories color category# lambda (nm) min. max. orange 2 599 602.5 3 601.5 605 4 603.8 608.2 5 606.8 611.2 tolerance for each bin limit is 0.5 nm. intensity bin limits color bin intensity range (mcd) min. max. res/orange p 540.0 850.0 q 850.0 1200.0 r 1200.0 1700.0 s 1700.0 2400.0 t 2400.0 3400.0 u 3400.0 4900.0 v 4900.0 7100.0 w 7100.0 10200.0 x 10200.0 14800.0 y 14800.0 21400.0 z 21400.0 30900.0 yellow o 510.0 800.0 p 800.0 1250.0 q 1250.0 1800.0 r 1800.0 2900.0 s 2900.0 4700.0 t 4700.0 7200.0 u 7200.0 11700.0 v 11700.0 18000.0 w 18000.0 27000.0 maximum tolerance for each bin limit is 18%. mechanical option matrix mechanical option code defnition 00 bulk packaging, minimum increment 500 pcs/bag 02 tape & reel, straight leads, minimum increment 1300 pcs/bag dd ammo pack, straight leads with minimum increment 2k/pack note: all categories are established for classifcation of products. products may not be available in all categories. please contact your local avago representative for further clarifcation/information.
8 figure 8. recommended wave soldering profle. laminar wa ve bo tt om side of pc bo ard ho t air knife turbulent wa ve fluxing prehea t 01 02 0 30 50 100 150 200 250 30 40 50 time ? seconds tempera ture ? c 60 70 80 90 100 t op side of pc bo ard convey or speed = 1.83 m/min (6 ft/min) prehea t setting = 150 c (100c pcb) solder wa ve tempera ture = 245c air knife air tempera ture = 390c air knife dist ance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma no te: allo w for bo ards to be sufficientl y cooled before exer ting mechanical force. 8 precautions: lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standof. ? recommended soldering conditions: wave soldering manual solder dipping pre-heat temperature 105c max. C pre-heat time 30 sec max. C peak temperature 250c max. 260c max. dwell time 3 sec max. 5 sec max. ? wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profle to ensure the soldering profle used is always conforming to recommended soldering condition. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25c, before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole sizes for led component leads: led component lead size diagonal plated through hole diameter 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. av02-0965en - september 26, 2008
|
